1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update to current requirements. Editorial changes throughout. -gap 06-08-01 Raymond Monnin B Correct IILlimits in Table I from max. limits to min. limits. Editorial changes throughout. -gap 10-02-10 Charles F. Saffle The original first page of th
2、is drawing has been replaced. REV SHET REV SHET REV STATUS REV B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY Thanh V. Nguyen DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Tim H. Noh COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS D
3、RAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Tim H. Noh MICROCIRCUIT, DIGITAL, ECL, HEX TTL-TO-ECL TRANSLATOR, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 92-05-21 AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-91530 SHEET 1 OF 11 DSCC FORM
4、 2233 APR 97 5962-E195-10 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91530 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This
5、 drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radia
6、tion Hardness Assurance (RHA) levels are reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 91530 01 M X X Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Leadfinish (see 1.2.5) / (see 1
7、.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the app
8、ropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 100324 Hex TTL-to-ECL translator 1.2.3 Device class designator. The device class designator is a single le
9、tter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification t
10、o MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X GDIP5-T24 or CDIP6-T24 24 dual-in-line Y See figure 1 24 quad flat pack 1.2.5 Lead finish. The lead finish is as specified in M
11、IL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91530 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION
12、 LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Negative supply voltage range (VEE) . -7.0 V dc to +0.5 V dc Positive supply voltage range (VTTL) -0.5 V dc to +6.0 V dc DC input voltage range (VIN) -0.5 V to +6.0 V DC input current range (IIN) -30 mA to +5.0 mA Maximum dc out
13、put current (IOUT) -50 mA Storage temperature range -65C to +150C Lead temperature (soldering, 10 seconds) +300C Junction temperature (TJ) +175C Maximum power dissipation (PD) . 805 mW Thermal resistance, junction-to-case (JC): Case X See MIL-STD-1835 Case Y 28C/W 1.4 Recommended operating condition
14、s. Negative supply voltage range (VEE) . -5.7 V dc minimum to -4.2 V dc maximum Positive supply voltage range (VTTL) +4.5 V dc minimum to +5.5 V dc maximum Minimum high level input voltage (VIH) +2.0 V Maximum low level input voltage (VIL) . +0.8 V Case operating temperature range (TC) . -55C to +12
15、5C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contra
16、ct. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOO
17、KS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111
18、-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. _ 1/ S
19、tresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING
20、 SIZE A 5962-91530 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modifi
21、ed in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices an
22、d as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines
23、shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Truth table. The truth table shall be as specified on figure 3. 3.2.4 Test circuit and switching waveforms. The test circuit and switching waveforms sh
24、all be as specified on figure 4. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operatin
25、g temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers
26、 PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes
27、 Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for d
28、evice class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device c
29、lass M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that t
30、he manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-385
31、35 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawin
32、g is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made
33、 available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 32 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted witho
34、ut license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91530 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 TABLE 1. Electrical performance characteristics. Test Symbol Conditions 1/ -5.7 V VEE -4.2 V +4.5 V VTTL +5.5 V unless other
35、wise specified Group A subgroups Limits Unit Min Max High level output voltage VOHVTTL= 5.0 V, VIL= 0.0 V, VIH= 5.0 V VEE= -5.7 V, -4.2 V 1, 2 -1.025 -0.870 V 3 -1.085 -0.870 Low level output voltage VOL1, 2 -1.830 -1.620 3 -1.830 -1.555 High level threshold output voltage VOHCVTTL= 5.0 V, VIL= 0.8
36、V, VIH= 2.0 V VEE= -5.7 V, -4.2 V 1, 2 -1.035 3 -1.085 Low level threshold output voltage VOLC1, 2 -1.610 3 -1.555 Forward clamp diode voltage drop VFCDVEE= -4.5 V, VTTL= 4.5 V, IIN= -18.0 mA 1, 2, 3 -1.2 High level input current IIHVEE= -4.5 V, VTTL= 5.5 V VIN= 2.7 V 1, 2, 3 20 A High level input b
37、reakdown current IBVI IN= 5.5 V 1, 2, 3 100 Low level input current, data inputs IIL1VEE= -4.5 V, VIN= 0.5 V, VTTL= 5.5 V 1, 2, 3 -0.9 mA Low level input current, enable inputs IIL21, 2, 3 -5.4 Negative power supply drain current IEEVEE= -5.7 V, -4.2 V, VTTL= 5.0 V 1, 2, 3 -70 -22 Positive power sup
38、ply drain current ITTLVEE= -4.5 V, VTTL= 5.5 V 1, 2, 3 38 Functional tests VIL= 0.4 V, VIH= 2.4 V VEE= -5.7 V, -4.2 V VTTL= 4.5 V, 5.5 V, See 4.4.1b 7, 8 Propagation delay time, data or enable to output tPLH, tPHLSee figure 4 9 0.5 2.9 ns 10 0.3 3.3 11 0.5 3.0 Transition time, output 2/ tTLH, tTHL9
39、0.45 1.8 10 0.45 1.8 11 0.35 1.8 1/ Each input/output, as applicable, shall be tested at the specified temperature for the specified limits. Output terminals shall be terminated through 50 to -2 V. Input terminals not designated shall be high logic level or low logic level. 2/ This parameter is prov
40、ided as design information only (not tested but guaranteed). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91530 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 6 DSCC FORM 2
41、234 APR 97 Symbol Inches 1/ Millimeters 1/ Min Max Min Max A .085 2.16 b .016 .018 0.41 0.46c .004 .006 0.10 0.15 D/E .370 .400 2/ 9.40 10.16 2/ e .045 .055 1.14 1.40 L .250 .360 6.35 9.14Q .035 .050 0.89 1.27 S .075 1.91N 24 24 NOTE: 1. The U.S. government preferred system of measurement is the met
42、ric SI system. However, since this item was originally designed using inch-pound units of measurement, in the event of conflict between the metric and inch-pound units, the inch-pound units shall take precedence. 2. This dimension allows for meniscus and glass overrun. FIGURE 1. Case outline. Provid
43、ed by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91530 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 Device type 01 Case outlines X Y Terminal number Termina
44、l symbol 1 0Q D1 2 Q1 D23 1Q Q0 4 2Q 0Q 5 Q2 Q1 6 VCC1Q 7 VCCA2Q 8 VCCAQ2 9 Q3 VCC10 3Q VCCA11 4Q VCCA12 Q4 Q3 13 5Q 3Q 14 Q5 4Q 15 D5 Q4 16 D45Q 17 D3 Q5 18 VEED5 19 E D420 VTTLD3 21 D0 VEE22 D1 E 23 D2 VTTL24 Q0 D0FIGURE 2. Terminal connections. Inputs Outputs Dn E Qn nQ X L L H L H L H H H H L H
45、= High level L = Low level X = Irrelevant FIGURE 3. Truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91530 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 8 DSCC FO
46、RM 2234 APR 97 NOTES: 1. VCC= VCCA= 0.0 V, VEE= -4.5 V, VTTL= +5.0 V, VIH= +3.0 V. 2. L1, L2, and L3 = equal length 50 impedance lines. 3. RT= 50 terminator internal to scope. 4. Decoupling 0.1 F from GND to VCC, VEE, and VTTL. 5. All unused outputs are loaded with 50 to GND. 6. CL= fixture and stra
47、y capacitance 3 pF. FIGURE 4. Test circuit and switching waveforms. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91530 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 9 DSCC
48、 FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and
