1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add “TJ= +25C” to the conditions column under the TEAtest as specified under Table I. Changes in accordance with NOR 5962-R277-94. 94-09-23 M. A. FRYE B Replace reference to MIL-STD-973 with reference with MIL-PRF-38535. Redrawn. - ro 09-01-27 R.
2、 HEBER REV SHET REV SHET REV STATUS REV B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY MARCIA B. KELLEHER CHECKED BY RAJESH PITHADIA DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil APPROVED BY MICHAEL A. FRYE STANDARD MICROCIRCUIT D
3、RAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 94-07-26 MICROCIRCUIT, LINEAR, VOLTAGE REGULATOR, SWITCHING, MONOLITHIC SILICON AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-94576 SHEET 1 OF 11 DSCC FORM 2233 APR 97
4、5962-E066-09 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94576 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing docu
5、ments two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness
6、 Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 94576 01 Q Y A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawi
7、ng number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA
8、designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 LT1074 5 A step down switching regulator 02 LT1074HV 5 A step down switching regulator 1.2.3 Device class designator. T
9、he device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A
10、 Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style Y See figure 1 4 TO-3 flange mount style 1.2.5 Lead finish. The lead finish is as specif
11、ied in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94576 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990
12、REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Supply voltage (VIN): Device type 01 . 45 V dc Device type 02 . 64 V dc Switch output voltage (VSW) : With respect to input voltage, device type 01 64 V dc With respect to input voltage, device type 02 75 V dc With respe
13、ct to GND pin, device type 01 . 35 V dc 2/ With respect to GND pin, device type 02 . 45 V dc 2/ Feedback pin voltage (VFB) . -2 V dc, +10 V dc Junction temperature (TJ) +150C Storage temperature range -65C to +150C Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (
14、JC) 2.5C/W Thermal resistance, junction-to-ambient (JA) . 35C/W 1.4 Recommended operating conditions. 1/ 2/ Supply voltage (VIN) range: Device type 01 . 8.0 V dc to 40 V dc Device type 02 . 8.0 V dc to 60 V dc Ambient operating temperature range (TA) . -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Gover
15、nment specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICAT
16、ION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard M
17、icrocircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In t
18、he event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. _ 1/ Stresses above the absolute maximum ra
19、ting may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Switch to input voltage limitation must be observed. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD M
20、ICROCIRCUIT DRAWING SIZE A 5962-94576 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified
21、herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class
22、 level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outline.
23、The case outline shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performan
24、ce characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full junction operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgr
25、oup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN is not feasible due to space limitations, the manufacturer has the option of not marking the “5
26、962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The c
27、ertification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required
28、from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certific
29、ate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A an
30、d herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M.
31、 For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain
32、 the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit
33、 group number 52 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94576 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97
34、TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TJ+125C Group A subgroups Device type Limits Unit VIN= 25 V unless otherwise specified Min Max Minimum supply voltage VCCNormal mode 1,2,3 All 8.0 V Startup mode 1/ 1,2 4.8 3 5.0 Error amplifier transconductance TEATJ= +25C
35、 4 All 3700 8000 mho Error amplifier, source and sink current IEASVFB= +2.0 V, TJ= +25C, source 1 All 100 225 A VFB= +2.5 V, TJ= +25C, sink 700 1600 Error amplifier voltage 2/ gain AEA1 V VC 4 V, TJ= +25 4 All 800 V/V Supply current ISVIN 40 V, VFB= 2.5 V 3/ 1,2,3 All 11 mA 40 V VIN 60 V 3/ 12 Feedb
36、ack pin bias current IFBVFB= VREF1,2,3 All 2.0 A Reference voltage VREFVC= 2.0 V 1,2,3 All 2.155 2.265 V Reference voltage line regulation VREFLR8.0 V VIN VMAX4/ 1,2,3 All 0.02 %/V Switch “On” voltage 5/ VSWONISW= 1 A 1,2 All 1.85 V 3 2.10 ISW= 5 A 1,2 2.30 3 2.50 Switch current limit ISW6/ 1,2,3 Al
37、l 5.5 8.5 A Maximum duty cycle DCMAX4,5,6 All 85 % Switching frequency line regulation VSWLR8.0 V VIN VMAX4/ 4,5,6 All 0.1 %/V See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94
38、576 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions -55C TJ+125C Group A subgroups Device type Limits Unit VIN= 25 V unless otherwise specified Min Max Switching
39、frequency f 4 All 90 110 kHz 5 85 125 6 85 120 Switch “OFF” leakage current ISWOFFVIN= 25 V, TJ= +25C 1 All 300 A VIN= MAX, TJ= +25C 4/ 500 VCvoltage at 0% duty cycle VVC1 All 1.0 2.0 V 2,3 0.4 2.6 1/ Total voltage from the VINpin to the GROUND pin must be 8 V after startup for proper regulation. 2/
40、 Switch to input voltage limitation must also be observed. 3/ A feedback pin voltage VFBof +2.5 V forces the VCpin to its low clamp level and the switch duty cycle to zero. This approximates the zero load condition where duty cycle approaches zero. 4/ VMAX= 40 V for device type 01. VMAX= 60 V for de
41、vice type 02. 5/ To calculate maximum switch “on” voltage at currents between low and high conditions, a linear interpolation may be used. 6/ Switch frequency is internally scaled down when the feedback pin voltage is less than 1.3 V to avoid extremely short switch on times. During testing, VFBis ad
42、justed to give a minimum switch on time of 1 s. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94576 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 Ca
43、se Y Dimensions Symbol Inches Millimeters Min Max Min Max A .320 .350 8.128 8.890 b .038 .043 .965 1.092 D .760 .775 19.30 19.69 F .060 .135 1.52 3.43 L .420 .480 10.67 12.19 P .151 .162 3.84 4.114 q 1.177 1.197 29.90 30.40 R .495 .525 12.57 13.34 R1 .167 .177 4.241 4.495 s .655 .675 16.44 17.15 NOT
44、E: 1. The U.S. government preferred system of measurement is the metric SI system. However, since this item was originally designed using inch pound units of measurement, in the event of conflict between the metric and inch pound units, the inch pound units shall take precedence. FIGURE 1. Case outl
45、ine. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94576 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 8 DSCC FORM 2234 APR 97 Device types 01 and 02 Case outline Y Termina
46、l number Terminal symbol 1 VC2 VIN3 VSW4 FEEDBACK Case GROUND FIGURE 2. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94576 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REV
47、ISION LEVEL B SHEET 9 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan s
48、hall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior
