1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add device types 03 and 04. Editorial changes throughout. 93-11-09 M. A. FRYE B Replace reference to MIL-STD-973 with reference to MIL-PRF-38535. - ro 05-03-16 R. MONNIN THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHE
2、T REV STATUS REV B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY SANDRA B. ROONEY DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY CHARLES E. BESORE COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTME
3、NTS APPROVED BY MICHAEL A. FRYE AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 92-05-08 MICROCIRCUIT, LINEAR, DUAL RS-232 TRANSCEIVER, MONOLITHIC SILICON AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-91729 SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E189-05 Provided by IHSNot f
4、or ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91729 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class
5、 levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflec
6、ted in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 91729 01 M V X Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. D
7、evice classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates
8、a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 LT1180 Dual RS-232 transceiver with shutdown 02 LT1181 Dual RS-232 transceiver 03 LT1280 Dual RS-232 transceiver with shutdown 04 LT1281 Dual RS-232 tra
9、nsceiver 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
10、accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line V GDIP
11、1-T18 or CDIP2-T18 18 Dual-in-line 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT D
12、RAWING SIZE A 5962-91729 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Supply voltage (VCC) +6 V dc Positive power supply voltage (V+) . +13.2 V dc Negative power supply voltage (V-) -13.2 V dc Driver input vo
13、ltage . V- to V+ Receiver input voltage . -30 V dc to +30 V dc ON - OFF input voltage (pin 18, device types 01, 03) GND to +12 V dc Driver output voltage . V- +30 V dc to V+ -30 V dc Receiver output voltage -0.3 V dc to VCC+ 0.3 V dc Short circuit duration, (V+) 30 seconds Short circuit duration, (V
14、-) . 30 seconds Short circuit duration, driver and receiver output . Continuous Power dissipation (PD) 500 mW 2/ 3/ Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Maximum junction temperature (TJ) +150C Storage temperature range . -65C to +150C Lead temperature (soldering, 10 seconds)
15、+300C 1.4 Recommended operating conditions. Supply voltage (VCC) +5.0 V dc Ambient operating temperature range (TA) . -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the
16、 extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test M
17、ethod Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.da
18、ps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may
19、degrade performance and affect reliability. 2/ Must withstand the added PDdue to short circuit tests; e.g. IOSTand IOSR. 3/ Derate at 9.5 mW/C above TA= +70C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-9
20、1729 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, howe
21、ver, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacture
22、rs Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 D
23、esign, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with
24、1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits ar
25、e as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be
26、marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this opti
27、on, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall b
28、e a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to sup
29、ply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to list
30、ing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certific
31、ate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of chan
32、ge of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and
33、 applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 53 (see MIL-PRF-38535, appendix A). Pr
34、ovided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91729 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Tes
35、t Symbol Conditions 1/ -55C TA +125C VCC= 5.0 V, Group A subgroups Device type Limits 2/ Unit VON- OFF= 3.0 V dc, unless otherwise specified Min Max Output voltage swing VOUTPositive, TR1, TR2 each loaded with 3 k to GND 1,2,3 All 5.0 V Negative, TR1, TR2 each loaded with 3 k to GND -5.0 Low level i
36、nput voltage VILVOUT= high 1,2,3 All 0.8 V High level input voltage VIHVOUT= low 1,2,3 All 2.0 V Logic input current high IIHVIN 2.0 V 1,2,3 All 20 A Logic input current low IILVIN 0.8 V 1,2,3 All 20 A Output short circuit current (transmitter) IOSTSourcing current, VOUT= 0 V, TA= +25C 1 All 7 mA Si
37、nking current, VOUT= 0 V, TA= +25C -7 Output leakage current (transmitter) IOZTVOUT= 30 V dc, 3/ shutdown mode 1,2,3 01 100 A 1,3 03 25 2 100 Slew rate SR RL= 3 k, CL= 51 pF, TA= +25C 4 All 4 30 V/s RS-232 input threshold low VTLVOUT= high 1,2,3 All 0.2 V RS-232 input threshold high VTHVOUT= low 1,2
38、,3 All 3.0 V RS-232 input hysteresis VH1,2,3 All 0.1 1.0 V Receiver input resistance RITA= +25C 1 All 3 7 k Receiver output high voltage VOHIOUT= 160 A, VCC= 5 V 1,2,3 All 3.5 V Receiver output low voltage VOLIOUT= -1.6 mA 1,2,3 All 0.4 V See footnotes at end of table. Provided by IHSNot for ResaleN
39、o reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91729 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Condition
40、s 1/ -55C TA +125C VCC= 5.0 V, Group A subgroups Device type Limits 2/ Unit VON- OFF= 3.0 V dc, unless otherwise specified Min Max Output short circuit current (receiver) IOSRVOUT= VCC, sinking current, TA= +25C 1 All -10 mA VOUT= 0 V dc, TA= +25C, 1 01,02 0.6 sourcing current 03,04 0.3 Output leaka
41、ge current (receiver) IOZR0 V VOUT= VCC, 3/ sinking current 1,2,3 01,03 10 A Supply current ICCOutputs unloaded 4/ 1,3 01,02 23 mA 2 30 1,2,3 03,04 14 Supply leakage current ICZZShutdown mode 3/ 4/ 1,2,3 01 100 A 1,3 03 25 2 100 ON- OFF pin current ISHUT 0 V VON- OFF 5 V 3/ 4/ 1,2,3 01,03 -15 80 A 1
42、/ External capacitors; for device types 01 and 02 = 0.1 F, for device types 03 and 04 = 1.0 F. 2/ The algebraic convention, whereby the most negative value is a minimum and the most positive a maximum, is used in this table. 3/ For device type 01: VON- OFF= 0.4 V for -55C TA +50C, and VON- OFF= 0.2
43、V for +50C TA +125C. For device type 03: VON- OFF= 0.4 V for -55C TA +100C, and VON- OFF= 0.2 V for +100C TA +125C. 4/ VCC= 5 V, external loading of V+ and V- equals zero, and the driver outputs are low (inputs high). Provided by IHSNot for ResaleNo reproduction or networking permitted without licen
44、se from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91729 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 Device type 01, 03 02, 04 Case outlines V E Terminal number Terminal symbol 1 NC C1+ 2 C1+ V+ 3 V+ C1- 4 C1- C2+ 5 C2+ C2- 6 C2- V-
45、7 V- TR2 OUT 8 TR2 OUT REC 2 IN 9 REC 2 IN REC 2 OUT 10 REC 2 OUT TR2 IN 11 TR2 IN TR1 IN 12 TR1 IN REC 1 OUT 13 REC 1 OUT REC 1 IN 14 REC 1 IN TR1 OUT 15 TR1 OUT GND 16 GND VCC17 VCC- 18 VON- OFF- FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted w
46、ithout license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91729 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 8 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in
47、accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, ap
48、pendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufac
