1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with NOR 5962-R146-93. 93-04-29 K. A. Cottongim B Added case outline Z. Redrew entire document. 95-06-15 K. A. Cottongim C Added RadHard and Class K devices. Added RadHard requirements. Redrew entire document. -sld 97-10-23
2、K. A. Cottongim D Table I; For the Output voltage test +VOUTchange the min and max limits for the Radhard L and R for device type 02 from 4 and 6 V to 4.7 and 5.3 V. Change the max limit for Radhard L and R for device type 02 for the VRIPand IINtests. Change the max limit for device type 02 for the
3、VRIPtest subgroups 2 and 3 from 120 to 240 mVp-p. -sld 98-02-03 K. A. Cottongim E Changes to table I to standardize test nomenclature and conditions. 00-06-26 Raymond Monnin F Correct case outline X. For symbol D change max value from 1.455 to 1.460 and for symbol E change max value from 1.125 to 1.
4、130. Update drawing to reflect current requirements. gc 04-08-23 Raymond Monnin G Correct dimension E1 for case outline Z. Change min. value from 0.790” to 0.786” and max value from 0.810” to 0.814” Add paragraph 1.5 and footnote 2/. Table I, add footnote 2/ for enhanced low dose rate effects. Parag
5、raph 4.3.5.a, correct paragraph to add component tested dose rate. Add paragraph 3.2.3 for Radiation exposure circuit. gc 07-01-29 Raymond Monnin H Update Table I to include RHA level “P“. Update table in paragraph 4.3.5 to include RHA level “P “. Update bulletin page to include RHA level “P“ part n
6、umbers. gc 07-05-31 Robert M. Heber REV SHEET REV SHEET REV STATUS REV H H H H H H H H H H H H H OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 PMIC N/A PREPARED BY Steve L. Duncan DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Gary Zahn COLUMBUS, OHIO 43218-3990 http:/www.ds
7、cc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Gregory Lude MICROCIRCUIT, HYBRID, LINEAR, 5-VOLT, SINGLE CHANNEL, DC-DC CONVERTER AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 92-07-02 AMSC N/A REVISION LEVEL H SIZE A CAGE CODE 67268 5962-92139 SHEET 1
8、OF 13 DSCC FORM 2233 APR 97 5962-E433-07 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92139 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL H SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE
9、1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels
10、 are reflected in the PIN. 1.2 PIN. The PIN shall be as shown in the following example: 5962 - 92139 01 H X X Federal RHA Device Device Case Lead stock class designator type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.
11、1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Dev
12、ice type Generic number Circuit function 01 MHF+2805S/883, MHF+2805SF/883 DC-DC converter, 12 W, 5 V output 02 SMHF2805S, SMHF2805SF DC-DC converter, 12 W, 5 V output 1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level. All lev
13、els are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K, and E) or QML Listing (Class G and D). The product assurance levels are as follows: Device class Device performance documentation K Highest reliability class available. This level
14、 is intended for use in space applications. H Standard military quality class level. This level is intended for use in applications where non-space high reliability devices are required. G Reduced testing version of the standard military quality class. This level uses the Class H screening and In-Pr
15、ocess Inspections with a possible limited temperature range, manufacturer specified incoming flow, and the manufacturer guarantees (but may not test) periodic and conformance inspections (Group A, B, C and D). E Designates devices which are based upon one of the other classes (K, H, or G) with excep
16、tion(s) taken to the requirements of that class. These exception(s) must be specified in the device acquisition document; therefore the acquisition document should be reviewed to ensure that the exception(s) taken will not adversely affect system performance. D Manufacturer specified quality class.
17、Quality level is defined by the manufacturers internal, QML certified flow. This product may have a limited temperature range. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92139 DEFENSE SUPPLY CENTER COLUM
18、BUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL H SHEET 3 DSCC FORM 2234 APR 97 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X See figure 1 8 Dual-in-line Z See figure 1 8 Flange mount 1.2.5 Le
19、ad finish. The lead finish shall be as specified in MIL-PRF-38534. 1.3 Absolute maximum ratings. 1/ Input voltage range -0.5 V dc to +50 V dc Power dissipation (PD) Device type 01 (non-RHA) 6 W Device type 02 (non-RHA) 8 W Device type 02 (RHA level P, L and R). 9 W Output power . 12.36 W Lead solder
20、ing temperature (10 seconds) +300C Storage temperature range -65C to +150C 1.4 Recommended operating conditions. Input voltage range +16 V dc to +40 V dc Case operating temperature range (TC). -55C to +125C 1.5 Radiation features. Maximum total dose available (dose rate = 9 rad(Si)/s: Device type 02
21、 (RHA levels P, L and R) 100 krad (Si) 2/ 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are th
22、ose cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38534 - Hybrid Microcircuits, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard for Microcircuit Case Outlines. _ 1/ Str
23、esses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ These parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects. Radiation e
24、nd-point limits for the noted parameters are guaranteed only for the conditions as specified in MIL-STD-883, method 1019, condition C, tested at 9 rad(Si)/s. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92
