1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update the boilerplate to current requirements as specified in MIL-PRF-38535. jak 07-07-03 Thomas M. Hess B Update boilerplate paragraphs to the current MIL-PRF-38535 requirements. - LTG 13-05-16 Thomas M. Hess REV SHEET REV B B B B B B B B SHEET
2、 15 16 17 18 19 20 21 22 REV STATUS REV B B B B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Thanh V. Nguyen DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE
3、BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A CHECKED BY Thanh V. Nguyen APPROVED BY Monica L. Poelking MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, SCAN TEST DEVICE WITH OCTAL REGISTERED BUS TRANSCEIVER, THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON DRAWING
4、 APPROVAL DATE 94-04-19 REVISION LEVEL B SIZE A CAGE CODE 67268 5962-94615 SHEET 1 OF 22 DSCC FORM 2233 APR 97 5962-E415-13 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94615 DLA LAND AND MARITIME COLUMBUS
5、, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device class Q) and space application (device class V). A choice of case outlines and lead finishes are available and are ref
6、lected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 94615 01 Q X A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2
7、) Device class designator Case outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA dev
8、ice. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54ABT8543 Scan test device with octal registered bus transceiver, three-state outputs, TTL compatible inputs 1.2.3 Device class designator. The device class designat
9、or is a single letter identifying the product assurance level as follows: Device class Device requirements documentation Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive des
10、ignator Terminals Package style X GDIP3-T28 or CDIP4-T28 28 Dual-in-line 3 CQCC1-N28 28 Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V. Provided by IHSNot for ResaleNo reproduction or networking permitted without license fr
11、om IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94615 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) -0.5 V dc to +7.0 V dc DC input voltage range (I/O ports) (VIN) . -0.5 V dc to +
12、5.5 V dc 4/ DC input voltage range (except I/O ports) (VIN) . -0.5 V dc to +7.0 V dc 4/ DC output voltage range (VOUT) . -0.5 V dc to +5.5 V dc 4/ DC output current (IOL) (per output) . +96 mA DC input clamp current (IIK) (VIN= 0.0 V) -18 mA DC output clamp current (IOK) (VOUT= 0.0 V) -50 mA Storage
13、 temperature range (TSTG) . -65C to +150C Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) +175C Maximum power dissipation (PD) 420 mW 5/ 1.4 Recommended operating conditions. 2/ 3/ Supply voltage range (VCC) +4.5 V
14、 dc to +5.5 V dc Input voltage range (VIN) +0.0 V dc to VCC Output voltage range (VOUT). +0.0 V dc to VCCMaximum low level input voltage (VIL ) . 0.8 V Minimum high level input voltage (VIH ) 2.0 V Maximum high level output current (IOH) -24 mA Maximum low level output current (IOL) +48 mA Maximum i
15、nput rise and fall rate (t/V) 10 ns/V Minimum setup time (ts): An before LEAB or Bn before LEBA . 3.5 ns An, Bn, CEAB, CEBA, LEAB, LEBA, OEAB, or OEBA before TCK . 6.0 ns TDI before TCK 6.5 ns TMS before TCK 6.0 ns Minimum hold time (th): An after LEAB or Bn after LEBA . 1.5 ns An, Bn, CEAB, CEBA, L
16、EAB, LEBA, OEAB, or OEBA after TCK . 0.5 ns TDI after TCK 0.0 ns TMS after TCK . 0.0 ns Minimum pulse width (tw): LEAB or LEBA high or low 3.0 ns TCK high or low . 5.0 ns Minimum delay time, power-up to TCK (td) 50.0 ns 6/ Minimum rise time, VCCpower-up (tr) . 1 s 6/ Maximum TCK frequency (fCLK) . 5
17、0 MHz Case operating temperature range (TC) . -55C to +125C 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Unless otherwise noted, all voltages are referenced to GND.
