1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update boilerplate paragraphs to current MIL-PRF-38535 requirements. - ro 09-09-21 C. SAFFLE REV SHET REV SHET REV STATUS REV A A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY RICK OFFICER DEFENSE SUPPLY CENTER COLUMBU
2、S COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY RAJESH PITHADIA APPROVED BY MICHAEL FRYE MICROCIRCUIT, LINEAR, PRECISION VIRTUAL GROUND, MONOLITHIC SILICON DRAWI
3、NG APPROVAL DATE 94-12-20 AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-95556 SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E493-09 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95556 DEFENSE SUPPLY CENT
4、ER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finish
5、es are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 95556 01 Q P A Federal stock class designator RHA designator (see 1
6、.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Leadfinish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device cl
7、ass M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 0
8、1 TLE2425 Precision virtual ground 02 TLE2426 Precision virtual ground 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for
9、MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals
10、 Package style P GDIP1-T8 or CDIP2-T8 8 Dual-in-line 2 CQCC1-N20 20 Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking
11、permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95556 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Continuous input voltage 40 V Continuous filter trap voltage: Device type 02
12、 . 40 V Output current (IOUT) 80 mA Duration of short circuit current at (or below) +25C . Unlimited 2/ Storage temperature range . -65C to +150C Case temperature for 10 seconds: (case 2) +260C Lead temperature 1.6 mm (1/16 inch) from case for 10 seconds (case P) . +300C Junction temperature (TJ) .
13、+150C Power dissipation (PD) (TA 25C): Case P . 1050 mW 3/ Case 2 . 1375 mW 3/ Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 1.4 Recommended operating conditions. Input voltage range (VIN) 4 V to 40 V Operating free air temperature range (TA) -55C to +125C 2. APPLICABLE DOCUMENTS 2.1
14、Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECI
15、FICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Stand
16、ard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence.
17、 In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. _ 1/ Stresses above the absolute maxim
18、um rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ The output may be shorted to either supply. Temperature and /or supply voltages must be limited to ensure that the maximum dissipation rating is not exceede
19、d 3/ Above 25C derate linearly at a factor of 11.0 mW/C for case 2 and 8.4 mW/C for case P. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95556 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVIS
20、ION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in
21、the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The des
22、ign, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The termina
23、l connections shall be as specified on figure 1. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the fu
24、ll ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition
25、, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking
26、 for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The co
27、mpliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 he
28、rein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing
29、shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q a
30、nd V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acqu
31、ired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore document
32、ation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 59 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or network
33、ing permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95556 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TA+125C Group A subgroups De
34、vice type Limits 1/ Unit IOUT= 0 mA unless otherwise specified Min Max Output voltage VOUTVIN= 5 V 1 01,02 2.48 2.52 V 2,3 01 2.47 2.532,3 02 2.465 2.535VIN= 4 V, TA= +25C 1 02 1.980 2.020 VIN= 12 V 1 02 5.950 6.050 2,3 5.925 6.075VIN= 40 V, TA= +25C 1 02 19.80 20.20 Supply current ICCVIN= 5 V 1,2,3
35、 01 250 A VIN= 5 V and 12 V, no load, TA= +25C 1 02 300 VIN= 4 V and 40 V, no load 2,3 400 Short circuit output current IOSSink current, VIN= 5 V, 1 01 30 mA VOUT= 5 V, TA= +25C 02 20 Source current, VIN= 5 V, 1 01 -30 VOUT= 0 V, TA= +25C 02 -20 Sink current, VIN= 12 V, VOUT= 12 V, TA= +25C 1 02 20
36、Source current, VIN= 12 V, VOUT= 0 V, TA= +25C 1 02 -20 Input regulation RINVIN= 4.5 V to 5.5 V 4 01 20 V 5,6 100VIN= 4.5 V to 40 V 4 20 V/V 5,6 100See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT D
37、RAWING SIZE A 5962-95556 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions -55C TA+125C Group A subgroups Device type Limits 1/ Unit IOUT= 0 mA unless otherwise spe
38、cified Min Max Output regulation 2/ 3/ ROUT-VIN= 5 V, 4 01 -160 160 V (source current) IOUT= 0 mA to -10 mA 5,6 -250 250 VIN= 5 V and 12 V, 4 02 -160 160 IOUT= 0 mA to -10 mA 5,6 -250 250 VIN= 5 V, TA= +25C, IOUT= 0 mA to -20 mA 4 01 -450 450 VIN= 5 V and 12 V, IOUT= 0 mA to -20 mA, TA= +25C 4 02 -4
39、50 450 Output regulation 2/ 3/ ROUT+VIN= 5 V, 4 01 -160 160 V (sink current) IOUT= 0 mA to 3 mA 5,6 -250 250 VIN= 5 V, IOUT= 0 mA to 3 mA 5,6 02 -250 250 VIN= 12 V, IOUT= 0 mA to 8 mA 5,6 02 -250 250 VIN= 5 V and 12 V, IOUT= 0 mA to 10 mA, TA= +25C 4 02 -160 160 VIN= 5 V, IOUT= 0 mA to 20 mA, TA= +2
40、5C 4 01 -235 235 VIN= 5 V and 12 V, IOUT= 0 mA to 20 mA, TA= +25C 4 02 -235 235 Output impedance ZOTA= +25C 1 01,02 22.5 M 1/ The limiting terms “min” (minimum) and “max” (maximum) shall be considered to apply to magnitudes only. Negative current shall be defined as conventional current flow out of
41、a device terminal. 2/ If not tested, shall be guaranteed to the limits specified in table I herein. 3/ Pulse testing techniques are used to maintain the junction temperature as close to the ambient temperature as possible. Thermal effects must be taken into account separately. Provided by IHSNot for
42、 ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95556 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 7 DSCC FORM 2234 APR 97 Device types 01 02 Case outlines P 2 P 2 Terminal number Terminal symbol
43、 1 OUTPUT NC OUTPUT NC 2 COMMON OUTPUT COMMON OUTPUT 3 INPUT NC INPUT NC 4 NC NC NC NC 5 NC COMMON NC COMMON 6 NC NC NC NC 7 NC INPUT NC INPUT 8 NC NC NR (SEE NOTE) NC 9 - NC - NC 10 - NC - NC 11 - NC - NC 12 - NC - NC 13 - NC - NC 14 - NC - NC 15 - NC - NC 16 - NC - NC 17 - NC - NC 18 - NC - NC 19
44、- NC - NC 20 - NC - NR (SEE NOTE) NC = No connection. NOTE: Noise reduction pin. With the addition of an external capacitor, peak-to-peak noise is reduced while line ripple rejection is improved. FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted wit
45、hout license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95556 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 8 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in ac
46、cordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appe
47、ndix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall
48、be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition B or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the
