1、LTR A MICROCIR( DESCRIPTION DATE (YR-M-DA) APPROVED Added Case outline Z. Redrew entire document. 95-10- 12 K.A. Cottongim MICROCIRCUIT, DIGITAL, FLASH ERASABLE/PROGRAMMABLE READ ONLY MEMORY, APPROVED BY 1024K X 32-BIT, HYBRID DRAWING . THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCI
2、ES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 95-03-09 I I AMSC N/A REVISION LEVEL A 5962-9461 3 SIZE CAGE CODE A 67268 I SHEET 1 OF 23 I I DESC FORM 193 JUL 94 DISTRIBUTION STATEMENT A Approved for public release distribution is unlimited 5962-E308-95 Provided by IHSNot for ResaleNo reprodu
3、ction or networking permitted without license from IHS-,-,-SMD-5962-9YbL3 REV A m 9999996 OOOOLL 7Lb m . The lead finish shall be as specified in WIL-H-38534 for classes H and K. Finish letter ooXoo 1.2.5 shall not be marked on the microcircuit or its packaging. finishes A, B, and C are considered a
4、cceptable and interchangeable without preference. The “X8t designation is for use in specifications when lead SIZE A 5962-9461 3 STANDARD MICROCIRCUIT DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 REVISION LEVEL SHEET A 2 tandards specified in the solicitation, form a part of this dra
5、uing to the extent specified herein. SPECIFICATION MILITARY MIL-H-38534 - Hybrid Microcircuits, General Specification for. STANDARDS MILITARY MIL-STD-883 - Test Methods and Procedures for Microelectronics. MIL-STD-973 - Configuration Management. MIL-STD-1835 - Microcircuit Case Outlines. HANDBOOK Mi
6、 LITARY MIL-HDBK-780 - Standardized Military Drawings. (Copies of the specification, standards, and handbook required by manufacturers in connection with specific tcquisition functions should be obtained from the contracting activity or as directed by the contracting activity.) 2.2 Orde r of orecede
7、nce. In the event of a conflict between the text of this drawing snd the references cited ierein, the text of this drawing shall take precedence. L/ Stresses above the absolute maxim rating may cause permanent damage to the device. maxim levels may degrade performance and affect reliability. Minimm
8、DC voltage is -0.5 V on input/output pins. periods ESC FORM 193A JUL 94 See footnotes at top of next page. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-59b2-94bL3 REV A W 9999996 OOBOOLB 070 W - continued. TABLE I. aectricai wrformance rnacter
9、istics -. Unless otherwise specified, 4.5 V i Vcc i 5.5 V and Vss = O V. Unless otherwise specified the DC test conditions are as follows: Input pulse levels: V Unless otherwise spec!iLVike AC test condfkions are as follows: Input pulse levels: VIL = O V and VIH = 3.0 V. input rise and fall times: I
10、nput and output timing reference levels: 1.5 V. Block erasebyte writes are inhibited uhen Vpp = VppL and not guaranteed in the range between VppH and VppL. Parameters shall be tested as part of device initial characterization and after any design or process changes which may affect these parameters.
