1、 REVISIONS LTR DESCRIPTION DATE APPROVED A Updated body of drawing to reflect current requirements. - glg. 12-02-23 Charles Saffle THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. CURRENT CAGE CODE 67268 REV SHEET REV A A SHEET 15 16 REV STATUS REV A A A A A A A A A A A A A A OF SHEETS SHE
2、ET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY James E. Jamison DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING CHECKED BY Charles Reusing THIS DRAWING IS AVAILABLE FOR USE BY All DEPARTMENTS APPROVED BY Michael. A. Frye MICRO
3、CIRCUITS, MEMORY, DIGITAL, ECL, 1K x 4 HIGH-SPEED STATIC RAM, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 24 June 1987 AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 14933 5962-91518 SHEET 1 OF 15 DSCC FORM 2233 APR 97 5962-E196-12 Provided by IHSNot for ResaleNo r
4、eproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 SIZE A 5962-91518 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, no
5、n-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962 - 91518 01 M X A | | | | | | | | | | | | | | | | | | Federal RHA Device Device Case Lead stock class designator type class
6、 outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes N, Q, and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA
7、marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) shall identify the circuit function as follows: Device type Generic number Circuit function Acces
8、s time 01 10E474L 1K x 4, ECL SRAM 7 ns 02 10E474L 1K x 4, ECL SRAM 5 ns 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements fo
9、r MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Termina
10、ls Package style X GDIP5-T24 or CDIP6-T24 24 dual-in-line package Y GQCC1-J28 28 J-leaded chip carrier Z See figure 1 24 flat package package 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. 1/ Supply voltage range (VEEto VCC) . -7.0 V dc
11、 to +0.5 V dc DC input voltage range . VEEto +0.5 V dc Output current -50 mA Maximum power dissipation (PD): . 1.04 W Lead temperature (soldering, 10 seconds) +260C Thermal resistance, junction-to-case (JC) Case X and Y See MIL-STD-1835 Case Z 20C/W 2/ Junction Temperature (TJ) +175C Storage tempera
12、ture range . -65C to +150C Temperature under bias -55C to +125C Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 SIZE A 5962-91518 REVISION LEVEL A SHEET 3 DSCC FORM 2234 AP
13、R 97 1.4 Recommended operating conditions. Supply voltage range (VEE) . -5.46 V dc to -4.94 V dc Minimum high level input high voltage (VIH): TA= +25C -1.130 V TC= +125C -1.030 V TC= -55C . -1.260 V Minimum high level input high voltage (VIH): TA= +25C -1.475 V TC= +125C -1.450 V TC= -55C . -1.540 V
14、 Case operating temperature range (TC) . -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these doc
15、uments are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Co
16、mponent Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700
17、Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of the documents are the issues of the documents cited in the solicitation. JEDEC
18、INTERNATIONAL (JEDEC) JEDEC Standard No. 78 - IC Latch-Up Test. (Applications for copies should be addressed to JEDEC Solid State Technology Association, 3103 North 10thStreet, Suite 240-S, Arlington, VA 22201-2107; http:/www.jedec.org.) (Non-Government standards and other publications are normally
19、available from the organizations that prepare or distribute the documents. These documents also may be available in or through libraries or other informational services.) _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum level
20、s may degrade performance and affect reliability. 2/ When the thermal resistance for this case is specified in MIL-STD-1835, that value shall supersede the value indicated herein. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT
21、DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 SIZE A 5962-91518 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing shall take precedence. Nothing in th
22、is document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the de
23、vice manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specifi
24、ed herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein and figure 1. 3.2.2 Terminal connections. The
