1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with NOR 5962-R127-95. 95-05-10 K. A. Cottongim B Corrected figure 1 to move the side view of case outline X and Z to the right side of the top view for the correct orientation. Removed the min limit for the D dimension of 2
2、.880 inches (73.15 mm) for the case outline Z. Redrew entire document. -sld 98-09-17 K. A. Cottongim C Paragraph 4.2.a.2, correct from TCto TA. Update drawing boilerplate. Editorial changes throughout. 03-07-16 Raymond Monnin REV SHEET REV SHEET REV STATUS REV C C C C C C C C C C C OF SHEETS SHEET 1
3、 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY Steve L. Duncan DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Michael Jones POST OFFICE BOX 3990 COLUMBUS, OHIO 43216-5000 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Kendall A. Cottongi
4、m MICROCIRCUIT, HYBRID, LINEAR, 5-VOLT, DUAL CHANNEL, DC/DC CONVERTER AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 94-10-21 AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 67268 5962-94659 SHEET 1 OF 11 DSCC FORM 2233 APR 97 5962-E489-03 DISTRIBUTION STATEMENT A. Approved for public re
5、lease; distribution is unlimited. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94659 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Sco
6、pe. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are re
7、flected in the PIN. 1.2 PIN. The PIN shall be as shown in the following example: 5962 - 94659 01 H X X Federal RHA Device Device Case Lead stock class designator type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 Radia
8、tion hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device typ
9、e Generic number Circuit function 01 MHD2805D/883, MHD2805DF/883 DC-DC converter, 15 W, 5 V output 1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level. All levels are defined by the requirements of MIL-PRF-38534 and require QML
10、 Certification as well as qualification (Class H, K, and E) or QML Listing (Class G and D). The product assurance levels are as follows: Device class Device performance documentation K Highest reliability class available. This level is intended for use in space applications. H Standard military qual
11、ity class level. This level is intended for use in applications where non-space high reliability devices are required. G Reduced testing version of the standard military quality class. This level uses the Class H screening and In-Process Inspections with a possible limited temperature range, manufac
12、turer specified incoming flow, and the manufacturer guarantees (but may not test) periodic and conformance inspections (Group A, B, C, and D). E Designates devices which are based upon one of the other classes (K, H, or G) with exception(s) taken to the requirements of that class. These exception(s)
13、 must be specified in the device acquisition document; therefore the acquisition document should be reviewed to ensure that the exception(s) taken will not adversely affect system performance. D Manufacturer specified quality class. Quality level is defined by the manufacturers internal, QML certifi
14、ed flow. This product may have a limited temperature range. 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X See figure 1 10 Dual-in-line Z See figure 1 10 Flange mount Provided by IHSNot for
15、ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94659 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534
16、. 1.3 Absolute maximum ratings. 1/ Input voltage range -0.5 V dc to +50 V dc Power dissipation (PD), short circuit 10 W Output power. 15.5 W Lead soldering temperature (10 seconds). +300C Storage temperature range . -65C to +150C 1.4 Recommended operating conditions. Input voltage range +16 V dc to
17、+40 V dc Case operating temperature range (TC) -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of the
18、se documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation. SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-38534 - Hybrid Microcircuits, General Specification for. STANDARDS DEPARTMENT OF DEFEN
19、SE MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. HANDBOOKS DEPARTMENT OF DEFENSE MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Unless otherwise indicated, copies of the
20、specification, standards, and handbooks are available from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this dr
21、awing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 1/ Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the maximum levels may degrade performan
22、ce and affect reliability. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94659 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Ite
23、m requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as designated in the device manufacturers Quality Management (QM) plan or as d
24、esignated for the applicable device class. Therefore, the tests and inspections herein may not be performed for the applicable device class (see MIL-PRF-38534). Furthermore, the manufacturer may take exceptions or use alternate methods to the tests and inspections herein and not perform them. Howeve
25、r, the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device class. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38534 and herein. 3.2.1 Case outline(s). The case outline(s)
