1、REVISIONSLTR DESCRIPTION DATE (YR -MO -DA) APPROVEDREVSHEETREVSHEETREV STATUS REVOF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12PMIC N/A PREPARED BY RICK C. OFFICER DEFENSE ELECTRONICS SUPPLY CENTERSTANDARDIZEDMILITARYDRAWINGCHECKED BYCHARLES E. BESOREDAYTON, OHIO 45444THIS DRAWING IS AVAILABLEFOR USE BY
2、 ALLDEPARTMENTSAPPROVED BYMICHAEL A. FRYE MICROCIRCUIT, LINEAR, HIGH SPEED, VOLTAGECOMPARATOR, WITH MASTERAND AGENCIES OF THEDEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 92-12-23SLAVE FLIP FLOP, MONOLITHIC SILICONAMSC N/A REVISION LEVEL SIZEACAGE CODE67268 5962-92128SHEET 1 OF 12DESC FORM 193JUL 91 5
3、962 -E580-92DISTRIBUTION STATEMENT A . Approved for public release; distribution is unlimited.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDIZEDMILITARY DRAWINGSIZEA 5962-92128DEFENSE ELECTRONICS SUPPLY CENTERDAYTON, OHIO 45444REVISION LEVE
4、L SHEET2DESC FORM 193AJUL 911. SCOPE1.1 Scope . This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two productassurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S andV), and a choi
5、ce of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Deviceclass M microcircuits represent non -JAN class B microcircuits in accordance with 1.2.1 of MIL -STD -883, “Provisions for the use ofMIL -STD -883 in conjunction with compliant non -JA
6、N devices“. When available, a choice of Radiation Hardness Assurance (RHA)levels are reflected in the PIN.1.2 PIN . The PIN shall be as shown in the following example:5962 - 92128 01 M G X| | | | | | | | | | | | | | | | Federal RHA Device Device Case Lead stock class designator type class outline fi
7、nishdesignator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / ( see 1.2.3)/ Drawing number1.2.1 RHA designator . Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels andshall be marked with the appropriate RHA designator. Device classes Q and V
8、RHA marked devices shall meet the MIL -I -38535specified RHA levels and shall be marked with the appropriate RHA designator. A dash ( -) indicates a non -RHA device.1.2.2 Device type(s) . The device type(s) shall identify the circuit function as follows:Device type Generic number Circuit function01
9、EL2019 High speed voltage comparator with masterslave flip flop1.2.3 Device class designator . The device class designator shall be a single letter identifying the product assurance level asfollows:Device class Device requirements documentationM Vendor self -certification to the requirements for non
10、 -JAN class B microcircuitsin accordance with 1.2.1 of MIL -STD -883B or S Certification and qualification to MIL-M-38510Q or V Certification and qualification to MIL -I -385351.2.4 Case outline(s) . The case outline(s) shall be as designated in MIL-STD-1835 and as follows:Outline letter Descriptive
11、 designator Terminals Package styleG MACY1-X8 8 CanP GDIP1-T8 or CDIP2-T8 8 Dual-in-line1.2.5 Lead finish . The lead finish shall be as specified in MIL-M- 38510 for class M, B, or S or MIL -I -38535 for classes Q and V. Finish letter “X“ shall not be marked on the microcircuit or its packaging. The
12、 “X“ designation is for use in specifications when leadfinishes A, B, and C are considered acceptable and interchangeable without preference.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDIZEDMILITARY DRAWINGSIZEA 5962-92128DEFENSE ELECTRONI
13、CS SUPPLY CENTERDAYTON, OHIO 45444REVISION LEVEL SHEET3DESC FORM 193AJUL 911.3 Absolute maximum ratings . 1 / Supply voltage (V S ) . 18 V dcInput voltage (V IN ) . V S+ to V S-Differential input voltage . Limited only by power suppliesPeak output current (I OP ) 50 mAContinuous output current . 25
14、mAInput current (Pins 1, 2, or 3) . 10 mAInput current (Pins 5 or 6) 5 mAJunction temperature (T J ) +175 ECStorage temperature range -65 EC to +150 ECLead temperature (soldering, 10 seconds) +300 ECPower dissipation (P D ):Case G 1.0 WCase P 1.5 WThermal resistance, junction-to-case ( JC ) See MIL-
15、STD-1835Thermal resistance, junction-to-ambient ( JA ):Case G 190 EC/WCase P 125 EC/W1.4 Recommended operating conditions .Supply voltage (V S ) . 15 V dcAmbient operating temperature range (T A ) -55 EC to +125 EC2. APPLICABLE DOCUMENT S2.1 Government specification, standards, bulletin, and handboo
16、k . Unless otherwise specified, the following specification,standards, bulletin, and handbook of the issue listed in that issue of the Department of Defense Index of Specifications andStandards specified in the solicitation, form a part of this drawing to the extent specified herein.SPECIFICATIONMIL
17、ITARYMIL-M-38510 - Microcircuits, General Specification for.MIL -I -38535 - Integrated Circuits, Manufacturing, General Specification for.STANDARDSMILITARYMIL-STD-480 - Configuration Control-Engineering Changes, Deviations and Waivers.MIL -STD -883 - Test Methods and Procedures for Microelectronics.