11、 Parameters shall be guaranteed to the limits specified in table I for all lots not specif ical ly tested. - 0.3 V and V = 0.3 V. 5 nanoseconds. may be delayed up to tCE - tm after the falling edge of CS without inpact on tCE Chip-sdect controlled writes: where CS defines the write pulse width (wahi
12、n a longer WE timing waveform), all setup, hold and inactive E times should be measured relative to the CS waveform. Write operations are driEn by the valid combination of CS and . In sys- STANDARD MICROCIRCUIT DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 DESC FORM 193A JUL 94 A I 59
13、62-9461 3 I I SHEET 9 REVISION LEVEL A Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-i D3/E3 STAN DARD MICROCIRCUIT DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 0bl 4 PLS PIN 56- SIZE A 5962-9461 3 REVISION LEVEL SHEET 4 F LmplN 66
14、PIN 66 /- _iEE Tk El E - PIN 11 b2 65 PLS SEATING BASE PLANE PLANE 9 , I 1 1 10 A DESC FORM 193A JUL 94 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-Case outlines X, Y - continued s-1 A Al Millimeters Inches Min Max Min Max 5.33 6.22 0.210 o. 245
15、0.66 0.89 O. 025 0.035 e F L 2. Pin 1 is identified by 0.070 square pad. 3. Pin nunbers are for reference only. 4. For solder lead finish, +b will increase by .O03 inches (.O08 mn). - .loo BSC 2.54 ESC 1.14 1.40 0.045 O. O55 3.68 3.94 0.145 0.155 FIGURE 1. Case outine(Q - Continued. DEFENSEELECTRONI
16、CSSUPPLYCENTER DAYTON, OHIO 45444 REVISION LEVEL A STANDARD MICROCIRCUIT DRAWING SHEET 11 1 5962-94613 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-5962-946L3 REV A H 9999996 008002L bb5 H Case 2 Al BASE AND SEATING PLANE A2 C FIGURE 1. Case o
17、utlinetsi - Continued. STAN DARD MICROCIRCUiT DRAWING 1 5962-94613 DEFENSEELECTRONICSSUPPLYCENTER I I DAYTON, OHIO 45444 REVISION LEVEL SHEET I I 1 I 12 A DESC FORM 193A JUL 94 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-Case outline 2 - continue
18、d Dl/El k 1 39.24 40.01 1.545 1.575 37.72 38.48 1.485 1.515 4.83 5.33 0.190 0.210 e el I I I s1 9.65 ESC 0.380 BSC I 1.27 ESC .O50 BSC 20.32 BSC 0.800 ESC OTES: 1. The U.S. preferred system of measurement is the metric SI. measurement. units shall rule. Pin nbrs a;e for reference only. This item uac
19、 designed using inch-pound units of In case of problems involving conflicts betueen the metric and inch-pound units, the inch-pound 2. 3. For solder lead finish, b uiii increase by .O03 inches (.O08 mn). SIZE A STANDARD MICROCIRCUIT DRAWING FIGURE 1. Case outlinetsi - Continued. 5962-9461 3 DEFENSEE
20、LECTRONICSSUPPLYCENTER DAYTON, OHIO 45444 I REVISION LEVEL SHEET A 13 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-Dwice tVpe Case out 1 ine Temi na 1 nunber 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 Al 1 I /o8 I /o9 I /o1 o A14 A16
21、 Al 1 AO A18 I /o0 I /o1 I /o2 - RP cs2 GND 1 /o1 1 A10 A9 A15 - “cc - cs1 A19 i /O3 i GURE Devi ce type Case outline Terminal nunber 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 AL 1 X Temi na 1 synibol I /O1 5 /O14 i /O1 3 I/012 OE Al 7 WE I /O7 I /o6 I /O5 I /o4 I /o24 I /O25
22、 I /O26 - - A7 A12 VPP A13 A8 1/016 /O17 1/018 Device type Case outline Terminal nrakr 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 Al X Teminal Syniboi vcc - CS4 NC i /O27 A4 A5 A6 NC cs3 GND I/019 I/031 I /O30 I /O29 I /O28 - Al A2 A3 I /O23 I /o22 I /o21 I /o20 .-.rminai conn
23、ections (industry D i nout c L. STANDARD MICROCIRCUIT DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON. OHIO 45444 SIZE A I I 5962-94613 I SHEET14 REVISION LEVEL A I I I I DESC FORM 193A JUL 94 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-Devi ce
