1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Redraw. Update drawing to current requirements. drw 09-06-18 Joseph Rodenbeck REV SHET REV SHET REV STATUS REV A A A A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY Marcia B. Kelleher DEFENSE SUPPLY CENTER COLUMB
2、US COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY Charles E. Besore APPROVED BY Michael A. Frye MICROCIRCUIT, LINEAR, PUSH PULL FOUR CHANNEL DRIVER, MONOLITHIC SI
3、LICON DRAWING APPROVAL DATE 93-02-26 AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-92350 SHEET 1 OF 12 DSCC FORM 2233 APR 97 5962-E350-09 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92350 DEFENSE
4、SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and
5、lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 92350 01 M X A Federal stock class designator RHA design
6、ator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designato
7、r. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type. The device type identifies the circuit function as follows: Device type Generic number Circuit fu
8、nction 01 L293D Push pull four channel driver 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, no
9、n-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline. The case outline is as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X See figure 1 16
10、 Dual-in-line 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92
11、350 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Collector supply voltage (VCC) 36.0 V dc Logic supply voltage (VSS) 36.0 V dc Input voltage (VIN) 7.0 V dc Inhibit voltage (VINH) . 7.0 V dc Peak output curren
12、t, non repetitive (IOUT) . 1.2 A Power dissipation (PD), at TGROUND-PINS, +125C 5 W Storage temperature range -65C to +150C Lead temperature (soldering, 10 seconds) . +300C Thermal resistance, junction-to-case (JC) . 5C/W max Thermal resistance, junction-to-ambient (JA) 65C/W Junction temperature (T
13、J) . +150C 1.4 Recommended operating conditions. Supply voltage range . 4.5 V dc to 24 V dc Ambient operating temperature range (TA) -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this
14、 drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-S
15、TD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at
16、http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes
17、precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affe
18、ct reliability. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92350 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requireme
19、nts. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein.
20、 The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-
21、38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Block diag
22、ram. The block diagram shall be as specified on figure 3. 3.2.4 Truth table. The truth table shall be as specified on figure 4. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirrad
23、iation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 M
24、arking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For R
25、HA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for devi
26、ce classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed ma
27、nufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitte
28、d to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate
29、of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notif
30、ication to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the
31、manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 53 (see MIL-
32、PRF-38535, appendix A).Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92350 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical perform
33、ance characteristics. Test Symbol Conditions -55C TA+125C Group A subgroups Device type Limits 1/ Unit VCC= 24 V, VSS= 5 V, unless otherwise specified Min Max Collector supply current ICCVIN= L, IOUT= 0 A, VINH= H 1, 2, 3 01 6 mA VIN= H, IOUT= 0 A, VINH= H 24 IN= L 4 Total quiescent logic supply cur
34、rent ISSVIN= L, IOUT= 0 A, VINH= H 1, 2, 3 01 60 mA VIN= H, IOUT= 0 A, VINH= H 22 IN= L 24 Input low voltage VIL1, 2, 3 01 -0.3 1.5 V Input high voltage VIHVSS 7 V 1, 2, 3 01 2.3 VSSV SS 7 V 2.3 7.0 Low voltage input current IILVIN= L 1, 2, 3 01 -10 A High voltage input current IIHVIN= H 1, 2, 3 01
35、100 A Inhibit low voltage VINHL1, 2, 3 01 -0.3 1.5 V Inhibit high voltage VINHHVSS7 V 2.3 6.5 Low voltage inhibit current IINHL1, 2, 3 01 -100 A High voltage inhibit current IINHH1, 2, 3 01 10 A Source output saturation voltage VCESATHIOUT= -0.6 A 1, 2, 3 01 1.8 V Sink output saturation voltage VCES
36、ATLIOUT= 0.6 A 1, 2, 3 01 1.8 V See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92350 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 6 DSCC FORM
37、 2234 APR 97 TABLE I. Electrical performance characteristics - continued. Test Symbol Conditions -55C TA+125C Group A subgroupsDevice type Limits 1/ Unit VCC= 24 V, VSS= 5 V, unless otherwise specified Min Max Clamp diode forward voltage VFIF= 0.6 A 1, 2, 3 01 1.7 V Rise time tr0.1 VOUTto 0.9 VOUT,
38、see figure 5 9, 10, 11 01 650 ns Fall time tf0.9 VOUTto 0.1 VOUT, see figure 5 9, 10, 11 01 920 ns Turn on delay ton0.5 VINto 0.5 VOUT, see figure 5 9, 10, 11 01 1700 ns Turn off delay toff0.5 VINto 0.5 VOUT, see figure 5 9, 10, 11 01 650 ns 1/ The algebraic convention, whereby the most negative val
39、ue is a minimum and the most positive a maximum, is used in this table. Negative current shall be defined as conventional current flow out of a device. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92350 DE
40、FENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 7 DSCC FORM 2234 APR 97 Symbol Inches Millimeters Min Max Min Max A 0.220 5.588 b1 0.048 0.075 1.219 1.905 b 0.044 0.053 1.118 1.346 C 0.008 0.015 0.203 0.381 D 0.840 21.34 e 0.100 BSC 2.540 BSC E1 0.291 0.321 7.391 8.153
41、E 0.220 0.310 5.588 7.874 L1 0.150 3.810 L 0.125 0.200 3.175 5.080 Q 0.015 0.060 0.381 1.524 S 0.080 2.032 S1 0.005 0.127 S2 0.005 0.127 NOTE: The U.S. government preferred system of measurement is the metric SI system. However, since this item was originally designed using inch-pound units of measu
42、rement, in the event of conflict between the metric and inch-pound units, the inch-pound units shall take precedence. FIGURE 1. Case outline X. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92350 DEFENSE SU
43、PPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 8 DSCC FORM 2234 APR 97 Device type 01 Case outline X Terminal number Terminal symbol 1 CHIP INHIBIT 1 2 INPUT 1 3 OUTPUT 1 4 GND 5 GND 6 OUTPUT 2 7 INPUT 2 8 VCC9 CHIP INHIBIT 2 10 INPUT 3 11 OUTPUT 3 12 GND 13 GND 14 OUTPUT 4 15
44、 INPUT 4 16 VSSFIGURE 2. Terminal connections. FIGURE 3. Block diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92350 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 9
45、DSCC FORM 2234 APR 97 INPUT (each channel) CHIP INHIBIT* OUTPUTn H H H L H L H L X* L L X* * Relative to the considered channel. * High output impedance. FIGURE 4. Truth table. FIGURE 5. Switching times. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-
46、,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92350 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 10 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-3
47、8535 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening.
48、For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The tes
