1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Make a correction to the Output offset voltage test unit symbol from “mA” to “mV” under Table I. Delete footnote 3/ and add footnote 2/ under the conditions column of the Transresistance, single-ended output test as specified under Table I. Chang
2、es in accordance with N.O.R. 5962-R054-94. 94-03-10 M. A. FRYE B Make a correction to pin 2 from “GND” to “VCC” under figure 2. Redrawn. - ro 08-11-14 R. HEBER REV SHET REV SHET REV STATUS REV B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 PMIC N/A PREPARED BY MARCIA B. KELLEHER CHECKED BY CHAR
3、LES E. BESORE DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil APPROVED BY MICHAEL A. FRYE STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 92-11-19 MICROCIRCUIT, LINEAR,
4、TRANSIMPEDANCE AMPLIFIER, MONOLITHIC SILICON AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-92129 SHEET 1 OF 9 DSCC FORM 2233 APR 97 5962-E496-08 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92129 D
5、EFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlin
6、es and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 92129 01 M P A Federal stock class designator RHA
7、 designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA de
8、signator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number
9、 Circuit function 01 5212A Transimpedance amplifier 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 complia
10、nt, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style P GD
11、IP1-T8 or CDIP2-T8 8 Dual-in-line 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DR
12、AWING SIZE A 5962-92129 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Power supply voltage (VCC) 6.0 V dc Ground differential None allowed, short 4 ground pins together Storage temperature range . -65C to +150
13、C Lead temperature (soldering, 10 seconds) +300C Junction temperature (TJ) . +150C Power dissipation (PD) 165 mW Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Thermal resistance, junction-to-ambient (JA) 158C/W 1.4 Recommended operating conditions. Power supply voltage range (VCC) 4.5
14、 V dc to 5.5 V dc Ambient operating temperature range (TA) . -55C to +125C Transresistance power supply sensitivity (R/V): VCC= 5.0 V 0.5 V 9.6 normally Transresistance ambient temperature sensitivity (R/T) . 0.05 % / C normally Input rms noise current spectral density (IN): f = 10 MHz . 2.5 pA / Hz
15、 normally Input rms noise current (IT), f = 100 MHz 30 nA normally Power supply rejection ratio (PSRR) : ECL configuration, f = 0.1 MHz 23 dB normally Pulse distortion overload threshold (IPmax) . 300 A normally 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The foll
16、owing specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing,
17、 General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcirc
18、uit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing
19、 and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended
20、 operation at the maximum levels may degrade performance and affect reliability. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92129 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B
21、 SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan
22、 shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, constr
23、uction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections
24、 shall be as specified on figure 1. 3.2.3 Block diagram. The block diagram shall be as specified on figure 2. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter l
25、imits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part s
26、hall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using t
27、his option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V
28、 shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in orde
29、r to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior
30、 to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A
31、certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA
32、 of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers faci
33、lity and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 53 (see MIL-PRF-38535, appendi
34、x A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92129 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characterist
35、ics. Test Symbol Conditions -55C TA +125C VCC= 5 V Group A subgroups Device type Limits Unit unless otherwise specified Min Max Input bias voltage VIIIN= 0 A 1,2,3 01 0.55 1.05 V Output bias voltage VOIIN= IOUT= 0 A 1,2,3 01 2.5 3.8 V Output offset voltage VOSIIN= IOUT= 0 A 1,2,3 01 120 mV Supply cu
36、rrent ICCIIN= IOUT= 0 A 1,2,3 01 20 33 mA Output sink / source current IOMAXVOUT 100 mV 1,2,3 01 3.0 mA Maximum input current (2 % linearity) IBIOUT= 0 A 1,2,3 01 40 A Maximum input current overload threshold IMAX1,2,3 01 60 A Maximum output voltage swing differential VOMAXRL= 1,2,3 01 1.7 VP-PTrans
37、resistance, differential output RTf = 10 MHz, RL= 1/ 2/ 4,5,6 01 9.0 19 k Output resistance, differential output ROf = 10 MHz 2/ 4,5,6 01 14 46 Transresistance, single ended output RTSf = 10 MHz, RL= 2/ 4,5,6 01 4.5 9.5 k Output resistance, single ended output ROSf = 10 MHz 1/ 4,5,6 01 7.0 23 Bandwi
38、dth (-3 dB) f3dB TA= +25C 2/ 4 01 100 MHz Input resistance RIN2/ 4,5,6 01 70 150 Input capacitance CIN2/ 4 01 18 pFPower supply rejection ratio PSRR f = 0.1 MHz 1/ 3/ 4/ 4,5,6 01 20 dB 1/ Due to test equipment limitations, actual tested conditions and/or limits may differ from those specified, howev
39、er the specified test limits and conditions are guaranteed. 2/ This parameter is guaranteed but not tested. 3/ Output referenced. 4/ Circuit board layout dependent at higher frequencies. For best performance use RF filter in VCClines. Provided by IHSNot for ResaleNo reproduction or networking permit
40、ted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92129 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 Device type 01 Case outline P Terminal number Terminal symbol 1 II2 VCC3 GND1 4 GND1 5 OUT+ 6 GND2 7 OUT- 8 GND2 FI
41、GURE 1. Terminal connections. FIGURE 2. Block diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92129 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 7 DSCC FORM 2234 AP
42、R 97 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or funct
43、ion as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and tech
44、nology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test cond
45、ition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in ac
46、cordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein. 4.2.2 Additional criteria for device classes Q and V. a. The burn-in test duration, test condition and test temperature,
47、 or approved alternatives shall be as specified in the device manufacturers QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document revision level control of the device manufacturers Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shal
48、l be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table II herein. c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in MIL-PRF-38535, appendix B. 4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q