24、tvpe Cess out 1 ine Terminal mrnber STAN DARD MICROCIRCUIT DRAWING DEFENSEELECTRONICSSUPPLYCENTER DAYTON, OHIO 45444 1 2 3 4 5 6 7 a 9 10 11 12 13 14 15 16 17 18 19 20 21 22 SIZE A 5962-9461 3 REVISION LEVEL SHEET A 15 Y 1/08 1/09 I /o1 o A13 A14 A15 A16 Al 7 I /o0 I /o1 I /o2 RP cs2 GND - - I/011 A
25、10 Al 1 A12 VCC - cs1 A19 I /O3 Device type Case outline Terminai nunber 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 3a 39 40 41 42 43 44 Al 1 Y Terminal SvnaOi 1/015 1/014 I/013 1/012 OE - Aia - WE I /O7 I /o6 I /O5 I /o4 I /O24 I /O25 I /O26 A6 A7 VPP A8 A9 1/016 1/017 I/018 Devi ce type Case out
26、line Terminal mmber 45 46 47 4a 49 50 51 52 53 54 55 56 57 sa 59 60 61 62 63 64 65 66 Al 1 Y “CC - CS4 NC I /O27 A3 A4 A5 NC cs3 GND I/019 1/031 I /O30 I /O29 I /O28 AO Al A2 I /O23 I /o22 1/021 I /o20 - FIGURE 2. Terminal connections (alternate Di noutsr - Continued. Provided by IHSNot for ResaleNo
27、 reproduction or networking permitted without license from IHS-,-,-Devi ce type Case outline Terminal nunber 1 2 3 4 5 6 7 a 9 10 11 12 13 14 15 16 17 ia 19 20 21 22 23 24 Al 1 z Termina symbol GND cs/1 A5 A4 A3 A2 Al AO N/C I /o0 1/01 I /o2 I /O3 I /O4 I /O5 I /ob I /O7 GND - I /o8 I /o9 I /o1 o 1/
28、011 1/012 If013 Device type Case outline Termina minber 25 26 27 2a 29 30 31 32 33 34 35 36 37 38 39 40 41 42 03 44 45 46 47 48 Al 1 z Termina Symbol 1/014 I/015 “cc Al 1 A12 A13 A14 A15 A16 cs2 OE cs4 A17 A18 A19 N/C N/C RP - - - - “PP I/031 I /O30 I /O29 I 1028 1 /O27 Device type Case outline Term
29、inal nunber 49 50 51 52 53 54 55 56 57 sa 59 60 61 62 63 64 65 66 67 68 FIGURE 2. -minal connections - continued. Al 1 z Terminal 5-1 I /O26 I /O25 I /o24 GND I /O23 I /o22 1/021 I /o20 1/019 uoia I /O1 7 1/016 “cc A10 A9 A8 A7 A6 WE c53 - - JUL 94 Provided by IHSNot for ResaleNo reproduction or net
30、working permitted without license from IHS-,-,-SMD-5962-94613 REV A 9999996 0080026 147 = Mode - - - - RP CS OE UE AD Vpp 1/00-31 NOTES: Read Output disable IH IL IL IH X DUJT 1.2 VIH VIL VIH VIH X X High 2 Standby DeepPouerDom AOORESS ADDRESSES STABLE I 1H IH X X X High 2 VIL X X X X X High 2 - cs
31、- OE - U OUTPUTS Urite I IH I IL I IH I IL I I X I DIN FIGURE 4. Read cvcle timinq diasram. I SIZE I I 3 STANDARD MICROCIRCUIT DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 IA I REVISION LEVEL SHEET A 17 I 5962-94613 DESC FORM 193A JUL 94 Provided by IHSNot for ResaleNo reproduction o
32、r networking permitted without license from IHS-,-,-ADDRESS AIN )d: AIN I - WE - DEFENSEELECTRONICSSUPPLYCENTER DAYTON, OHIO 45444 PP REVISION LEVEL SHEET A 18 ADDRESS AIN Q AIN I HIGH Z VALID SRD DATA DS - FIGURE 6. grite ow rations - WE controlled. I STANDARD MICROCIRCUIT DRAWING 1 5962-94613 Prov
33、ided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STAN DARD MICROCIRCUIT DRAWING DEFENSE ELECTRONICSSUPPLYCENTER DAYTON, OHIO 45444 SIZE 5962-9461 3 A REVISION LEVEL SHEET A 19 Provided by IHSNot for ResaleNo reproduction or networking permitted without li
34、cense from IHS-,-,-SMD-5962-9VbL3 REV A W 9979996 0080029 956 UNDER TEST CURRENT SOURCE BIPOLAR SUPPLY1 SIZE A STANDARD MICROCIRCUIT DRA WING tes: 1. Vz is programrhble from -2 V to +7.0 V. 2. IoL and.IoH ar programble from O to 16 mA. 3. Tester inpeance (Zo).= 75 ohms. 4. Vz is typically the midpoi
35、nt of VOH and VOL. 5. I 6. A?t! tester includes jig capacitance. and IOH.are adjusted to simlnte a typical resistive lead circuit. 5962-9461 3 DEFENSEELECTRONICSSUPPLYCENTER DAYTON, OHIO 45444 REVISION LEVEL SHEET A 20 Provided by IHSNot for ResaleNo reproduction or networking permitted without lice
36、nse from IHS-,-,-c MIL-il-38534 test requirements TABLE II. mical test m. S*rolps (in accordance with nu-H-38534, group A test table) Final electrical test parameters I Interim electrical parmeters 1*,2,3,4,7,0AI8B,9, 10,11 REVISION LEVEL DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 A Group