18、MIL-STD-1835 - Microcircuit Case Outlines.BULL ETINMILITARYMIL -BUL -103 - List of Standardized Military Drawings ( SMDs).1 / Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at themaximum levels may degrade performance and affect reliability.Pr
19、ovided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDIZEDMILITARY DRAWINGSIZEA 5962-92128DEFENSE ELECTRONICS SUPPLY CENTERDAYTON, OHIO 45444REVISION LEVEL SHEET4DESC FORM 193AJUL 91HANDBOOKMILITARYMIL -HDBK -780 - Standardized Military Drawings.(Cop
20、ies of the specification, standards, bulletin, and handbook required by manufacturers in connection with specific acquisitionfunctions should be obtained from the contracting activity or as directed by the contracting activity.)2.2 Order of precedence . In the event of a conflict between the text of
21、 this drawing and the references cited herein, the text ofthis drawing shall take precedence.3. REQUIREMENTS3.1 Item requirements . The individual item requirements for device class M shall be in accordance with 1.2.1 of MIL -STD -883,“Provisions for the use of MIL -STD -883 in conjunction with comp
22、liant non -JAN devices“ and as specifiedherein. The individual item requirements for device classes B and S shall be in accordance with MIL -M -38510 and as specifiedherein. For device classes B and S a full electrical characterization table for each device type shall be include in this SMD. Theindi
23、vidual item requirements for each device classes Q and V shall be in accordance with MIL-I-38535, the device manufacturersQuality Management (QM) plan, and as specified herein.3.2 Design, construction, and physical dimensions . The design, construction, and physical dimensions shall be as specified
24、inMIL-M-38510 for device for device class M, B, and S and MIL -I -38535 for device classes Q and V and herein.3.2.1 Case outline(s) . The case outline(s) shall be in accordance with 1.2.4 herein.3.2.2 Terminal connections . The terminal connections shall be as specified on figure 1.3.3 Electrical pe
25、rformance characteristics and postirradiation parameter limits . Unless otherwise specified herein, the electricalperformance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambientoperating temperature range.3.4 Electrical test requirem
26、ents . The electrical test requirements shall be the subgroups specified in table II. The electrical testsfor each subgroup are defined in table I.3.5 Marking . The part shall be marked with the PIN listed in 1.2 herein. Marking for device class M shall be in accordance withMIL -STD -883 (see 3.1 he
27、rein). In addition, the manufacturers PIN may also be marked as listed in MIL -BUL -103. Marking for device classes B and S shall be in accordance with MIL -M -38510. Marking for device classes Q and V shall be inaccordance with MIL-I-38535.3.5.1 Certification/compliance mark . The compliance mark f
28、or device class M shall be a “C“ as required in MIL -STD -883 (see 3.1herein). The certification mark for device classes B and S shall be a “J“ or “JAN“ as required in MIL -M -38510.The certification mark for device classes Q and V shall be a “QML“ as required in MIL -I -38535.3.6 Certificate of com
29、pliance . For device class M, a certificate of compliance shall be required from a manufacturer in order to belisted as an approved source of supply in MIL -BUL -103 (see 6.7.3 herein). For device classes Q and V, a certificate of comp lianceshall be required from a QML -38535 listed manufacturer in
30、 order to supply to the requirements of this drawing (see 6.7.2 herein). The certificate of compliance submitted to DESC -EC prior to listing as an approved source of supply for this drawing s hall affirm thatthe manufacturers product meets, for device class M, the requirements of MIL -STD -883 (see
31、 3.1 herein), or for device classes Qand V, the requirements of MIL -I -38535 and the requirements herein.3.7 Certificate of conformance . A certificate of conformance as required for device class M in MIL -STD -883 (see 3.1 herein) ordevice classes B and S in MIL-M-38510 or for device classes Q and
32、 V in MIL -I -38535 shall be provided with each lot of microcircuitsdelivered to this drawing.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDIZEDMILITARY DRAWINGSIZEA 5962-92128DEFENSE ELECTRONICS SUPPLY CENTERDAYTON, OHIO 45444REVISION LEVE
33、L SHEET5DESC FORM 193AJUL 91TABLE I. Electrical performance characteristics .Test SymbolConditions-55 C T A +125 CV S = 15 VGroup AsubgroupsDevicetypeLimits Unitunless otherwise specified Min MaxInput offset voltage V IO V CM = 0 V, 1 01 -5.0 +5.0 mVV OUT = transition point 2,3 -7.0 +7.0Input bias c
