1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update the boilerplate to current requirements as specified in MIL-PRF-38535. Editorial changes throughout. jak 07-05-30 Thomas M. Hess B Update boilerplate paragraphs to the current MIL-PRF-38535 requirements. - LTG 13-06-21 Thomas M. Hess REV S
2、HEET REV B B B B B B B B B SHEET 15 16 17 18 19 20 21 22 23 REV STATUS REV B B B B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Thanh V. Nguyen DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING
3、 THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A CHECKED BY Thanh V. Nguyen APPROVED BY Monica L. Poelking MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, SCAN TEST DEVICE WITH OCTAL BUS TRANSCEIVER AND REGISTER, THREE-STATE OUTPUTS, TTL COMPATIB
4、LE INPUTS, MONOLITHIC SILICON DRAWING APPROVAL DATE 94-04-26 REVISION LEVEL B SIZE A CAGE CODE 67268 5962-94616 SHEET 1 OF 23 DSCC FORM 2233 APR 97 5962-E425-13 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962
5、-94616 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device class Q) and space application (device class V). A choice of case outlines and le
6、ad finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 94616 01 Q X A Federal stock class designator RHA designat
7、or (see 1.2.1) Device type (see 1.2.2) Device class designator Case outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designato
8、r. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54ABT8652 Scan test device with octal bus transceiver and register, three-state outputs, TTL compatible inputs 1.2.3 Device clas
9、s designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as
10、follows: Outline letter Descriptive designator Terminals Package style X GDIP3-T28 or CDIP4-T28 28 Dual-in-line 3 CQCC1-N28 28 Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V. Provided by IHSNot for ResaleNo reproduction or
11、networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94616 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) . -0.5 V dc to +7.0 V dc DC input voltage
12、 range (I/O ports) (VIN) -0.5 V dc to +5.5 V dc 4/ DC input voltage range (except I/O ports) (VIN) -0.5 V dc to +7.0 V dc 4/ DC output voltage range (VOUT) -0.5 V dc to +5.5 V dc 4/ DC output current (IOL) (per output) +96 mA DC input clamp current (IIK) (VIN= 0.0 V) . -18 mA DC output clamp current
13、 (IOK) (VOUT= 0.0 V) . -50 mA Storage temperature range (TSTG) -65C to +150C Lead temperature (soldering, 10 seconds) . +300C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 Junction temperature (TJ) . +175C Maximum power dissipation (PD) . 420 mW 5/ 1.4 Recommended operating conditions.
14、2/ 3/ Supply voltage range (VCC) . +4.5 V dc to +5.5 V dc Input voltage range (VIN) . +0.0 V dc to VCC Output voltage range (VOUT) +0.0 V dc to VCCMaximum low level input voltage (VIL). 0.8 V Minimum high level input voltage (VIH) 2.0 V Maximum high level output current (IOH) . -24 mA Maximum low le
15、vel output current (IOL) . +48 mA Maximum input rise and fall rate (t/V) . 10 ns/V Minimum setup time (ts): An before CLKAB or Bn before CLKBA 5.1 ns An, Bn, CLKAB, CLKBA, SAB, SBA, OEAB, or OEBA before TCK . 7.0 ns TDI before TCK. 6.0 ns TMS before TCK . 6.0 ns Minimum hold time (th): An before CLK
16、AB or Bn after CLKBA . 0.5 ns An, Bn, CLKAB, CLKBA, SAB, SBA, OEAB, OEBA or after TCK 0.6 ns TDI after TCK . 0.9 ns TMS after TCK 0.9 ns Minimum pulse width: (tw) CLKAB or CLKBA high or low . 3.0 ns TCK high or low 5.0 ns Minimum delay time, power-up to TCK (td) . 50.0 ns 6/ Minimum rise time, VCCpo
17、wer-up (tr) 1.0 s 6/ Maximum clock frequency: (fCLK) TCK 50 MHz CLKAB or CLKBA . 100 MHz Case operating temperature range (TC) -55C to +125C 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and af
18、fect reliability. 2/ Unless otherwise noted, all voltages are referenced to GND. 3/ The limits for the parameters specified herein shall apply over the full specified VCCrange and case temperature range of -55C to +125C. 4/ The input and output negative voltage ratings may be exceeded provided that
19、the input and output clamp current ratings are observed. 5/ Power dissipation values are derived using the formula PD= VCCICC+ nVOLIOL, where VCCand IOLare as specified in 1.4 herein, ICCand VOLare as specified in table I herein, and n represents the total number of outputs. 6/ These parameters are
20、not production tested. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94616 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Governme
21、nt specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION
22、 MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Micr
23、ocircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/quicksearch.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094). 2.2 Non-Government publications. The followin
24、g document form a part of this document to the extent specified herein. Unless otherwise specified, the issues of the document which are DOD adopted are those listed in the issue of DODISS cited in the solicitation. Unless otherwise specified, the issues of documents not listed in the DODISS are the
25、 issues of documents cited in the solicitation. INSTITUTE OF ELECTRICAL AND ELECTRONICS ENGINEERS (IEEE) IEEE Standard 1149.1 - IEEE Standard Test Access Port and Boundary Scan Architecture. (Applications for copies should be addressed to the Institute of Electrical and Electronics Engineers, 445 Ho
26、es Lane, Piscataway, NJ 08854-4150). (Non-Government standards and other publications are normally available from the organizations that prepare or distribute the documents. These documents may also be available in or through libraries or other informational services). 2.3 Order of precedence. In th
27、e event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The i
28、ndividual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 as specified herein, or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. 3.2 Design,
29、construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections
30、 shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94616 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990
31、REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 3.2.4 Block diagram. The block diagram shall be as specified on figure 3. 3.2.5 Test access port controller and scan test registers. The test access port controller and scan test registers shall be as specified on figure 4. 3.2.6 Ground bounce waveforms
32、 and test circuit. The ground bounce waveforms and test circuit shall be as specified on figure 5. 3.2.7 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 6. 3.3 Electrical performance characteristics and postirradiation parameter limits.