26、 shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and sh
27、all apply over the full specified operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking of device(s). Marking of device(s) shall be in ac
28、cordance with MIL-PRF-38534. The device shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers vendor similar PIN may also be marked. 3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described herein shall maint
29、ain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample, for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those which, if any, are guaranteed. This data shall be maintaine
30、d under document revision level control by the manufacturer and be made available to the preparing activity (DSCC-VA) upon request. 3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this drawing. The certificate of compliance (orig
31、inal copy) submitted to DSCC-VA shall affirm that the manufacturers product meets the performance requirements of MIL-PRF-38534 and herein. 3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of microcircuits delivered to this dra
32、wing. 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as desc
33、ribed herein. 4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level contr
34、ol and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-883. (2) TAas specified in accordanc
35、e with table I of method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. Provided by IHSNot for ResaleNo reproduction or netwo
36、rking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94659 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL C SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Limits Test Symbol Conditions -55C TC +125C VIN= 28 V
37、dc 0.5 V dc no external sync, CL= 0 unless otherwise specified Group A subgroups Device type Min Max Unit 1 +4.950 +5.050 IOUT= 1.5 A dc, (main) 2,3 +4.850 +5.150 1 -4.925 -5.075 Output voltage VOUTIOUT= 1.5 A dc, (dual) 2,3 01 -4.825 -5.175 V dc Output current IOUTVIN= 16 V dc, 28 V dc, and to 40 V
38、 dc, sum of both outputs 1,2,3 01 0.0 3000 mA 1 50 Output ripple voltage VRIPIOUT= 1.5 A B.W. = 10 kHz to 2 MHz 2,3 01 80 mV p-p VIN= 16 V dc to 40 V dc, IOUT= 1.5 A (main) 50 Line regulation VRLINEVIN= 16 V dc to 40 V dc, IOUT= 1.5 A (dual) 1,2,3 01 100 mV IOUT= 0 to 1.5 A , (main) 50 Load regulati
39、on VRLOADIOUT= 0 to 1.5 A , (dual) 1,2,3 01 100 mV IOUT= 0, Inhibit (pin 2) = 0 1,2,3 01 8 Input current IINIOUT= 0, Inhibit (pin 2) = open 1, 2, 3 01 75 mA Input ripple current IRIPIOUT= 1.5 A, B.W. = 10 kHz to 10 MHz 1, 2, 3 01 50 mA p-p 1 76 Efficiency Eff IOUT= 1.5 A 2, 3 01 70 % Isolation ISO I
40、nput to output or any pin to case (except pins 6, 7, and 8) at 500V dc, TA= +25C 1 01 100 M Capacitive load 1/ 2/ CLNo effect on dc performance, TA= +25C 4 01 500 F See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDA
41、RD MICROCIRCUIT DRAWING SIZE A 5962-94659 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL C SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued Limits Test Symbol Conditions -55C TC +125C VIN= 28 V dc 0.5 V dc no external sync, CL= 0 unle
42、ss otherwise specified Group A subgroups Device type Min Max Unit Power dissipation, load fault PDShort circuit 1,2,3 01 10 W Switching frequency FSIOUT= 1.5 A 4,5,6 01 550 650 kHz External sync range 3/ FSYNCIOUT= 1.5 A, TTL level to pin 9 4,5,6 01 500 675 kHz Output response to step transient load
43、 changes 4/ VTLOAD50 percent load to/from 100 percent load, Balanced loads 4,5,6 01 -300 +300 mV pk Recovery time, step transient load changes 2/ 4/ 5/ TTLOAD50 percent load to/from 100 percent load, Balanced loads 4,5,6 01 200 s Input step from 16 V dc to 40 V dc, IOUT= 1.5 A -400 +400 Output respo
44、nse to transient step line changes 2/ 6/ VTLINEInput step from 40 V dc to 16 V dc, IOUT= 1.5 A 4,5,6 01 -400 +400 mV pk Input step from 16 V dc to 40 V dc, IOUT= 1.5 A 300 Recovery time, transient step line changes 2/ 5/ TTLINEInput step from 40 V dc to 16 V dc, IOUT= 1.5 A 4,5,6 01 300 s Turn-on ov
45、ershoot 2/ VtonOSIOUT = 1.5 A 4,5,6 01 50 mV pk Turn-on delay 7/ TonDIOUT = 1.5 A 4,5,6 01 5 ms Load fault recovery 2/ 5/ TrLFIOUT = 1.5 A 4,5,6 01 5 ms 1/ Capacitive load may be any value from 0 to the maximum limit without compromising dc performance. 2/ Parameter shall be tested as part of device
46、 characterization and after design and process changes; therefore, the parameters shall be guaranteed to the limits specified in table I. 3/ A TTL level waveform (VIH= 4.5 V minimum, VIL= 0.8 V maximum) with a 50 percent 10 percent duty cycle applied to the sync pin (pin 9) within the sync range fre
47、quency shall cause the converters switching frequency to become synchronous with the frequency applied to the sync input pin (pin 9). 4/ Load step transition time 10 microseconds maximum. 5/ Recovery time is measured from the initiation of the transient until VOUThas returned to within 1 percent of
48、VOUT final value. 6/ Input step transition time greater than 10 microseconds. 7/ Turn-on delay time measurement is either for a step application of power at the input or the removal of a ground signal from the inhibit pin (pin 2) while power is applied to the input. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94659 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL C SHEET 7 DSCC FORM 2234
