1、SflD-57b2-92259 REV A = 9999996 009OLlOLl 008 DEFENSE LOGISTICS AGENCY DEFENSE SUPPLY CENTER, COLUMBUS POST OFFICE BOX 3990 COLUMBUS, OH 43216-5000 IN REPLY REFER TO DSCC-VAC (Mr. T. Nguyen/(DSN)850-0671/6 14-692-067 Ihn) SUBJECT: Notice of Revision (NOR) 5962-R025-97 for Standard Microcircuit Drawi
2、ng (SMD) 5962-92259 Militaryflndustry Distribution The enclosed NOR is approved for use effective as of the date of the NOR. In accordance with MIL-STD- 1 O0 SMD holders should, as a minimum, handwrite those changes described in the NOR to sheet 1 of the subject SMD. After completion, the NOR should
3、 be attached to the subject SMD for future reference. Those companies who were listed as approved sources of supply prior to this action have agreed to actions taken on devices for which they had previously provided DSCC a certificate of compliance. This is evidenced by an existing active current ce
4、rtificate of compliance on file at DSCC with a DSCC record of verbal coordination. The certificate of compliance for these devices is considered concurrence with the new revision unless DSCC is otherwise notified. If you have comments or questions, please contact Thanh Nguyen at (DSN)850-0671/(614)6
5、92-067 1. 1 Encl ONICA L. POELKING Chief, Custom Microelectronics Team Federal Recycling Program Printed on Recycled Papei Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-5962-92259 REV A 9999996 0090405 T44 ubi repoLhSE DO NOT RET%N COUR COdPLET
6、ED FOkM TO EITHER OF THESE ADDRESSED. RETURN COMPLETED FORM TO THE GOVERNMENT SSUING CONTRACTING OFFICER FOR THE CONTRACT/ PROCURING ACTIVITY NUMBER LISTED IN ITEM 2 OF THIS FORM. dW add “A. Revisions description column; add “Changes in accordance with NOR 5962-R025-97“. Revisions date column; add “
7、96-1 0-1 7“. Revision level block; add “A. Rev status of sheets; for sheets 1 and 6, add “A. Sheet 6: Table I, output short circuit current, los; change maximum limit from “-225 mA“ to “-250 mA“ Revision level block; add “A“. d. TITLE Chief, Custom Microelectronics Team 15a. ACTIVITY ACCOMPLISHING R
8、EVISION DSCC-VAC e. SIGNATURE f. DATE SIGNED (YYMMDD) Monica L. Poelking 96-1 0-1 7 b. REVISION COMPLETED (Signaiure) c. DATE SIGNED (YYMMDD) Thanh V. Nguyen 96-10-17 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- SMD-5962-92259 W 9999996 006990b 9
9、06 LTR DATE (YR-MO-DA) APPROVED DE SCRIPTION REV SHEET REV SHEET 15 _ . PMIC NIA 16 17 STANDARD MICROCIRCUIT DRAWING CHECKED BY Thanh V. Nguyen APPROVED BY Monica L. Poelking DRAWING APPROVAL DATE 94-09-22 REVISION LEVEL THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPART
10、MENT OF DEFENSE MICROCIRCUIT, DIGITAL, FAST CMOS, 16-BIT NONINVERTING TRANSPARENT LATCH WITH THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS AND LIMITED OUTPUT VOLTAGE SWING, MONOLITHIC SILICON SIZE CAGE CODE 5962-92259 A 67268 SHEET 1 OF 20 AMSC N/A )ESC FORM 193 JUL 91 DISTRIBUTION STATEMENT A. Approve
11、d for public release; distribution is unlimited. 5962-E421 -94 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-5762-92259 9999e19b 0069907 842 1. SCOPE 1 .I Scopc. This drawing forms a part of a one part - one pari: number documentation system (s
12、ec 6.6 herein). TWO product assurance classes consisting of military high reliability (device classes Q and MI and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). 1.2.1 of MIL-STD-883, “Provi
13、sions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices“. available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. Device class M microcircuits represenl: non-JAN class B microcircuits in accordance with Uhen 1.2 m. The PIN shall be as shown i
14、n the following example: 5r i 92259 7 i 1 1 Federal RHA Device Device case Lead stock class designator type class out line finish designator (see 1.2.1) (see 1.2.2) designator (sec 1.2.4) (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA desiqnator. Device class M RHA marked devices shalt meet th
15、e MIL-1-38535 appendix A specified RHA Levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIGI-38535 specified RHA Levels and shall be marked with the appropriate RHA designator. non-RHA device. A dash I-) indicates a 1.2.2 Device
16、 tYPt(S). The device type(s) shall identify the (circuit function as follows: Devi ce type Generic number Circuit function I o1 54FCT16373T 16-bit noninverting transparent latch with three-state outputs, TTL compatible inputs and limited output voltage swing 03 54FCT16373CT 16-bi t noninverting tran
