1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes were made to 1.3 and table IIA. Add table IIB. Update boilerplate. -rrp 99-04-26 R. MONNIN B Replaced reference to MIL-STD-973 with reference to MIL-PRF-38535. Drawing updated to reflect current requirements. - gt 04-05-06 R. MONNIN C Und
2、er the title block and paragraph 1.2.2, delete 3 A and substitute 2.4 A Under paragraph 1.3, make correction to continuous output current, delete 3 A and substitute 2.4 A. Add terminal symbol descriptions to figure 2. Delete the note number 14 from the figure 1 dimensions table. Update boilerplate p
3、aragraphs to current MIL-PRF-38535 requirements. - ro 12-04-18 C. SAFFLE REV SHEET REV SHEET REV STATUS REV C C C C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY RICK OFFICER DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil
4、 STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY RAJESH PITHADIA APPROVED BY MICHAEL FRYE MICROCIRCUIT, LINEAR, 2.4 AMP, 55 VOLT H-BRIDGE, MONOLITHIC SILICON DRAWING APPROVAL DATE 94-9-07 AMSC N/A REVISION LEVEL
5、C SIZE A CAGE CODE 67268 5962-92325 SHEET 1 OF 14 DSCC FORM 2233 APR 97 5962-E257-12 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92325 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEE
6、T 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifyi
7、ng Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 92325 01 M X A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2) Device class designator Case
8、outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendi
9、x A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 LMD18200 2.4 amp, 55 volt H bridge 1.2.3 Device class
10、designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-3853
11、5, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X See figure 1 24 Dual in line 1.2.5 Lead finish. The lead finish is as spe
12、cified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92325 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISI
13、ON LEVEL C SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Total supply voltage at VCCpins 6 and 7 . 60 V Voltage at pins 3, 4, 5, 9, 10, 15, 16, 17, 21 and 22 12 V Voltage at bootstrap pins 1, 12, 13, and 24 . VOUT+ 16 V Peak output current (200 ms) 6 A Continuous output current . 2.
14、4 A Storage temperature range . -65C to +150C Power dissipation (PD) 2/ . 25 W Power dissipation (PD) (TA= +25 C, free air) . 3 W Lead temperature (soldering, 10 seconds) +300C Junction temperature (TJ) . +150C Thermal resistance, junction-to-case (JC) . 1.4C/W Thermal resistance, junction-to-ambien
15、t (JA) 40.5C/W still air 13C/W 500 LFPM air flow 1.4 Recommended operating conditions. Supply voltage (VCC) +12 V to +55 V Ambient operating temperature range (TA) . -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards,
16、and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPA
17、RTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these d
18、ocuments are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herei
19、n, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum level
20、s may degrade performance and affect reliability. 2/ The maximum power dissipation must be derated at elevated temperatures and is a function of TJ(max), JAand TA. The maximum allowable power dissipation at any temperature is Pd(max) = (TJ(max) - TA)/JA, or the number given in the Absolute maximum r
21、atings, whichever is lower. The normal thermal resistance from junction to case (JC) is 1.0C/W and from junction to ambient (JA) is 30C/W. For guaranteed operation TJ(max) = 125C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT
22、DRAWING SIZE A 5962-92325 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 as specified herein, or as modified in
23、 the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as
24、specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outline. The case outline shall b
25、e in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Logic diagram. The logic diagram shall be as specified on figure 3. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless ot
26、herwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified
27、 in table IIA. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitatio
28、ns, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-3853
29、5, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classe
30、s Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source o
31、f supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and here
32、in or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits
33、 delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DLA Land and Maritime -VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review
34、for device class M. For device class M, DLA Land and Maritime, DLA Land and Maritimes agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer.
35、3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 110 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRA
36、WING SIZE A 5962-92325 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TA +125C VS= 42 V Group A subgroups Device type Limits Unit unless otherwise specified Min Max Logic low
37、input voltage VIL1, 2, 3 01 -0.1 0.8 V Logic high input voltage VIH1, 2, 3 01 2 12 V Logic low input current IILVIN= -0.1 V 1, 2, 3 01 -10 A Logic high input current IIHVIN= 12 V 1, 2, 3 01 10 A Current sense output IOUTIOUT= 1 A 1 01 250 500 A sense 2, 3 225 525 Current sense linearity ILIN1 A IOUT
38、 2.4 A 1/ 1, 2, 3 01 -20 20 % Undervoltage lockout UVLO Outputs turn OFF 1, 2, 3 01 9 15 V Flag output leakage IFOFFVf= 12 V 1, 2, 3 01 10 A Quiescent supply current ISAll logic inputs low 1, 2, 3 01 25 mA Switch ON resistance RDSONOutput current = 2.4 A 2/ 1 01 0.6 2, 3 0.7 Clamp diode forward drop
39、 VCLAMPClamp current = 2.4 A 2/ 1, 2, 3 01 1.70 V 1/ Regulation is calculated relative to the current sense output value with a 1 A load. 2/ Output currents are pulsed ( tw 2 ms, duty cycle 5% ). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDA
40、RD MICROCIRCUIT DRAWING SIZE A 5962-92325 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 6 DSCC FORM 2234 APR 97 FIGURE 1. Case outline. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962
41、-92325 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 7 DSCC FORM 2234 APR 97 Symbol Dimensions Notes Inches Millimeters Min Max Min Max A - .210 - 5.33 b .015 .020 0.38 0.51 3 b2 .045 .055 1.14 1.40 5 C .008 .015 0.20 0.38 3 D - 1.230 - 31.24 7 E .585 .605 14.86 15.37 7 e .1
42、00 BSC 2.54 BSC eA .605 BSC 15.37 BSC L .125 - 3.18 - 9 Q .040 .060 1.02 1.52 10 Q1 .150 - 3.81 - S - .098 - 2.49 S1 - .005 - 0.13 11 S2 - .005 - 0.13 12 N 24 24 13 Note 1, 2 FIGURE 1. Case outline Continued. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from I
43、HS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92325 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 8 DSCC FORM 2234 APR 97 NOTES: 1. The U.S. Government preferred system of measurement is the metric S.I. system. However, since this item was originally designed using inch-p
44、ound units of measurement, in the event of conflict between the metric and inch-pound units, the inch-pound units shall take precedence. 2. Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded area shown. The manufacturers i
45、dentification shall not be used as a pin one identification mark. 3. The maximum limits of lead dimensions b and c or M shall be measured at the centroid of the finished lead surfaces, when solder dip or tin plate lead finish is applied. 4. Dimensions b1 and c1 apply to lead base metal only. Dimensi
46、ons M applies to lead plating and finish thickness. 5. The b2 minimum dimension of .045 inch (1.14 mm) was implemented 30 September 1992. Until that date, a minimum dimension of .038 (0.97 mm) was acceptable. 6. Corner lead (1, N, N/2) and N/2+1) may be configured as shown in detail A. For this conf
47、iguration dimension b3 replaces dimension b3 replaces dimension b2. 7. This dimension allows for off-center lid, meniscus, and glass overrun. 8. For configuration B, no organic or polymeric materials shall be molded to the bottom of the package to cover the leads. 9. Pointed or rounded lead tips as
48、shown in details B and C are preferred to ease insertion, but are not mandatory. 10. Measure dimension S1 at all four corners. 11. Measure dimension S2 from the top of the ceramic body to the nearest metallization or lead. 12. N is the maximum number of terminal positions. 13. Braze fillet shall be concave. The maximum dimensions of this fillet included solder dip or tin plate lead finish, if applied. FIGURE 1. Case outline Continued. Provided by IHSNot for ResaleNo reproduction or networking permitted without lice