25、 terminal connections shall be as specified on figure 2. 3.2.3 Truth table. The truth table shall be as specified on figure 3. 3.2.4 Functional tests. Various functional tests used to test this device are contained in appendix A herein. If the test patterns cannot be implemented due to test equipmen
26、t limitations, alternate test patterns to accomplish the same results shall be allowed. For device class M, alternate test patterns shall be maintained under document revision level control by the manufacturer and shall be made available to the preparing or acquiring activity upon request. For devic
27、e classes Q and V alternate test patterns shall be under the control of the device manufacturers Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the preparing or acquiring activity upon request. 3.3 Electrical performance characteristics. Unless otherwis
28、e specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each su
29、bgroup are described in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not ma
30、rking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q, and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/complianc
31、e mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certifi
32、cate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order
33、 to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the r
34、equirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be pr
35、ovided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DLA Land and Maritime-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this d
36、rawing. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 SIZE A 5962-91518 REVISION LEVEL A SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Te
37、st Symbol Conditions -55C TC +125C -5.46 V VEE -4.94 V VCC= 0 V, VCCA= 0 V unless otherwise specified Group A subgroups Device type Limits Unit Min Max Output high voltage VOHOutputs terminated through 50 to -2.0 V VCC= 0 V VCCA= 0 V VEE= -5.2 V VIHVIL1, 2, 3 All -0.960 -0.880 -1.140 -0.810 -0.700 -
38、0.900 V -0.810 -0.700 -0.900 -1.95 -1.95 -1.95 Output low voltage VOL-0.810 -0.700 -0.900 -1.95 -1.95 -1.95 1, 2, 3 All -1.850 -1.830 -1.920 -1.650 -1.610 -1.670 V Input high voltage VIH1, 2, 3 All -1.130 -1.030 -1.260 -0.810 -0.700 -0.900 V Input low voltage VIL1, 2, 3 All -1.950 -1.950 -1.950 -1.4
39、75 -1.450 -1.540 V Input high current IIHVIN= VIHMax. 1, 2, 3 All 220 A Input low current IILVIN= VILMin. CEinput1, 2, 3 All 0.5 170 A All other inputs -50 Power supply current IEEVEE= -5.46 V Inputs and outputs open 1, 2, 3 All -190 mA Input capacitance 1/ CINVEE= -5.2 V TA= 25C, f = 1 MHz, see 4.4
40、.1e 4 All 8 pF Output capacitance 1/ COUTVEE= -5.2 V TA= 25C, f = 1 MHz, see 4.4.1e 4 All 9 pF Functional tests see 4.4.1c 7, 8A, 8B All Chip select access time tELQVSee figures 4 and 5 9, 10, 11 01 0.5 5.0 ns 02 0.5 4.0 Chip select recovery tEHQL9, 10, 11 01 0.5 5.0 ns 02 0.5 4.0 Address access tim
41、e tAVQV9, 10, 11 01 1.2 7.0 ns 02 1.2 5.0 Write pulse width tWLWH9, 10, 11 All 5.0 ns Data set-up to write tDVWL9, 10, 11 All 0 ns See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING DLA LAND A
42、ND MARITIME COLUMBUS, OHIO 43218-3990 SIZE A 5962-91518 REVISION LEVEL A SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC +125C -5.46 V VEE -4.94 V VCC= 0 V, VCCA= 0 V unless otherwise specified Group A subgroups Device type Limits Unit Mi
43、n Max Data hold from write tWHDXSee figures 4 and 5 9, 10, 11 All 1.0 ns Address set-up to write tAVWL9, 10, 11 All 1.0 ns Address hold from write tWHAX9, 10, 11 All 1.0 ns Chip select set-up to write tELWL9, 10, 11 All 0 ns Chip select hold from write tWHEH9, 10, 11 All 1.0 ns Write disable tWLQL9,
44、 10, 11 01 0.3 6.5 ns 02 0.3 4.0 Write recovery tWHQH9, 10, 11 01 0.5 7.0 ns 02 0.5 5.0 Output rise time 1/ tr9, 10, 11 All 1.0 2.5 ns Output fall time 1/ tf9, 10, 11 All 1.0 2.5 ns 1/ Tested initially and after any design or process changes which may affect that parameter, and therefore shall be gu
45、aranteed to the limits specified in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 SIZE A 5962-91518 REVISION LEVEL A SHEET 7 DSCC FORM 2234 APR 97 3.9 Verificati
46、on and review for device class M. For device class M, DLA Land and Maritime, DLA Land and Maritimes agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of
47、the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 41 (see MIL-PRF-38535, appendix A). 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures sh
48、all be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL
