1、SMD-5762-732bO REV B = 9999996 0066948 49T DEFENSE LOGISTICS AGENCY DEFENSE ELECTRONICS SUPPLY CENTER 1507 WILMINGTON PIKE DAYTON, OH 45444-5765 IN REPLY REFERTO: DESC-ELDC (Mr. Gauder/ (AV 986) 513-296-8526/1tg SUBJECT: Notice of Revision (NOR) 5962-R079-96 Drawing (SMD) 5962-93260. APR 16 l%6 Eor
2、Standard Microcircuit Military/Industry Distribution The enclosed NOR is approved for use effective as of the date of the NOR. In accordance with MIL-STD-100 SMD holders should, as a minimum, handwrite those changes described in the NOR to sheet 1 of the subject SMD. After completion, the NOR should
3、 be attached to the subject CMD for future reference. Those companies who were listed as approved sources of supply prior to this action have agreed to actions taken on devices for which they had previously provided DESC a certificate of compliance. This is evidenced by an existing active current ce
4、rtificate of compliance on file at DESC along with a DESC record of verbal coordination. The certificate of compliance for these devices is considered concurrence with the new revision unless DESC is otherwise notified. DESC has received and accepted a certificate of compliance from Logic Devices, c
5、age code 65896, for PIN 5962-9326001MYX and vendor similar part number LF2250GMB25. This action will be reflected in the next revision of MIL-HDBK-103 If you have comments or questions, please contact Larry T. Gauder at (AV)986-8526 / (513) 296-8526. 1 Encl MONICA L. POELKING Chief, Custom Microelec
6、tronics Branch Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-5762-93260 REV B 9999996 0086949 32b NOTICE OF REVISION (NOR) This revision described below has been authorized for the docmnt listed. I. DATE (Y YMMDD ) 96 - 03 - 22 the time for rev
7、iewing instructions, searching existing data.sourEes, gathering and maintaining the data needed, and ccinp eting and reviewing the collection of information. Se- c-nts regarding this burden estimate or an including suggestions for reducing this burden yo De artment of Defense Washingtion Headquartek
8、 Services Directorate for information Operatiots,and Fe rrts 1215 Jeffekon Davis Highway Suite 1204 Arl/n ton VA 22202-4302, and to the Office of ana hnt and Budget Washington DC 20503. ACTIVITY NUMBER LISTED IN ITEM 2 OF THIS FORM. other aspect of this collection of information Paperwork Reduction
9、Proct (07 add W. Revisions description colurn; add “Changes in accordance with NOR 5962-R079-96ka Revisions date colum; add 1196-03-2211. Revision level block; add IiBli. Rev status of sheets; For sheets 1, 2, and 8 add I1Bii. Sheet 2: 1.2.4 Case out lins. Add the following: Outline Letter “Y Descri
10、otive desisnator Termi na Is Packase stvle CMGA17-PI21 121 pin grid array“ Revision level block; add iiBii. Sheet 8: FIGURE 1. Terminal connections. Change from case outline “X“ to case outline “X, YIi, five places. Revision level block; add ilB1u. Provided by IHSNot for ResaleNo reproduction or net
11、working permitted without license from IHS-,-,-SMD-59B2-932bO REV A b 0085541 514 DEFENSE LOGISTICS AGENCY DEFENSE ELECTRONICS SUPPLY CENTER 1507 WILMINGTON PIKE DAYTON, OH 45444-5765 IN REPLY REFERTO: DESC-ELDC (Mr. Gauder/ (AV 986) 513-296-8526/1tg) MAR G 7 3% SUBJECT: Notice of Revision (NOR) 596
12、2-R063-96 for Standard Microcircuit Drawing (SMD) 5962-93260. Military/ndustry Distribution The enclosed NOR is approved for i se effective as of the date of he NOR. In accordance with MIL-STD-100 SMD holders should, as a minimum, handwrite those changes described in the NOR to sheet 1 of the subjec
13、t SMD. After completion, the NOR should be attached to the subject SMD for future reference. Those companies who were listed as approved sources of supply prior to this action have agreed to actions taken on devices for which they had previously provided DESC a certificate of compliance. This is evi
14、denced by an existing active current certificate of compliance on file at DESC along with a DESC record of verbal coordination. The certificate of compliance for these devices is considered concurrence with the new revision unless DESC is otherwise notified. If you have comments or questions, please
15、 contact Larry T. Gauder at (AV)986-8526 / (513) 296-8526. 1 Encl Chief, Custom Microelectronics Branch Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-I. DATE (YYMMDD) 96-02-15 NOTICE OF REVISION (NOR) This revision described below has been authoriz
16、ed for the document listed. Public reporting.burden.for this collection.is estieted to average 2 hours per response jncluding the time for reviewing instructions, searching existipg data-sources, gathering and mainfaining the data needed and comp eting and reviewing the collection of information. Se
17、nd comnents regarding this burdenestimate or an other aspect of this collection of information including suggestions for reducing this burden !o De artment of Defense Washingtion Headquarteh Services Directorate for Information Operatioh and !e Orts 1215 Jeffekon Davis Highway, Sujte 1204, Arlin ton
18、 VA 22202-4302, and to the Office of Rana bent and Bud et Paperwork Reduction Pro ect (07!4-0!88), Washington DC 20503. RETURN COMPLETED FORM TO THE GOVERNMENT ISSUING CONTRACTING OFFICER FOR THE CONTRACT/ PROCURiNG ACTIVITY NUMBER LISTED IN ITEM 2 OF THIS FORM. PLEASE DO NOT 8ETURN YOUR CdPLtTED FO
19、RM TO EITHER OF THkE ADDRESSED b. ADDRESS (Street, City, State, Zip Code) 6. NOR NO. 7. CAGE CODE 8. DOCUMENT NO. 67268 5962-93260 4. ORIGINATOR Defense Electronics Supply Center 1507 Wilmington Pike Dayton, OH 45444-5765 a. TYPED MAME (First, Middle Initial, Last) Form Approved OMB No. 0704-0188 2.