17、sparent latch with three-state outputs, TTL compatible inputs and limited output voltage swing 1 1.2.3 Device cLass desiqnator. The device class designator shall be a single letter identifying the product assurance level as follows: o2 54FCT16373AT I Device class Device requirements documentatio? 16
18、-bit noninverting transparent latch with three-state outputs, TTL compatible inputs and limited output voltage swing M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-1-3853s 1.2.4 C
19、ase outline(s). The case outlineW shall be as designated in MIL-STD-1835, and as follows: Out line letter Descriptive designator Ter m i na 1 s Package style X GDFPI-F48 48 Flat pack 1.2.5 Lead finish. The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-1-38535 f
20、or classes Q and V. designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference. Finish letter “X“ shall not be marked on the microcircuit or its packaging. The “XI 5962-92259 MICROCIRCUIT DRAWING DEFENSE ELECTRONICS SUPPLY
21、 CENTER DAYTON, OHIO 45444 REVISION LEVEL 4 DESC FORM 193A JUL 91 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-_ SMD-5962-92259 9999996 00b908 789 I 1.3 Absolute maximum ratinqs. I/ 2/ 3/ STANDARD MICROCIRCUIT DRAWING Supply voltage range (V - - -
22、 - - - - - - - - - - - - - - - DC input voltage range tv ) - - - - - - - - - - - - - - - - - DC output voltage range dN ) - - - - - - - - - - - - - - - - DC input clamp current (I FT(V = -0.5 V - - - - - - - - - DC output clamp current (f,) do, -0.5 V and +7.0 V) - - - - DC output source current (I
23、- - - - - - - - - DC output sink current (IoLY(per output) - - - - - - - - - - trouni current (iGND) - - - - - - - - - - - - - - - - - - - - Storage temperature range (T ) - - - - - - - - - - - - - - - Case temperature under bias ?$,As) - - - - - - - - - - - - - Lead temperature (soldering, seconds)
24、 - - - - - - - - - - - Thermal resistance, junction-to-case (OJc) - - - - - - - - - - Junction temperature (TJ) - - - - - - - - - - - - - - - - - - Maximum power dissipation (PD) - - - - - - - - - - - - - - - - ) (per output) DC Vc current (Icc) - - - - - - - - - - - - - - - - - - 1.4 Recommended op
25、erating conditions. z/ 3/ Supply voltage range WCC) - - - - - - - - - - - - - - - - - - Input voltage range (VIN) - - - - - - - - - - - - - - - - - - Output voltage range (VOUT) - - - - - - - - - - - - - - - - - Maximum low level input voltage (VIL) - - - - - - - - - - - - Minimum high level input v
26、oltage (VI 1 - - - - - - - - - - - - case operating temperature range (T$ - - - - - - - - - - - - Maximum input rise or fall rate (AtIAv): - - - - - - - - Maximum high level output current (1 1 - - - - - - - - - - - Maximum low level output current (Io? - - - - - - - - - - - - (from VIN = 0.3 V to 2
27、.7 V, 2.7 V to 0.3 V) SIZE A 5962-92259 -0.5 V dc to +7.0 V dc -0.5 V dc to Vcc + 0.5 V dc 41 -0.5 V dc to Vcc -20 ntA t2O mA -30 mA +70 mA 1480 mA +I120 ipA -65C to +150C -65OC to +135C +3oooc See MIL-STD-1835 +175OC 1.0 w +4.5 V dc to +5.5 V dc +O.O V dc to Vcc +O.O V dc to Vcc 0.8 v 2.0 v -55C to
28、 +125OC 2.5 ns/V -24 mA 48 mA 1.5 Digitat logic testing for device classes Q and V. Fault coverage measurement of manufacturing Logic tests (MIL-STD-883, test method 5012) - - - - - - - - XX percent s/ 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, bulletin, and handbook. Untess ot
29、herwise specified, the following specification, standards, bulletin, and handbook of the issue listed in that issue of the Department of Defense Index of Specifications and Standards specified in the solicitation, form a part of this drawing to the extent specified herein. DEFENSE ELECTRONICS SUPPLY
30、 CENTER DAYTON, OHIO 45444 I REVISIQN LEVEL I SHEET3 I I 1 1 DESC FORM 193A JUL 91 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SPECIFICATION MILITARY HIL-1-38535 - STANDARDS MILITARY MIL-STD-883 - HIL-STD-973 - MIL-STD-1835 - BULLETIN MILITARY MI
31、L-BUL-103 - HANDBOOK HILITARY MIL-HDBK-780 - Integrated Circuits, Hanufacturing, General Specification for. Test Hethods and Procedures for Hicroelectronics. Configuration Management. Hicrocircuit Case Outlines List of Standardized Military Drawings (SMDs). Standardized Military Drawings. (Copies of
32、 the specification, standards, bulletin, and handbook irequired by manufacturers in connection with specific acquisition functions should be obtained from the contracting activity or as directed by the contracting activity.) 2.2 Order of precedence. In the event of a conflict between %the text of th