18、3/ The limits for the parameters specified herein shall apply over the full specified VCCrange and case temperature range of -55C to +125C. 4/ The input and output negative voltage ratings may be exceeded provided that the input and output clamp current ratings are observed. 5/ Power dissipation val
19、ues are derived using the formula PD= VCCICC+ nVOLIOL, where VCCand IOLare as specified in 1.4 herein, ICCand VOLare as specified in table I herein, and n represents the total number of outputs. 6/ This parameter is not production tested. Provided by IHSNot for ResaleNo reproduction or networking pe
20、rmitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94615 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards,
21、and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPA
22、RTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these d
23、ocuments are available online at http:/quicksearch.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094). 2.2 Non-Government publications. The following document form a part of this document to the extent specified herein. Unless other
24、wise specified, the issues of the document which are DOD adopted are those listed in the issue of DODISS cited in the solicitation. Unless otherwise specified, the issues of documents not listed in the DODISS are the issues of documents cited in the solicitation. INSTITUTE OF ELECTRICAL AND ELECTRON
25、ICS ENGINEERS (IEEE) IEEE Standard 1149.1 - IEEE Standard Test Access Port and Boundary Scan Architecture. (Applications for copies should be addressed to the Institute of Electrical and Electronics Engineers, 445 Hoes Lane, Piscataway, NJ 08854-4150). (Non-Government standards and other publication
26、s are normally available from the organizations that prepare or distribute the documents. These documents may also be available in or through libraries or other informational services). 2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited here
27、in, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with M
28、IL-PRF-38535 as specified herein, or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimens
29、ions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as s
30、pecified on figure 2. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94615 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 3.2.4 Block diagram. The block diagra
31、m shall be as specified on figure 3. 3.2.5 Test access port controller and scan test registers. The test access port controller and scan test registers shall be as specified on figure 4. 3.2.6 Ground bounce waveforms and test circuit. The ground bounce waveforms and test circuit shall be as specifie
32、d on figure 5. 3.2.7 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 6. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and po
33、stirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3
34、.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. F
35、or RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. 3.6 C
36、ertificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as
37、an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 shall be pro
38、vided with each lot of microcircuits delivered to this drawing. 3.8 IEEE 1149.1 compliance. This device shall be compliant with IEEE 1149.1 - 1990. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94615 DLA LA
39、ND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ -55C TC +125C +4.5 V VCC +5.5 V unless otherwise specified VCCGroup A subgroups Limits 3/ Unit Min M
40、ax High level output voltage 3006 VOHFor all inputs affecting output under test VIN= VIH= 2.0 V or VIL= 0.8 V IOH= -3 mA 4.5 V 1, 2, 3 2.5 V 5.0 V 1, 2, 3 3.0 V IOH= -24 mA 4.5 V 1, 2, 3 2.0 V Low level output voltage 3007 VOLFor all inputs affecting output under test, VIN= VIH= 2.0 V or VIL= 0.8 V
41、IOL= +48 mA 4.5 V 1, 2, 3 0.55 V Negative input clamp voltage 3022 VIC-For input under test, IIN= -18 mA 4.5 V 1, 2, 3 -1.2 V Input current high 3010 IIH4/ For input under test VIN= 5.5 V CE, LE, OE,TCK 5.5 V 1, 2, 3 1.0 A A or B ports 1, 2, 3 100 TDI, TMS 1, 2, 3 10.0 Input current low 3009 IIL4/ F
42、or input under test VIN= 0.0 V CE, LE, OE, TCK 5.5 V 1, 2, 3 -1.0 A A or B ports 1, 2, 3 -100 TDI, TMS 1, 2, 3 -160 Three-state output leakage current high 3021 IOZH5/ For control inputs affecting output under test, VIN= VIH= 2.0 V or VIL= 0.8 V VOUT= 2.7 V 5.5 V 1, 2, 3 50.0 A Three-state output le
43、akage current low 3020 IOZL5/ For control inputs affecting output under test, VIN= VIH= 2.0 V or VIL= 0.8 V VOUT= 0.5 V 5.5 V 1, 2, 3 -50.0 A Off-state leakage current IOFFFor input or output under test, VINor VOUT= 5.5 V All other pins at 0.0 V 0.0 V 1 100 A High-state leakage current ICEXFor outpu
44、t under test, VOUT= 5.5 V Outputs at high logic state 5.5 V 1, 2, 3 50 A Output current 3011 IO6/ VOUT= 2.5 V 5.5 V 1, 2, 3 -50 -180 mA Quiescent supply current delta, TTL input level 3005 ICC7/ For input under test, VIN= 3.4 V For all other inputs VIN= VCCor GND 5.5 V 1, 2, 3 1.5 mA Quiescent suppl
45、y current, output high 3005 ICCHFor all inputs, VIN= VCCor GND IOUT= 0 A A or B ports 5.5 V 1, 2, 3 2.0 mA Quiescent supply current, output low 3005 ICCL5.5 V 1, 2, 3 38 mA Quiescent supply current, outputs disabled 3005 ICCZ5.5 V 1, 2, 3 2.0 mA See footnotes at end of table. Provided by IHSNot for
46、ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94615 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test and MIL-STD-883 te
47、st method 1/ Symbol Test conditions 2/ -55C TC +125C +4.5 V VCC +5.5 V unless otherwise specified VCCGroup A subgroups Limits 3/ Unit Min Max Input capacitance 3012 CINTC= +25C See 4.4.1c Control inputs 5.0 V 4 15.3 pF Input/output capacitance 3012 CI/OA or B ports 5.0 V 4 24.9 pF Output capacitance
48、 3012 COUTTDO 5.0 V 4 24.2 pF Low level ground bounce noise VOLP8/ VIH= 3.0 V VIL= 0.0 V TA= +25C See figure 5 See 4.4.1d 5.0 V 4 1500 mV VOLV8/ 5.0 V 4 -1000 High level VCCbounce noise VOHP8/ 5.0 V 4 1600 VOHV8/ 5.0 V 4 -550 Functional tests 3014 9/ VIL= 0.8 V, VIH= 2.0 V Verify output VOSee 4.4.1c 4.5 V 7, 8 L H 5.5 V 7, 8 L H NORMAL MODE Propagation delay time, An to Bn or Bn to An 3003 tPLH1CL= 50 pF minimum RL= 500 See figure 6 5.0 V 9 2.0 4.7 ns 4.5 V and 5.5 V 10, 11 2.0 5.5 tPHL15.0 V 9 1.5 4.4 ns 4.5 V and 5.5 V 10, 11 1.5 5.8 Propagation dela