34、urrent I IB V CM = 0 V, Pin 2 or 3 1 01 -300 +300 nA2,3 -500 +500Input offset current I IO V CM = 0 V 1 01 -150 +150 nA2,3 -250 +250Power supply PSRR V S = 5 V to 15 V 1,2,3 01 75 dBrejection ratioCommon mode V CM 1,2,3 01 12 Vinput rangeVoltage gain A V V OUT = 0.8 V to 2.0 V 1 01 15 V/mV2,3 10Outp
35、ut voltage, V OL I OL = 0 mA to 8 mA 1 01 -0.05 0.4 Vlogic low 2,3 -0.1 0.4Output voltage, V OH V S = 15 V 1,2,3 01 3.5 4.65 Vlogic high V S = 5 V 1,2,3 2.4Output voltage V ODIS1 I OL = -1 mA, V S = 15 V 1,2,3 01 4.65 VI OL = -1 mA, V S = 5 V 2 / 1 3.0V ODIS2 I OL = -1 mA, 1,2,3 -0.3V S = 5 V to 15
36、VLE or CS inputs V INH 1 01 2.0 Vlogic high input 2,3 2.2voltageLE or CS inputs V INL 1,2,3 01 0.8 Vlogic low inputvoltageSee footnotes at end of table.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDIZEDMILITARY DRAWINGSIZEA 5962-92128DEFENS
37、E ELECTRONICS SUPPLY CENTERDAYTON, OHIO 45444REVISION LEVEL SHEET6DESC FORM 193AJUL 91TABLE I. Electrical performance characteristics - Continued.Test SymbolConditions-55 C T A +125 CV S = 15 VGroup AsubgroupsDevicetypeLimits Unitunless otherwise specified Min MaxLE or CS inputs I IN V IN = 0 V to 5
38、 V 1 01 -200 +200 Alogic input current 2,3 -300 +300Positive supply I S+EN 1 01 11.0 mAcurrent, enabled 2,3 12.0Positive supply I S+DIS 1 01 6.0 mAcurrent, disabled 2,3 7.0Negative supply I S-EN 1 01 17.0 mAcurrent, disabled 2,3 18.0Negative supply I S-DIS 1,2,3 01 8.0 mAcurrent, disabledCommon mode
39、 CMRR V CM = +12 V to 12 V 4,5,6 01 75 dBrejection ratioSetup time, 5 mV T S V IN = 100 A 9 01 20 nsoverdrive T A = +25 C 2 /Hold time T H T A = +25 C 2 / 9 01 0 nsClock to output T OUT T A = +25 C 2 / 9 01 25 nsdelayOutput three-state T EN T A = +25 C 2 / 9 01 70 nsenable delayOutput three-state T
40、DIS T A = +25 C 2 / 9 01 300 nsdisable delay1 / The algebraic convention, whereby the most negative value is a minimum and the most positive is a maximum,is used in this table. Negative current shall be defined as conventional current flow out of a device terminal.2 / If not tested, shall be guarant
41、eed to the limits specified in table I herein.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDIZEDMILITARY DRAWINGSIZEA 5962-92128DEFENSE ELECTRONICS SUPPLY CENTERDAYTON, OHIO 45444REVISION LEVEL SHEET7DESC FORM 193AJUL 91Device type 01Case o
42、utlines G and PTerminal number Terminal symbol1 GND2 INPUT+3 INPUT-4 -V S5 SELECT CHIP ( CS )6 CLOCK INPUT7 OUTPUT8 +V SNC = No connectionFIGURE 1. Terminal connections .Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDIZEDMILITARY DRAWINGSIZE
43、A 5962-92128DEFENSE ELECTRONICS SUPPLY CENTERDAYTON, OHIO 45444REVISION LEVEL SHEET8DESC FORM 193AJUL 913.8 Notification of change for device class M . For device class M, notification to DESC -EC of change of product (see 6.2 herein)involving devices acquired to this drawing is required for any cha
44、nge as defined in MIL-STD-480.3.9 Verification and review for device class M . For device class M, DESC, DESCs agent, and the acquiring activity retain theoption to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made availableonshore at the o
45、ption of the reviewer.3.10 Microcircuit group assignment for device class M, B, and S . Device classes M, B, and S devices covered by this drawingshall be in microcircuit group number 50 (see MIL-M-38510, appendix E).3.11 Serialization for device class S . All device class S devices shall be seriali
46、zed in accordance with MIL-M-38510.4. QUALITY ASSURANCE PROVISIONS4.1 Sampling and inspection . For device class M, sampling and inspection procedures shall be in accordance with section 4 ofMIL -M -38510 to the extent specified in MIL-STD-883 (see 3.1 herein). For device classes B and S, sampling a
47、nd inspectionprocedures shall be in accordance with MIL -M -38510 and method 5005 of MIL-STD-883, ex cept as modified herein. For deviceclasses Q and V, sampling and inspection procedures shall be in accordance with MIL -I -38535 and the device manufacturers QMplan.4.2 Screening . For device class M
48、, screening shall be in accordance with method 5004 of MIL -STD -883, and shall beconducted on all devices prior to quality conformance inspection. For device classes B and S, screening shall be in accordancewith method 5004 of MIL-STD-883, and shall be conducted on all devices prior to qualification and technology conformanceinspection. For device classes Q and V, screening shall be in accordance with MIL -I -38535, and shall be conducted on all devicesprior to qualification and technology conformance inspection.4.2.1 Ad
