1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Make correction to the -IOUTtest condition limit as specified under Table I. Update boilerplate paragraphs to current MIL-PRF-38535 requirements. - ro 10-03-09 C. SAFFLE REV SHET REV SHET REV STATUS REV A A A A A A A A A A A OF SHEETS SHEET 1 2 3
2、 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY RICK C. OFFICER DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY RAJESH R. PITHADIA APPROVED
3、BY MICHAEL A. FRYE MICROCIRCUIT, LINEAR, HIGH SLEW RATE, WIDEBAND, OPERATIONAL AMPLIFIER, MONOLITHIC SILICON DRAWING APPROVAL DATE 94-07-12 AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-94679 SHEET 1 OF 11 DSCC FORM 2233 APR 97 5962-E209-10 Provided by IHSNot for ResaleNo reproduction or net
4、working permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94679 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reli
5、ability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PI
6、N is as shown in the following example: 5962 - 94679 01 M P A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Leadfinish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked
7、 devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device t
8、ype(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 HA-2840 High slew rate, wideband, operational amplifier 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows
9、: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline
10、(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style P GDIP1-T8 or CDIP2-T8 8 Dual-in-line 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Pr
11、ovided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94679 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Voltage between +VS
12、and VSterminals +35 V Differential input voltage (VIND) 6 V Voltage at either input terminal . +VSto VSPeak output current ( 10% duty cycle) 50 mA Power dissipation (PD) 0.7 W at TA= +75C 2/ Junction temperature (TJ) . +175C Storage temperature range . -65C to +150C Lead temperature (soldering, 10 s
13、econds) +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Thermal resistance, junction-to-ambient (JA) +140C/W 1.4 Recommended operating conditions. Supply voltage (VS) . 12 V to 15 V Common mode input voltage (VINCM) x ( +VS- -VS) Load resistance (RL) . 1 k Ambient operating temper
14、ature range (TA) . -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited
15、 in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.
16、 DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Build
17、ing 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemp
18、tion has been obtained. _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Derate above TA= +75C at 7 mW/C. Provided by IHSNot for ResaleNo reproduction or networking pe
19、rmitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94679 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in
20、accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance w
21、ith MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and
22、herein for device class M. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specifie
23、d herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. Th
24、e electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufactu
25、rer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.
26、5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a cert
27、ificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-H
28、DBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requ
29、irements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 No
30、tification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs
31、agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered
32、by this drawing shall be in microcircuit group number 049 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94679 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISI
33、ON LEVEL A SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55C TA+125C Group A subgroups Device type Limits 2/ Unit unless otherwise specified Min Max Input offset voltage VIOVCM= 0 V 1 01 -2 +2 mV 2,3 -6 +6Input bias current IIBVCM= 0 V, +RS
34、= 1.1 k 1 01 -14.5 +14.5 A -RS= 100 2,3 -20 +20 VCM= 0 V, +RS= 100 1 -14.5 +14.5 -RS= 1.1 k 2,3 -20 +20 Input offset current IIOVCM= 0 V, +RS= 1.1 k 1 01 -4 +4 A -RS= 1.1 k 2,3 -8 +8 Common mode voltage range +VCMR+VS= +5 V, -VS= -25 V 1 01 10 V 2,3 10-VCMR+VS= +25 V, -VS= -5 V 1 -10 2,3 -10 Common
35、mode rejection ratio +CMRR VCM= 10 V, VOUT= -10 V, +VS= 5 V, -VS= -25 V 1,2,3 01 75 dB -CMRR VCM= -10 V, VOUT= 10 V, +VS= +25 V, -VS= -5 V 75 Output voltage swing +VOUTRL= 1 k 1,2,3 01 10 V -VOUTRL= 1 k -10 Output current +IOUTVOUT= 10 V 1,2,3 01 10 mA -IOUTVOUT= -10 V -10 Quiescent power supply cur
36、rent +ICCVOUT= 0 V, IOUT= 0 mA 1 01 14.6 mA 2,3 15 -ICCVOUT= 0 V, IOUT= 0 mA 1 -14.6 2,3 -15 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94679 DEFENSE SUPPLY CENTER COLUMBUS
37、 COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions 1/ -55C TA+125C Group A subgroups Device type Limits 2/ Unit unless otherwise specified Min Max Power supply rejection ratio +PSRR VS= 10 V, +V
38、= 10 V and V = -15 V, +V = 20 V and V = -15 V 1,2,3 01 75 dB -PSRR VS= 10 V, +V = 15 V and V = -10 V, +V = 15 V and V = -20 V 75 Quiescent power 3/ 4/ consumption PC VOUT= 0 V, IOUT= 0 mA 1,2,3 01 450 mW Large signal voltage gain +AVOLVOUT= 0 V and +10 V, 4 01 20 kV/V RL= 1 k 5,6 10 -AVOLVOUT= 0 V a
39、nd -10 V, 4 20 RL= 1 k 5,6 10 Gain bandwidth product 4/ 5/ GBWP VOUT= 200 mV, fO= 5 MHz, TA= +25C 4 01 500 MHz VOUT= 200 mV, fO= 45 MHz, TA= +25C 450 Slew rate 4/ 5/ 6/ +SR VOUT= -5 V to +5.0 V, RL= 1 k, AV= 10 V/V, TA= 25C 4 01 550 V/s -SR VOUT= +5 V to -5.0 V, RL= 1 k, AV= 10 V/V, TA= 25C 500 Full
40、 power bandwidth 4/ 5/ 7/ FPBW VPK= +10 V, TA= 25C 4 01 8.0 MHz Minimum closed loop 4/ 5/ stable gain CLSG RL= 1 k, CL 10 pF 4,5,6 01 10 V/V Overshoot 4/ 5/ +OS VOUT= 0 V to +200 mV, TA= 25C 4 01 30 % -OS VOUT= 0 V to -200 mV, TA= 25C 30 See footnotes at end of table. Provided by IHSNot for ResaleNo
41、 reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94679 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions
42、 1/ -55C TA+125C Group A subgroups Device type Limits 2/ Unit unless otherwise specified Min Max Open loop output 4/ 5/ resistance ROUTVOUT= 0 V, TA= +25C 4 01 60 Rise time 4/ 5/ 6/ tRVOUT= 0 V to +200 mV, CL 10 pF, TA= +25C 9 01 10 ns Fall time 4/ 5/ 6/ tFVOUT= 0 V to -200 mV, CL 10 pF, TA= +25C 9
43、01 10 ns 1/ Unless otherwise specified, supply voltage (VS) = 15 V, source resistance (RS) = 100 , load resistance (RL) = 100 k, and output voltage (VOUT) = 0 V. 2/ The algebraic convention, whereby the most negative value is a minimum and the most positive is a maximum, is used in this table. Negat
44、ive current shall be defined as conventional current flow out of a device terminal. 3/ Quiescent power consumption based upon quiescent supply current test maximum limit. No load on outputs. 4/ If not tested, shall be guaranteed to the limits specified in table I herein. 5/ Supply voltage (VS) = 15
45、V, source resistance (RS) = 50 , load resistance (RL) = 1 k, capacitance load (CL) 10 pF, and gain (AV) = +10 V/V. 6/ Measured at 10 percent to 90 percent points. 7/ Full bandwidth is based on slew rate measurement based using FPBW = slew rate / (2 x x VPK). Provided by IHSNot for ResaleNo reproduct
46、ion or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94679 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 8 DSCC FORM 2234 APR 97 Device type 01 Case outline P Terminal number Terminal symbol 1 NC2 -INPUT 3 +INPUT 4 -VS5
47、NC6 OUTPUT 7 +VS8 NCFIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94679 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 9 DSCC FORM 2234 APR 9
48、7 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening.