25、139 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL H SHEET 4 DSCC FORM 2234 APR 97 DEPARTMENT OF DEFENSE HANBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings (SMDs). MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at h
26、ttp:/assist.daps.dla.mil;quicksearch/ or www.dodssp.daps.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
27、of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in accordan
28、ce with MIL-PRF-38534. Compliance with MIL-PRF-38534 shall include the performance of all tests herein or as designated in the device manufacturers Quality Management (QM) plan or as designated for the applicable device class. The manufacturer may eliminate, modify or optimize the tests and inspecti
29、ons herein, however the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not affect the form, fit, or function of the device for the applicable device class. 3.2 Design, construction, and physical di
30、mensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38534 and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2
31、.3 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing and acquiring activity upon request. 3.3 Electrical performance characteristics. Unless otherwise specified herein,
32、 the electrical performance characteristics are as specified in table I and shall apply over the full specified operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are def
33、ined in table I. 3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers vendor similar PIN may also be marked. 3.6 Data. In addition to the general performance requirements
34、 of MIL-PRF-38534, the manufacturer of the device described herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample, for each device type listed herein. Also, the data should include a summary of all parameters manually tes
35、ted, and for those which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be made available to the preparing activity (DSCC-VA) upon request. 3.7 Certificate of compliance. A certificate of compliance shall be required from a manufa
36、cturer in order to supply to this drawing. The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that the manufacturers product meets the performance requirements of MIL-PRF-38534 and herein. 3.8 Certificate of conformance. A certificate of conformance as required in MIL-PR
37、F-38534 shall be provided with each lot of microcircuits delivered to this drawing. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as modified in the device manufacturers Quality Management (QM) plan. The modification in t
38、he QM plan shall not affect the form, fit, or function as described herein. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92139 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL H SHEE
39、T 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ 2/ -55C TC +125C VIN= 28 V dc 0.5 V Group A subgroups Device types Limits Unit no external sync, CL= 0 unless otherwise specified Min Max 1 4.95 5.05 IOUT= 2.4 A dc 2,3 01,02 4.85 5.15 Output voltage
40、 VOUTP, L, R 1,2,3 02 4.70 5.30 V dc VIN= 16 V dc to 40 V dc 1,2,3 01, 02 2400 Output current IOUTP, L, R 1,2,3 02 2400 mA 1 01,02 80 01 100 IOUT= 2.4 A BW = 10 kHz to 2 MHz 2,3 02 240 VOUTripple voltage VRIPP, L, R 1,2,3 02 350 mVp-p 01 50 VIN=16 V dc to 40 V dc IOUT= 2.4 A 1,2,3 02 100 VOUTline re
41、gulation VRLINEP, L, R 1,2,3 02 200 mV IOUT= 0 to 2.4 A 1,2,3 01,02 50 VOUTload regulation VRLOADP, L, R 1,2,3 02 100 mV IOUT= 0 A, Inhibit (pin 1) = 0 V dc 1,2,3 01,02 12 P, L, R 1,2,3 02 15 IOUT= 0 A, Inhibit (pin 1) = open 1, 2, 3 01,02 40 Input current IINP, L, R 1,2,3 02 100 mA 1 01,02 80 01 10
42、0 IOUT= 2.4 A, BW = 10 kHz to 10 MHz 2,3 02 120 IINripple current IRIPP, L, R 1,2,3 02 150 mAp-p See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92139 DEFENSE SUPPLY CENTER COLU
43、MBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL H SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions 1/ 2/ -55C TC +125C VIN= 28 V dc 0.5 V Group A subgroups Device types Limits Unit no external sync, CL= 0 unless otherwise specified Min M
44、ax 01 75 Efficiency Eff IOUT= 2.4 A 1 02 73 % 01 72 2,3 02 70 P, L, R 1,2,3 02 65 Isolation ISO Input to output or any pin to case (except pin 6) at 500V dc, 1 01,02 100 M TC= +25C P, L, R 1 02 100 Short circuit PDShort circuit 1,2,3 01 6 W power dissipation, PD= PIN- total POUT1,2,3 02 8 P, L, R 1,
45、2,3 02 9 4 01,02 500 600 Switching frequency FSIOUT= 2.4 A 5,6 01,02 480 620 kHz P, L, R 4,5,6 02 400 700 External sync range 3/ FSYNCIOUT= 2.4 A, TTL level to pin 5 4,5,6 01,02 500 600 kHz P, L, R 4,5,6 02 500 600 4,5,6 01 -400 +400 VOUTstep load transient 4/ VTLOAD50% load to/from 100% load 4,5,6
46、02 -500 +500 mV pk P, L, R 4,5,6 02 -1200 +1200 VOUTstep load transient recovery 4/ 5/ 6/ TTLOAD50% load to/from 100% load 4,5,6 01,02 300 s P, L, R 4,5,6 02 1200 VOUTstep line transient 5/ 7/ VTLINEInput step 16 V dc to/from 40 V dc, IOUT= 2.4 A 4,5,6 01,02 -800 +800 mV pk P, L, R 4,5,6 02 -1500 +1
47、500 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92139 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL H SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electr
48、ical performance characteristics - Continued. Test Symbol Conditions 1/ 2/ -55C TC +125C VIN= 28 V dc 0.5 V Group A subgroups Device types Limits Unit no external sync, CL= 0 unless otherwise specified Min Max VOUTstep line transient recovery 5/ 6/ TTLINEInput step 16 V dc to/from 40 V dc, IOUT= 2.4 A 4,5,6 01,02 1.2 ms P, L, R 4,5,6 02 2.4 Start up overshoot 5/ VtonOSIOUT = 2.4 A, VIN= 0 to 28 V dc 4,5,6 01,02 600 mV pk P, L, R 4,5,6 02 1500 Start up delay 8