20、 PROCURING ACTIVITY NO. 3. DODAAC 9. TITLE OF DOCUMENT I 10. REVISION LETTER I 11. ECP NO. a. CURRENT Initial MICROCIRCUIT, DIGITAL, CMOS, 12 X 10-BIT MATRIX MULTIPLIER, MONOLITHIC SILICON b. NEU A _ - 12. CONFIGURATION ITEM (OR SYSTEM) TO WHICH ECP APPLIES Al l 13. DESCRIPTION OF REVISION Sheet 1:
21、Revisions ltr column; add ItAa1. Revisions description column; add “Changes in accordance with NOR 5962-R063-96I1 Revisions date column; add 1i96-02-1511. Revision level block; add I1At1. Rev status of sheets; For sheets 1 and 6 add I1At1. Sheet 6: TABLE I: NOR continued on next page. 3. (X one) X (
22、1) Existing document supplemented by the NOR may be used in manufacture. (2) Revised document must be received before manufacturer may incorporate this change. (3) Custodian of master document shall make above revision and furnish revised document. J. ACTIVITY AUTHORIZED TO APPROVE CHANGE FOR GOVERN
23、MENT DESC - E LDC DD Form 1695, APR 92 Previous editions are obsolete c. TYPED NAME (First, Middle Initial, Last) Monica L. Poelking d. TITLE Chief, Custom Microelectronics 15a. ACTIVITY ACCOMPLISHING REVISION e. SIGNATURE f. DATE SIGNED ( YYMMDD ) Monica L. Poelking 96-02-15 C. DATE SIGNED b. REVIS
24、ION COMPLETED (Signature) DESC-ELDC (YYMMDD) Larry T. Gauder 96-02-15 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-13. DESCRIPTION OF REVISION - CONTINUED Sheet 6: TABLE I: Delete the following: Condi ti om -55C TC 5 +125“C unless otherwise specif
25、ied DU Docunent No.: 5962-93260 Revision: A Sheet: 2 of 2 NOR NO: 5962-R063-96 Units Device Group A Limits type subgroups Min Max Al l 9, 10, 11 O ns I II I Device type Al l II Units Group A Limits subgroups 9, IO, 11 2 ns Min Max Substitute the following: Conditions -55C 5 TC 5 +125“C unless otherw
26、ise specified Revision level block; add lEA8l I SMD-5962-73260 REV A = b 00855Li3 397 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-JUL 91 DISTRIBUTION STATEMENT A. Approved for pub1 ic release: distribution is un1 imited. LTR 5962-E357-94 DESCRI P
27、TION DATE (YR-MO-DA) APPROVED SMD-59b2-932bO m 9999996 00b3148 bb4 m REV SHEET I- -.- - - REVISIONS - 15 16 17 18 19 20 21 REV STATUS OF SHEETS REV SHEET 12 3 4 5 6 7 8 9 10 11 12 1314 PMIC N/A STANDARD1 ZED MILITARY PREPARED BY I Thomas M. Hess DAYTON, OHIO 45444 CHECKED BY Thorns M. Hess I DEFENSE
28、 ELECTRONICS SUPPLY CENTER DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS ANO AGENCIES OF THE DEPARTMENT OF DEFENSE MICROCIRC CIRCUIT, DIGITAL, CMOS, 12 X 10-BIT MATRIX MULTIPLIER, MONOLITHIC APPROVED BY Monica Delking DRAWING APPROVAL DATE SILICON 94-07-27 I I REVISION LEVEL AMSC NIA
29、SIZE CAGE CODE 5962-93260 A 67268 SHEET 1 OF 21 ESC FORM 193 I I Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-1.2.2 Device tmesl. The device type(s) shall identify the circuit function as follows: Device class Device requirements documentation M V
30、endor self-certification to the requirements for non-JAN class E microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-1-38535 1.2.4 Case outline(s1. The case outline(s) shall be as designated in MIL-STD-1835 and as follows: Out1 ine letter Descriptive d
31、es iana tor Termi na 1 s Packaqe style X CMGA3-Pl21 121 Pin grid array 1.2.5 Lead finish. The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-1-38535 for classes Q and V. Finish letter “X” shall not be marked on the microcircuit or its packaging. The “X” designat
32、ion is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference . 5962-93260 REVISION LEVEL SHEET STANDARDIZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 DESC FORM 193A JUL 91 Provided by IHSNot for ResaleNo
33、reproduction or networking permitted without license from IHS-,-,-SMD-59b2-932bO m 9999996 0063250 222 I-1 I 1.3 Absolute maximum ratinqs. l/z/J/s/ Storage temperature range . Vcc supply voltage with respect to ground range Input signal with respect to ground range . Signal applied to high impedance
34、 output range . Output current into low outputs Latch-up current . Power dissipation Lead temperature (soldering. 10 seconds) . Junction tenperature (TJ) . Thermal resistance, junction-to-case (JC) . . -65C to +15OoC -0.5 V dC to t7.0 V dc -0.5 V dc to VCC + 0.5 V dC -0.5 V dc to Vcc + 0.5 V dc 25 K