33、is drawing and the references cited herein, the text of this drawing shall take precedence. 3. REQUIREMENTS 3.1 The individual item requirements for device class M shall be in accordance with 1.2.1 of MIL-STD-883, “Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices“
34、and as Specified herein. device manufacturers Quality Management (QM) plan, and as specified herein. Item requirements. lhe individual item requirements for device classes Q and V shall be in accordance with MIL-1-38535, the 3.2 Desian, construction, and physical dimensions. The design, construction
35、, and physical dimensions shall be as specified in MIL-STD-883 (see 3.1 herein) for device class M and MIL-1-38535 for device classes C! and V and herein. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. 3.2.3 Truth table. 3.2.4 Logic diagram
36、. 3.2.5 Ground bounce Load circuit and waveforms. The terminal connections shall be as specified on figure 1. The truth table shall be as specified on figure 2. The logic diagram shall be as specified on figure 3. The ground bounce load circuit and waveforms shall be as specified on figure 4. 3.2.6
37、figure 5. Switchinq waveforms and test circuit. The switching waveforms and test circuit shall be as specified on 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradation paramete
38、r limits are as specified in table I and shall apply over the full case operating temperature range. and limits are as specified in table I. 3.4 Electrical test requirements. Test conditions for these specified Characteristics The electrical test requirements shall be the subgroups specified in tabl
39、e II. The electrical tests for each subgroup are defined in table I. SIZE STANDARD A MICROCIRCUIT DRAWING DEFENSE ELECTRONICS SUPPLY CENTER t DAYTON, OHIO 45444 DESC FORM 193A JUL 91 5962-92259 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-5962
40、-72259 m 999999b 00b10 337 W SIZE STANDARD A MICROCIRCUIT DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 REVISION LEVEL 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. Marking for device class i4 shall be in accordance with HIL-STO-883 (see 3.1 herein). MIL-BUL
41、-103. In addition, the manufacturers PIN may also be marked as listed in Marking for device classes Q and V shall be in accordance with HIL-1-38535. 3.5.1 Certification/coiiipliance mark. The compliance mark for device class M shall be a “C“ as required in HIL-STD-883 (see 3.1 herein). in MIL-1-3853
42、5. The certification mark for device classes Q and V shall be a “QML“ or Q“ as requircd 3.6 Certificate of compliance. For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-BUL-103 (see 6.7.2 herein). classe
43、s Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.7.1 herein). listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device class il the
44、 rquirements of HIL-STD-883 (see 3.1 herein), or for device classes Q and V, the requirements of MIL-1-38535 and the requirements herein. For device The certificate of compliance submitted to DESC-EC prior to 3.7 Certificate of conformance. A Certificate of conformance as required for device class M
45、 in MIL-STD-883 (see 3.1 herein) or for device classes Q and V in MIL-1-38535 shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of chanqe for device class II. For device class M, notification to DESC-EC of change of product (see 6.2 herein) involving device
46、s acquired to this drawing is required for any change as defined in MIL-STO-973. 3.9 Verification and review for device class M. For device class M, DESC, OESCs agent, and the acquiring activity Offshore documentation retain the option to review the manufacturers facility and applicable required doc
47、umentation. shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 38 (see MIL-1-38535, appendix A). 4. QUALITY ASSURANCE PROVISIONS 5962-92259 SHEET 5
48、4.1 Samplin(i and inspection. For device class M, sampling and inspection procedures shall be in accordance with For device classes Q and V, sampling and inspection procedures shall be in accordance MIL-STD-883 (see 3.1 herein). with MIL-1-38535 and the device manufacturers QH plan. 4.2 Screening. F
49、or device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. For device classes Q and V, screening shall be in accordance with MIL-1-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. 4.2.1 Additional criteria for device ciass M. a. Burn-in test
