1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Change in accordance with notice of revision 5962-R073-94 -jak 93-12-30 Monica L. Poelking B Change in accordance with notice of revision 5962-R237-94 -tvn 94-07-14 Monica L. Poelking C Add bottom brazed flat pack to figure 1. Update the boilerpl
2、ate paragraphs in accordance with the latest MIL-PRF-38535 requirements. - jak 11-11-01 Thomas M. Hess REV SHEET REV C C C C C C C C C C C C C C C SHEET 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 REV STATUS REV C C C C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A P
3、REPARED BY Joseph A. Kerby DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY Thanh V. Nguyen APPROVED BY Monica L. Poelking MICROCIR
4、CUIT, DIGITAL, ADVANCED CMOS, SERIALLY CONTROLLED ACCESS NETWORK, D-TYPE FLIP-FLOP WITH THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON DRAWING APPROVAL DATE 93-11-24 AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 67268 5962-93207 SHEET 1 OF 29 DSCC FORM 2233 APR 97 5962-E525-11 Provided
5、by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93207 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance cla
6、ss levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is refl
7、ected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 93207 01 M X A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2) Device class designator Case outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designato
8、r. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indica
9、tes a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 SCAN18374T Serially controlled access network, D-type flip-flop with three-state outputs, TTL compatible inputs and outputs 1.2.3 Device class desig
10、nator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, ap
11、pendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X GDFP1-F56 or figure 1 56 Flat package 1.2.5 Lead finish. The lead finish is as
12、 specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93207 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 RE
13、VISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) -0.5 V dc to +7.0 V dc DC input voltage range (VIN) -0.5 V dc to VCC + 0.5 V dc DC output voltage range (VOUT) . -0.5 V dc to VCC+ 0.5 V dc DC input clamp current (IIK) (VIN= -0.5 V and VCC
14、+ 0.5 V) 20 mA DC output clamp current (IOK) (VOUT= -0.5 V and VCC+ 0.5 V) . 20 mA DC output current (IOUT) per output pin 70 mA DC VCCor GND current (ICC, IGND) 1330 mA 4/ Storage temperature range (TSTG) . -65C to +150C Maximum power dissipation (PD) . 750 mW Lead temperature (soldering, 10 second
15、s) +300C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 Junction temperature (TJ) +175C 1.4 Recommended operating conditions. 2/ 3/ Supply voltage range (VCC) +4.5 V dc to +5.5 V dc Input voltage range (VIN) +0.0 V dc to VCC Output voltage range (VOUT). +0.0 V dc to VCC Minimum high leve
16、l input voltage (VIH) . 2.0 V Maximum low level input voltage (VIL) - . 0.8 V Case operating temperature range (TC) . -55C to +125C Input edge rate (V/t) minimum: from VIN= 0.8 V to 2.0 V, 2.0 V to 0.8 V 125 mV/ns Maximum high level output current (IOH) . -24 mA Maximum low level output current (IOL
17、) . +48 mA _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. The maximum junction temperature may be exceeded for allowable short duration burn-in screening conditions in
18、accordance with method 5004 of MIL-STD-883. 2/ Unless otherwise noted, all voltages are referenced to GND. 3/ The limits for the parameters specified herein shall apply over the full specified VCCrange and case temperature range of -55C to +125C. 4/ This value represents the maximum total current fl
19、owing into or out of all VCCor GND pins. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93207 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCU
20、MENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEF
21、ENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - Lis
22、t of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Gover
23、nment publications. The following document(s) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. JEDEC SOLID STATE TECHNOLOGY ASSOCIATION (JEDEC) JESD-20 - Standard for Description of
