1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Change voltage levels for Ground Bounce tests. - CS 97-04-24 Monica L. Poelking B Change the device name to reflect the Bus Hold feature, and adjust limits to characterize the performance of the optimized die. Editorial changes throughout. - CS 9
2、8-04-21 Monica L. Poelking C Update boilerplate to MIL-PRF-38535 requirements. - LTG 08-07-24 Thomas M. Hess REV SHET REV C C C C SHEET 15 16 17 18 REV STATUS REV C C C C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Thomas M. Hess CHECKED BY Thomas M. Hes
3、s DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil APPROVED BY Monica L. Poelking STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 95-11-07 MICROCIRCUIT, DIGITAL, ADVANCED
4、 BICMOS, 3.3 V 16-BIT EDGE-TRIGGERED D-TYPE FLIP- FLOPS WITH BUS HOLD, THREE-STATE OUTPUTS, AND TTL COMPATIBLE INPUTS, MONOLITHIC SILICON AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 67268 5962-95647 SHEET 1 OF 18 DSCC FORM 2233 APR 97 5962-E470-08 Provided by IHSNot for ResaleNo reproduction or netwo
5、rking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95647 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliab
6、ility (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN
7、is as shown in the following example: 5962 - 95647 01 Q X A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked
8、devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device ty
9、pe(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54LVTH16374 3.3 V ABT 16-bit edge-triggered D-type flip-flops with bus hold, three-state outputs, and TTL compatible inputs 1.2.3 Device class designator. The device class designator is
10、 a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qua
11、lification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X GDFP1-F48 48 Flat pack 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and
12、 V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95647 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 9
13、7 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) -0.5 V dc to +4.6 V dc DC input voltage range (VIN) -0.5 V dc to +7.0 V dc 4/ DC output voltage range (VOUT) . -0.5 V dc to +7.0 V dc 4/ DC output current (IOL) (per output) +96 mA DC output current (IOH) (per output) . +48 mA 5/ DC
14、 input clamp current (IIK) (VINVCC. 6/ Power dissipation values are derived using the formula PD= VCCICC+ nVOLIOL, where VCCand IOLare as specified in 1.4 above, ICCand VOLare as specified in table I herein, and n represents the total number of outputs. 7/ Unused inputs must be held high or low to p
15、revent them from floating. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95647 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS
16、 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE
17、SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of
18、Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of preced
19、ence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirem
20、ents. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein
21、. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF
22、-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The tru
23、th table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Ground bounce load circuit and waveforms. The ground bounce load circuit and waveforms shall be as specified on figure 4. 3.2.6 Switching waveforms and test circuit. The switch
24、ing waveforms and test circuit shall be as specified on figure 5. 3.2.7 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing and acquiring activity upon request. 3.3 Elect
25、rical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. Provided by IHSNot fo
26、r ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95647 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 5 DSCC FORM 2234 APR 97 3.4 Electrical test requirements. The electrical test requirements shal
27、l be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feas
28、ible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in a
29、ccordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of co
30、mpliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be lis
31、ted as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-3853
32、5 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of mic
33、rocircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for devi
34、ce class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for dev
35、ice class M. Device class M devices covered by this drawing shall be in microcircuit group number 127 (see MIL-PRF-38535, appendix A).Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95647 DEFENSE SUPPLY CENTE
36、R COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ -55C TC +125C +2.7 V VCC +3.6 V VCCGroup A subgroups Limits 3/ Unit unless otherwise specified Min Max Ne
37、gative input clamp voltage 3022 VIKFor input under test IIN= -18 mA 2.7 V 1, 2, 3 -1.2 V High level output voltage 3006 VOHIOH= -100 A 2.7 V and 3.6 V 1, 2, 3 VCC-0.2 V For all inputs affecting output under test VIN= 2.0 V or 0.8 V IOH= -8.0 mA 2.7 V 1, 2, 3 2.4 IOH= -24.0 mA 3.0 V 1, 2, 3 2.0 VOLIO
38、L= 100 A 2.7 V 1, 2, 3 0.2 V IOL= 24.0 mA 2.7 V 1, 2, 3 0.5 Low level output voltage 3007 IOL= 16.0 mA 3.0 V 1, 2, 3 0.4 For all inputs affecting output under test VIN= 2.0 V or 0.8 V IOL= 32.0 mA 3.0 V 1, 2, 3 0.5 IOL= 48.0 mA 3.0 V 1, 2, 3 0.55 Input current 3010 II4/ For input under test, VIN= 5.
