1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with NOR 5962-R232-94. 94-09-30 Michael A. Frye B Update drawing to reflect current requirements. Editorial changes throughout. - gap 01-02-26 Raymond Monnin C Boilerplate update and part of five year review. tcr 06-09-26 Ra
2、ymond Monnin THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV C C C C C C C C C SHEET 15 16 17 18 19 20 21 22 23 REV STATUS REV C C C C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Tuan Nguyen DEFENSE SUPPLY CENTER COLUMBUS STANDARD
3、 MICROCIRCUIT DRAWING CHECKED BY Jeff Bowling COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Michael A. Frye MICROCIRCUIT, MEMORY, CMOS, 1K X 9 PARALLEL FIFO, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPRO
4、VAL DATE 93-10-08 AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 67268 5962-91585 SHEET 1 OF 23 DSCC FORM 2233 APR 97 5962-E597-06 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91585 DEFENSE SUPPLY CENTER COLUM
5、BUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are a
6、vailable and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 91585 01 M X X Federal stock class designator RHA designator (see 1.2.1) D
7、evice type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M
8、RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function Access
9、time 01 7202SA 1K X 9 FIFO 120 ns 02 7202SA 1K X 9 FIFO 80 ns 03 7C424, 7C425 1K X 9 FIFO 65 ns 04 7C424, 7C425 1K X 9 FIFO 50 ns 05 7C424, 7C425 1K X 9 FIFO 40 ns 06 7C424, 7C425 1K X 9 FIFO 30 ns 1.2.3 Device class designator. The device class designator is a single letter identifying the product
10、assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case ou
11、tline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X CDIP3-T28 or GDIP4-T28 28 Dual-in-line package Y CDIP2-T28 or GDIP1-T28 28 Dual-in-line package Z GDFP2-F28 28 Flat pack U CQCC1-N32 32 Rectangular chip car
12、rier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91585 DEFEN
13、SE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Supply voltage range to ground potential (VCC)-0.5 V dc to +7.0 V dc DC voltage range applied to outputs in High Z state . -0.5 V dc to +7.0 V dc DC input voltage range
14、 (VIN) -0.5 V dc to +7.0 V dc DC output current . 20 mA Maximum power dissipation 1.0 W Lead temperature (soldering, 10 seconds) . +260C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 Junction temperature (TJ) . +175C Storage temperature range (TSTG) -65C to +150C Temperature under bias
15、. -55C to +125C 1.4 Recommended operating conditions. Supply voltage (VCC). +4.5 V dc minimum to +5.5 V dc maximum Ground voltage (GND) 0 V dc Input high voltage (VIH) . 2.2 V dc minimum Input low voltage (VIL) . 0.8 V dc maximum Case operating temperature range (TC) -55C to +125C 2. APPLICABLE DOCU
16、MENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEF
17、ENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - Lis
18、t of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, P
19、A 19111-5094.) 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD M
20、ICROCIRCUIT DRAWING SIZE A 5962-91585 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 2.2 Non-Government publications. The following documents form a part of this document to the extent specified herein. Unless otherwise specified, the issues o
21、f the documents are the issues of the documents cited in the solicitation. ELECTRONIC INDUSTRIES ALLIANCE (EIA) JEDEC Standard EIA/JESD 78 - IC Latch-Up Test. (Applications for copies should be addressed to the Electronics Industries Alliance, 2500 Wilson Boulevard, Arlington, VA 22201; http:/www.je
22、dec.org.) (Non-Government standards and other publications are normally available from the organizations that prepare or distribute the documents. These documents also may be available in or through libraries or other informational services.) 2.3 Order of precedence. In the event of a conflict betwe
23、en the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements
24、 for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
25、 device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q
26、 and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figu
27、re 2. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 El
28、ectrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. F
29、or packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accor
30、dance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “
31、C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of c
32、ompliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product m
33、eets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-
34、91585 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 5 DSCC FORM 2234 APR 97 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with
35、 each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and
36、 review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group as
37、signment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 105 (see MIL-PRF-38535, appendix A). 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535
38、 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For
39、device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices
40、 prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or ac
41、quiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table IIA herein.
42、Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91585 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. T
43、est Symbol Conditions 1/ -55C TC +125C 4.5 V VCC 5.5 V Group A subgroups Device type Limits Unit unless otherwise specified Min Max Output high voltage VOHVCC= 4.5 V, IOH= -2.0 mA 1, 2, 3 All 2.4 V VIN= VIH(Min), VIL(Max) Output low voltage VOLVCC= 4.5 V, IOL= 8.0 mA 1, 2, 3 All 0.4 V IN= VIH(Min),
44、VIL(Max) Input high voltage VIH1, 2, 3 All 2.2 V 2/ Input low voltage VIL1, 2, 3 All 0.8 V 2/ Input leakage current IIXVIN= 5.5 V to GND 1, 2, 3 All -10 10 A Output leakage current IOZVCC= 5.5 V, 1, 2, 3 All -10 10 A R = VIH, VOUT= 5.5 V and GND Operating supply ICC1VCC= 5.5 V, IOUT= 0 mA 1, 2, 3 01
45、-04 115 mA current f = 1/tRCW , R , DO D8pins are toggling between 0 V and 3 V 05 130 FF , XO / HF = 0 mA Q0 Q8= 0 mA 06 140 MR , FL / FT = 3.0 V Standby current ICC2VCC= 5.5 V, IOUT= 0 mA 1, 2, 3 All 30 mA All inputs = VIHFF , XO / HF = 0 mA Q0 Q8= 0 mA Power down current ICC3VCC= 5.5 V, IOUT= 0 mA
46、 1, 2, 3 All 25 mA All inputs = VCC0.2 V FF , XO / HF = 0 mA Q0 Q8= 0 mA Input capacitance CINVCC= 5.0 V, VIN= 0 V 4 All 8 pF 3/ TA= +25C, f = 1 MHz See 4.4.1e Output capacitance COUTVCC= 5.0 V, VOUT= 0 V 4 All 12 pF 3/ TA= +25C, f = 1 MHz See 4.4.1e Functional tests See 4.4.1c 7, 8A, 8B All See foo
47、tnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91585 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical perfor
48、mance characteristics Continued. Test Symbol Conditions 1/ -55C TC +125C 4.5 V VCC 5.5 V Group A subgroups Device type Limits Unit unless otherwise specified Min Max Read cycle time tRCSee figure 4 9, 10, 11 01 140 ns 02 100 03 80 04 65 05 50 06 40 Access time tA9, 10, 11 01 120 ns 02 80 03 65 04 50 05 40 06 30 Read recovery time tRR9, 10, 11 01, 02 20 ns 03, 04 15 05, 06 10 Read pulse width tPR9, 10, 11 01 120 ns 02 80 4/ 03 65 04 50 05 40 06 30 Read low to low Z tL