24、 54/74ACXXXX and 54/74ACTXXXX Advanced High-Speed CMOS Devices. (Copies of these documents are available online at http:/www.jedec.org or from JEDEC Solid State Technology Association, 3103 North 10th Street, Suite 240S, Arlington, VA 22201.) INSTITUTE OF ELECTRICAL AND ELECTRONICS ENGINEERS (IEEE)
25、IEEE Standard 1149.1 - IEEE Standard Test Access Port and Boundary-Scan Architecture. (Copies of the IEEE documents can be found at the Institute of Electrical and Electronics Engineers web page at http:/www.ieee.org/ or from IEEE Service Center, 445 Hoes Lane, P.O. Box 1331, Piscataway, NJ 08855-13
26、31) 2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIRE
27、MENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or funct
28、ion as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be
29、as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1 . 3.2.2 Terminal connections. The terminal connections shall be as specifie
30、d on figure 2 . Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93207 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 5 DSCC FORM 2234 APR 97 3.2.3 Truth table(s). The truth table(s) sh
31、all be as specified on figure 3 . 3.2.4 Block or logic diagram(s). The block or logic diagram(s) shall be as specified on figure 4 . 3.2.5 Description of boundary-scan circuitry. The description of the boundary-scan circuitry shall be as specified on figure 5. 3.2.6 Ground bounce load circuit and wa
32、veforms. The ground bounce load circuit and waveforms shall be as specified on figure 6. 3.2.7 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 7. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless oth
33、erwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in
34、table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, t
35、he manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, ap
36、pendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q a
37、nd V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of sup
38、ply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or
39、 for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits deli
40、vered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DLA Land and Maritime -VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for d
41、evice class M. For device class M, DLA Land and Maritime, DLA Land and Maritimes agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10
42、Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 37 (see MIL-PRF-38535, appendix A). 3.11 IEEE 1149.1 compliance. This device shall be compliant with IEEE 1149.1. Provided by IHSNot for ResaleNo reproduction or net
43、working permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93207 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test and MIL-STD-883 method Symbol Conditions -55C TC +125C 2
44、/ 4.5 V VCC 5.5 V VCCGroup A subgroups Limits 3/ Unit unless otherwise specified Min Max High level output voltage 3006 VOHFor -all inputs affecting output under test VIH= 2.0 V or VIL= 0.8 V For all other inputs, VIN= VCCor GND IOH= -50 A 4.5 V 1, 2, 3 3.15 V 5.5 V 4.15 IOH= -24 mA 4.5 V 2.40 5.5 V
45、 2.40 IOH= -27 mA 4/ 5.5V 2.00 Low level output voltage 3007 VOLFor all inputs affecting output under test VIH= 2.0 V or VIL= 0.8 V For all other inputs, VIN= VCCor GND IOL= +50 A 4.5 V 1, 2, 3 0.10 V 5.5 V 0.10 IOL= +48 mA 4.5 V 0.55 5.5 V 0.55 IOL= +63 mA 4/ 5.5V 0.80 Positive input clamp voltage
46、3022 VIC+ For input under test IIN= +18 mA 5.5 V 1, 2, 3 5.7 V Negative input clamp Voltage 3022 VIC- For input under test IIN= -18 mA 5.5 V 1, 2, 3 -1.2 V Three state leakage current high 3021 IOZH5/ AOEor BOE= 2.0 V For all other inputs, VIN= VCCor GND VOUT= 4.5 V 4.5 V 1 +0.5 A 2, 3 +10.0 5.5V 1
47、+0.5 A 2, 3 +10.0 Three state leakage current low 3020 IOZL5/ AOEor BOE= 2.0 V For all other inputs, VIN= VCCor GND VOUT= GND 4.5 V 1 -0.5 A 2, 3 -10.0 5.5V 1 -0.5 A 2, 3 -10.0 Input current high 3010 IIHFor input under test VIN= VCCFor all other inputs, VIN= VCCor GND TDI, TMS inputs 5.5 V 1 2.8 A
48、2, 3 3.7 All other inputs 1 0.1 2, 3 1.0 Input current low 3009 IILFor input under test VIN= GND For all other inputs, VIN= VCCor GND TDI, TMS inputs 5.5 V 1, 2, 3 -160 -385 A All other inputs 1 -0.1 2, 3 -1.0 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93207 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test and MIL-STD-883 m