39、5 V 0.0 V or 3.6 V 1, 2, 3 10.0 A For control inputs under test VIN= VCCor GND 3.6 V 1, 2, 3 1.0 For data inputs under test VIN= VCC3.6 V 1, 2, 3 1.0 For data inputs under test VIN= 0.0 V 3.6 V 1, 2, 3 -5.0 Input hold current II(hold)Data inputs VIN= 0.8 V 3.0 V 1, 2, 3 75.0 A VIN= 2.0 V -75.0 Three
40、-state output leakage current high 3021 IOZH5/ VOUT= 3.0 V 3.6 V 1, 2, 3 5.0 A Three-state output leakage current low 3020 IOZL5/ VOUT= 0.5 V 3.6 V 1, 2, 3 -5.0 A See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD
41、 MICROCIRCUIT DRAWING SIZE A 5962-95647 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ -55C TC +125C +2.7 V VCC +3.6 V V
42、CCGroup A subgroups Limits 3/ Unit unless otherwise specified Min Max Three-state output current, power-up IOZPU6/ VOUT= 0.5 V to 3.0 V mOE = Dont care 0.0 V to 1.5 V 1, 2, 3 100 A Three-state output current, power-down IOZPD6/ VOUT= 0.5 V to 3.0 V mOE = Dont care 1.5 V to 0.0 V 1, 2, 3 100 A Quiesc
43、ent supply current, outputs high 3005 ICCHFor all inputs VIN= VCCor GND IOUT= 0.0 A 3.6 V 1, 2, 3 0.19 mA Quiescent supply current, outputs low 3005 ICCL3.6 V 1, 2, 3 5.0 mA Quiescent supply current, outputs disabled 3005 ICCZ3.6 V 1, 2, 3 0.19 mA Quiescent supply current delta TTL input levels 3005
44、 ICC 7/ For input under test VIN= VCC-0.6 V, For all other inputs VIN= VCCor GND 3.0 V and 3.6 V 1, 2, 3 0.2 mA Input capacitance 3012 CINTC= +25C See 4.4.1c 3.3 V 4 10.0 pF Output capacitance 3012 COUTVIN= 3.0 V or 0.0 V VOUT= 3.0 V or 0.0 V 3.3 V 4 14.0 pF Low level ground bounce noise VOLP8/ VIH=
45、 2.7 V,VIL= 0.0 V TA= +25C 3.0 V 4 750 mV Low level ground bounce noise VOLV8/ See 4.4.1d See figure 4 3.0 V 4 -770 mV High level VCCbounce noise VOHP8/ 3.0 V 4 960 mV High level VCCbounce noise VOHV8/ 3.0 V 4 -1200 mV Functional test 3014 9/ VIN= VIHor VILVerify output VOUTSee 4.4.1b 2.7 V and 3.6
46、V 7, 8 L H See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95647 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 8 DSCC FORM 2234 APR 97 TABLE I.
47、 Electrical performance characteristics - Continued. Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ -55C TC +125C +2.7 V VCC +3.6 V VCCGroup A subgroups Limits 3/ Unit unless otherwise specified Min Max Clock frequency fclockCL= 50 pF minimum RL= 500 See figure 5 3.0 V and 3.6 V 9, 10
48、,11 0.0 160.0 MHz2.7 V 0.0 160.0 Pulse duration mCLK high or low twCL= 50 pF minimum RL= 500 See figure 5 3.0 V and 3.6 V 9, 10,11 3.0 ns 2.7 V 3.0 Setup time, data before mCLK tsuCL= 50 pF minimum RL= 500 See figure 5 3.0 V and 3.6 V 9, 10,11 2.9 ns 2.7 V 3.3 Hold time, data after mCLK thCL= 50 pF minimum RL= 500 See figure 5 3.0 V and 3.6 V 9, 10,11 0.8 ns 2.7 V 0.2 Maximum clock frequency fMAXCL= 50 pF minimum RL= 500 See figure 5 3.0 V and 3.6 V 9, 10,11 160.0 MHz2.7 V 160.0 Propagation delay time, mCLK t