33、Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups spe
34、cified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limi
35、tations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. 3.5.1 Certification/compliance mark. The certification mark fo
36、r device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. . 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). Th
37、e certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein. 3.7 Certificate of conformance. A certifica
38、te of conformance as required for device classes Q and V in MIL-PRF-38535 shall be provided with each lot of microcircuits delivered to this drawing. 3.8 IEEE 1149.1 compliance. This device shall be compliant with IEEE 1149.1 - 1990. Provided by IHSNot for ResaleNo reproduction or networking permitt
39、ed without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94616 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ -55C TC +125C
40、+4.5 V VCC +5.5 V unless otherwise specified VCCGroup A subgroups Limits 3/ Unit Min Max High level output voltage 3006 VOHFor all inputs affecting output under test, VIN= VIH= 2.0 V or VIL= 0.8 V IOH= -3 mA 4.5 V 1, 2, 3 2.5 V 5.0 V 1, 2, 3 3.0 V IOH= -24 mA 4.5 V 1, 2, 3 2.0 V Low level output vol
41、tage 3007 VOLFor all inputs affecting output under test, VIN= VIH= 2.0 V or VIL= 0.8 V IOL= +48 mA 4.5 V 1, 2, 3 0.55 V Negative input clamp voltage 3022 VIC-For input under test, IIN= -18 mA 4.5 V 1, 2, 3 -1.2 V Input current high 3010 IIH4/ For input under test, VIN= VCCCLK, S, OEAB, OEBA, TCK 4.5
42、 V 1, 2, 3 +1.0 A A or B ports 4.5 V 1, 2, 3 +100 TDI, TMS 4.5 V 1, 2, 3 +10.0 Input current low 3009 IIL4/ For input under test, VIN= 0.0 V CLK, S, OEAB, OEBA, TCK 4.5 V 1, 2, 3 -1.0 A A or B ports 4.5 V 1, 2, 3 -100 TDI, TMS 4.5 V 1, 2, 3 -160 Three-state output leakage current high 3021 IOZH5/ Fo
43、r control inputs affecting output under test, VIN= VIH= 2.0 V or VIL= 0.8 V VOUT= 2.7 V 5.5 V 1, 2, 3 50.0 A Three-state output leakage current low 3020 IOZL5/ For control inputs affecting output under test, VIN= VIH= 2.0 V or VIL= 0.8 V VOUT= 0.5 V 5.5 V 1, 2, 3 -50.0 A Off-state leakage current IO
44、FFFor input or output under test, VINor VOUT= 5.5 V All other pins at 0.0 V 0.0 V 1 100 A High-state leakage current ICEXFor output under test, VOUT= 5.5 V Outputs at high logic state 5.5 V 1, 2, 3 50 A Output current 3011 IO6/ VOUT= 2.5 V 5.5 V 1, 2, 3 -50 -180 mA Quiescent supply current delta, ou
45、tput high 3005 ICC7/ For input under test, VIN= 3.4 V For all other inputs, VIN= VCCor GND 5.5 V 1, 2, 3 1.5 mA Quiescent supply current, output high 3005 ICCHFor all inputs, VIN= VCCor GND IOUT= 0 A A or B ports 5.5 V 1, 2, 3 2.0 mA Quiescent supply current, output low 3005 ICCL5.5 V 1, 2, 3 38 mA
46、Quiescent supply current, outputs disabled 3005 ICCZ5.5 V 1, 2, 3 2.0 mA See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94616 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 RE
47、VISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ -55C TC +125C +4.5 V VCC +5.5 V unless otherwise specified VCCGroup A subgroups Limits 3/ Unit Min Max Input capacitance 3012 CINTC= +
48、25C See 4.4.1b Control inputs 5.0 V 4 15.3 pF Input/output capacitance 3012 CI/OA or B ports 5.0 V 4 24.9 pF Output capacitance 3012 COUTTDO 5.0 V 4 24.2 pF Low level ground bounce noise VOLP8/ VIH= 3.0 V VIL= 0.0 V TA= +25C See 4.4.1d See figure 5 5.0 V 4 1500 mV VOLV8/ 5.0 V 4 -1000 mV High level VCCbounce noise VOHP8/ 5.0 V 4 1600 mV VOHV8/ 5.0 V 4 -550 mV Functional tests 3014 9/ VIL= 0.8 V, VIH= 2.0 V Verify output VOSee 4.4.1c 4.5 V 7, 8 L H 5.5 V 7, 8 L H NORMAL MODE Propagation delay time, An to Bn or Bn to An 3003 tPLH1CL= 50 pF minimum RL= 500 See figure 6 5.0