35、A 400 mA 1.67 U 300C 175C See MIL-STO-1835 1.4 Recomnended operatinq conditions. Supply voltage range . Operating ambient temperature range 1.5 Diqital loqic testinq for device classes Q and V. 4.50 V dc I Vcc I 5.50 V dc -55C to +125“C Fault coverage measurement of manufacturing logic tests (MIL-ST
36、O-883, test method 5012) XX percent 51 2. APPLICABLE DOCUMENTS I 2.1 Government specification, standards, bulletin, and handbook. Unless otherwise specified, the following specification, standards, bulletin, and handbook of the issue listed in that issue of the Department of Defense Index of Specifi
37、cations and Standards specified in the solicitation, form a part of this drawing to the extent specified herein. SPEC 1 F I CAT I ON MILITARY MIL-1-38535 - Integrated Circuits, Manufacturing, General Specification far. STANDARDS MILITARY MIL-STD-883 - Test Methods and Procedures for Microelectronics
38、, MIL-STO-973 - Configuration Management. MIL-STD-1835 - Microcircuit Case Outlines. BULLETIN MILITARY MIL-BUL-103 - List of Standardized Military Drawings (SMDs). - i/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may d
39、egrade performance and affect re1 iability. 21 Maximum rating indicate stress specification only. Functional operation of these products at values beyond those indicated in operation condition table is not implied. periods may affect reliability. - 3/ The products described by this specification inc
40、lude internal circuitry designed to protect the chip from damaging substrate injection currents and accumulations of static charge. should be observed during storage, handling, and use of these circuits in order to avoid exposure to excessive electrical stress values. - 41 This devices provides hard
41、 clamping of transient undershoot and overshoot. Input levels below ground or above Vcc will be clamped beginning at -0.6 V and Vcc +0.6 V. inputs in the range of -0.5 V to +7.0 V. Devices operation will not be adversely affected, however, input current levels will be well in excess of 100 m4. - 51
42、Values will be added when they become available. Exposure to maximum rating conditions for extended Nevertheless, convention precautions The devices can withstand indefinite operation with 5962-93260 REVISION LEVEL SHEET STANDARDIZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45
43、444 DESC FORM 193A JUL 91 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-HANDBOOK STANDARD1 SED SIZE MILITARY DRAWING A DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 REVISION LEVEL MILITARY 5962-93260 SHEET 4 MIL-HDBK-780 - Standardized Milit
44、ary Drawings. (Copies of the specification, standards, bulletin, and handbook required by manufacturers in camection with specific acquisition functions should be obtained from the contracting activity or as directed by the contracting activity.) 2.2 Order of orecedence. In the event of a conflict b
45、etween the text of this drawing and the references cited herein, the text of this drawing shall take precedence. 3. REQUIREMENTS Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SID-5962-932bO m 9999996 0063352 095 m SIZE STANDARD1 ZED DEFENSE ELECTRO
46、NICS SUPPLY CENTER MILITARY DRAWING A DAYTON, OHIO 45444 REVISION LEVEL 3.8 Notification of change for device class M. For device class M, notification to DESC-EC of change of product :see 6.2 herein) involving devices acquired to this drauing is required for any change as defined in MIL-STD-PZ. 3.9
47、 Verification and revieu for device class M. For device class M, DESC, DESCs agent, and the acquiring activity Offshore docmentation -etain the option to revieu the manufacturers facility and applicable required docmentation. shall be made available onshore at the option of the reviewer. 3.10 Microc
48、ircuit group assignment for device class M. nicrocircuit group nunber 105 (see MIL-I-38535, appendix A). Device class M devices covered by this drawing shall be in 4. QUALITY ASSURANCE PROVISIONS 4.1 Sawling and inswction. For device class M, sanpling and inspection procedures shail be in accordance
49、 uith For device classes a and V, sanpiing and inspection procedures shall be in accordance *IL-STO-883 (see 3.1 herein). dith MIL-1-38535 and the device manufacturers M pian. 4.2 Screening. For device class M, screening shall be in accordance uith method 5004 of MIL-STD-883, and shall be zonducted on all devices prior to quality conformance inspection. For devi
