1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Drawing updated to reflect current requirements. Editorial changes throughout. - les. 00-10-17 Raymond Monnin B Update drawing to current requirements. Editorial changes throughout. - gap 08-06-06 Robert M. Heber REV SHET REV SHET REV STATUS REV
2、B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY Larry T. Gauder DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Thomas M. Hess COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY
3、Monica L. Poelking MICROCIRCUIT, DIGITAL, BIPOLAR, TTL, PARALLEL-LOAD 8-BIT SHIFT REGISTERS, AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 95-02-02 MONOLITHIC SILICON AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-95583 SHEET 1 OF 11 DSCC FORM 2233 APR 97 5962-E051-08 Provid
4、ed by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95583 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product a
5、ssurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) le
6、vels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 95583 01 Q E X Federal stock class designator RHA designator (see 1.2.1) Devicetype (see 1.2.2)Deviceclass designatorCaseoutline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA de
7、signator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-)
8、 indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54166 parallel-load 8-bit shift registers 1.2.3 Device class designator. The device class designator is a single letter identifying the produ
9、ct assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case
10、 outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 dual in line package F GDFP2-F16 or CDFP3-F16 16 flat package 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-385
11、35 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95583 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B S
12、HEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Supply voltage range -0.5 V dc minimum to +7.0 V dc maximum Input voltage . 5.5 V dc Storage temperature . -65C to +150C Maximum power dissipation (PD) 698.5 mW 2/ Lead temperature (soldering, 10 seconds) . +300C Thermal resistance, junct
13、ion-to-case (JC) See MIL-STD-1835 Junction temperature (TJ) . +175C 1.4 Recommended operating conditions. Supply voltage range (VCC) . +4.5 V dc minimum to 5.5 V dc maximum Minimum high level input voltage (VIH) 2.0 V Maximum low level input voltage (VIL) . 0.8 V dc 2/ Ambient operating temperature
14、range (TA) . -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in th
15、e solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPAR
16、TMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D,
17、 Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption ha
18、s been obtained. _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Maximum power dissipation is defined as VCCx ICC, and must withstand the added PDdue to short circuit
19、 test, e.g., IOS. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95583 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item require
20、ments. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herei
21、n. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PR
22、F-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The tr
23、uth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation pa
24、rameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. T
25、he part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA produc
26、t using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classe
27、s Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacture
28、r in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC
29、-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of confor
30、mance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification t
31、o DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufactu
32、rers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 003 (see MIL-PRF-3853
33、5, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95583 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance ch
34、aracteristics. Test Symbol Conditions -55C TA+125C Group A subgroups Limits Unit unless otherwise specified Min Max High level output voltage VOHVCC= 4.5 V, VIL= 0.8 V VIH= 2.0 V, IOH= -0.8 mA 1, 2, 3 2.4 V Low level output voltage VOLVCC= 4.5 V, VIH= 2.0 V VIL= 0.8 V, IOL= 16 mA 1, 2, 3 0.4 V Input
35、 clamp voltage VIKVCC= 4.5 V, IIN= -12 mA 1, 2, 3 -1.5 V High level input current IIH1 VCC= 5.5 V VIN= 5.5 V 1, 2, 3 1 mA Low level input current IIL VCC= 5.5 V VIN= 0.4 V 1, 2, 3 -1.6 mA High level input current IIH2 VCC= 5.5 V VIN= 2.4 V 1, 2, 3 40 A Short circuit input current IOSVCC= 5.5 V 1/ 1,
36、 2, 3 -20 -57 mA Supply current (average per flip-flop) ICC VCC= 5.5 V 2/ 1, 2, 3 127 mA Functional test VCC= 4.5 V, 5.5 V See 4.4.1b 7, 8 Maximum clock frequency fMAX VCC= 5.0 V, RL= 400 , 9 25 MHz Propagation delay time, output from CLEAR tPHL CL= 15 pF 9 35 ns tPLH 26 Propagation delay time, outp
37、ut from CLOCK tPHL 9 30 ns Width of clock or CLEAR pulse tW9 20 ns Mode-control setup time CLOCK tSU 9 30 ns Data setup time tSU 20 ns Hold time at any input CLOCK th 9 0 ns 1/ Not more than 1 output should be shorted at a time. 2/ With all outputs open, 4.5 V applied to the serial input, all other
38、inputs except the clock grounded, ICCis measured after a momentary ground, then 4.5 V, is applied to the clock. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95583 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, O
39、HIO 43218-3990 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 Device type 01 Case outlines E and F Terminal number Terminal symbol 1 SERIAL INPUT 2 A 3 B4 C5 D 6 CLOCK INHIBIT 7 CLOCK 8 GND 9 CLEAR 10 E 11 F 12 G 13 QH14 H15 SHIFT/ LOAD 16 VCCFIGURE 1. Terminal connections. INPUTS INTERNAL OUTPUTS O
40、UTPUT CLEAR SHIFT/LOAD CLOCK INHIBIT CLOCK SERIAL INPUT A.H QAQB QHL X X X X X L L L H X L L X X QA0QB0QH0H L L X a.h a b h H H L H X H QAn QGn H H L L X L QAn QGn H X H X X QA0 QB0 QH0 Notes: H = High voltage level. L = Low voltage level. X = Irrelevant. a, b, h = the level of steady-state inputs a
41、t inputs A through H respectively. QA0, QB0, QH0= the level of QA, QB, or QH, respectively, before the indicated steady-state input conditions were established. QAn, QGn= the level of QA, or QGbefore the most recent transition of the clock. FIGURE 2. Truth table. Provided by IHSNot for ResaleNo repr
42、oduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95583 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 FIGURE 3. Logic diagram. Provided by IHSNot for ResaleNo reproduction or networking pe
43、rmitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95583 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 8 DSCC FORM 2234 APR 97 NOTES: 1. All pulse generators have the following characteristics: ZOUT= 50; tr= 7 ns, tf= 7 ns. 2. The clock p
44、ulse has the following characteristics: tW(clock) 20 ns and PRR = 1 MHz. The clear pulse has the following characteristics: tW(clear) 20 ns and thold= 0 ns. When testing fmax, vary the clock PRR. 3. CL= 15pF and RL= 400 . CLincludes probe and jig capacitance. 4. All diodes are 1N3064, 1N916 or equiv
45、alent. 5. A clear pulse is applied prior to each test. 6. Propagation delay times (tPLHand tPHL) are measured at tn+ 1. Proper shifting of data is verified at tn+ 8 with a functional test. 7. tn+ 8 = bit time after eight clocking transitions. 8. Vref= 1.5 V. FIGURE 4. Test circuit and switching wave
46、forms. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95583 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 9 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection
47、. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sam
48、pling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, meth