37、A test requirements SHEET 21 Group C end-point electrical parameters MIL-STD-883, group E end-point electrical parameters for RHA devi ces Subgroups * ( in accordance with method 5005, group A test table) I I I * PDA applies to subgroup 1. * Uhen applicable to this standardized military drawing, the
38、 subgroups shall be defined. 4. QUALITY ASSURANCE PROVISIONS 4.1 Saml ina and inswct ion. Sampling and inspection procedures shall be in accordance with MIL-H-38534. 4.2 Screening. Screening shall be in accordance with MIL-H-38534. The following additional criteria shall app-,: a. Burn-in test, meth
39、od 1015 of MIL-STD-883. (1) Test condition E. The test circuit shall be maintained by the manufacturer under docunent revision Level control and shall be made available to either DESC-EL or the acquiring activity upon request. Also, the test circuit shall specify the inputs, outputs, biases, and pow
40、er dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STO-883. TA as specified in accordance with table I of method 1015 of MIL-STD-883. (2) b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical
41、 parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Quality con formance insDection. Quality conformance inspection shall be in accordance with MIL-H-38534 and as specified herein. I SIZE 1 I STANDARD MICROCIRCUIT DRAWING IAl I 5962-94613 DESC FORM 193A JUL 94 P
42、rovided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- _ 4.3.1 EcpIp A * . Group A inspection shall be in accordance with MIL-H-385% and as folious: a. Tests shall be as specified in table II herein. b. Subgroups 5, and 6 shall be omitted. c. Subgroup 7, BA
43、 and 88 shall include verification of the truth table on Figure 3. d. lhe following data patterns shall be verified during subgroups 7, 8A and 8: (1) Os to all memory cell Locations. (2) 1s to all memory cell locations. (3) Checkerboard pattern to the entire memory array. (4) Checkerboard compliment
44、 to the entire memory array. 4.3.2 DOUD 6 i- . 4.3.3 Cram C inswct ipn. Group B inspection shall be in accordance with MIL-H-38534. Group C inspection shall be in accordance with MIL-H-38534 and as follows: a. b. End-point electrical parameters shall be as specified in table II herein. Steady-state
45、life test, method 1005 of MIL-STO-883. (1) Test condition B. The test circuit shall be maintained by the manufacturer under docunent revision levei control and shall be made available to either DESC-EL or the acquiring activity upon request. Also, the test circuit shall specify the inputs, outputs,
46、biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-STD-883. (2) TA as specified in accordance with table I of method 1005 of MIL-STD-883. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STO-883. (4) lhe checkerbo
47、ard data pattern shall be verified after burn-in as part of end-point electrical testing. 4.3.4 Grow D inswct ion. Group D inspection shall be in accordance with MIL-H-38534. 4.3.5 i . Group E inspection is required only for parts intended to be marked as radiation iardness assured (see 3.5 herein).
48、 RHA levels for device classes H and K shall be M, D, R, and H. RHA quality :onformance inspection sanple tests shall be performed at the RHA level specified in the acquisition docunent. a. b. C. d. e. f. 9. RHA tests for device classes H and K for levels M, D, R, and H shall be performed through each level to determine at what levels the devices meet the RHA requirements. These RHA tests shall be performed for initial qualification and after design or process changes which may affect the RHA performan
