1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update boilerplate to MIL-PRF-38535 requirements. - LTG 07-06-21 Thomas M. Hess REV SHET REV A A A A A SHEET 15 16 17 18 19 REV STATUS REV A A A A A A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Joseph A.
2、 Kerby DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Thanh V. Nguyen COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Monica L. Poelking AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 96-01-27
3、 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, 16-BIT BUS TRANSCEIVER AND REGISTER WITH THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-95841 SHEET 1 OF 19 DSCC FORM 2233 APR 97 5962-E423-07 Provided by IHSNot for ResaleNo reproduc
4、tion or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95841 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting o
5、f high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2
6、PIN. The PIN is as shown in the following example: 5962 - 95841 01 Q X A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and
7、V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.
8、2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54ABT16652 16-bit bus transceiver and register with three-state outputs, TTL compatible inputs 1.2.3 Device class designator. The device class designator is a single letter
9、 identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MI
10、L-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X GDFP1-F56 56 Flat pack 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38
11、535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95841 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute m
12、aximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) -0.5 V dc to +7.0 V dc DC input voltage range (VIN)(except I/O ports). -0.5 V dc to +7.0 V dc 4/ DC output voltage range (VOUT) . -0.5 V dc to +5.5 V dc 4/ DC output current (IOL) (per output) +96 mA DC input clamp current (IIK) (VIN 0.0 V). -18 mA
13、 DC output clamp current (IOK) (VOUT 0.0 V). -50 mA Output current (IVCC) 514 mA Ground current (IGND) . 1056 mA Maximum power dissipation (PD) . 598 mW 5/ Storage temperature range (TSTG) . -65C to +150C Lead temperature (soldering, 10 seconds). +300C Thermal resistance, junction-to-case (JC) . See
14、 MIL-STD-1835 Junction temperature (TJ) +175C 1.4 Recommended operating conditions. 2/ 3/ Supply voltage range (VCC) +4.5 V dc to +5.5 V dc Input voltage range (VIN) +0.0 V dc to VCCOutput voltage range (VOUT). +0.0 V dc to VCCMinimum high level input voltage (VIH). +2.0 V Maximum low level input vo
15、ltage (VIL) +0.8 V Maximum high level output current (IOH) -24 mA Maximum low level output current (IOL) . +48 mA Maximum input rise or fall rate (t/V). 10 ns/V Operating case temperature range (TC). -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The fo
16、llowing specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturin
17、g, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microci
18、rcuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) _ 1/ Stresses above the absolute maximum rating may c
19、ause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Unless otherwise noted, all voltages are referenced to GND. 3/ The limits for the parameters specified herein shall apply over the full specified VCCrange and case tempera
20、ture range of -55C to +125C. Unused inputs must be held high or low. 4/ The input and output negative voltage ratings may be exceeded provided that the input and output clamp current ratings are observed. 5/ Power dissipation values are derived using the formula PD= VCCICC+ nVOLIOL, where VCCand IOL
21、are as specified in 1.4 above, ICCand VOLare as specified in table I herein, and n represents the total number of outputs. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95841 DEFENSE SUPPLY CENTER COLUMBUS
22、COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and
23、regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The
24、 modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical di
25、mensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein. 3.2.2 Terminal con
26、nections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Ground bounce load circuit and waveforms. The ground bounce load circuit and wav
27、eforms shall be as specified on figure 4. 3.2.6 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 5. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical perform
28、ance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgrou
29、p are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking t
30、he “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark.
31、The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be requ
32、ired from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The cer
33、tificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix
34、 A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device cla
35、ss M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity r
36、etain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microci
37、rcuit group number 126 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95841 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 5 DSCC FORM 2234 A
38、PR 97 TABLE I. Electrical performance characteristics. Limits 3/ Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ -55C TC +125C +4.5 V VCC +5.5 V unless otherwise specified VCCGroup A subgroups Min Max Unit Negative input clamp voltage 3022 VIKFor input under test IIN= -18 mA 4.5 V 1, 2
39、, 3 -1.2 V 4.5 V 1, 2, 3 2.5 IOH= -3.0 mA 5.0 V 1, 2, 3 3.0 High level output voltage 3006 VOHFor all inputs affecting output under test VIN= 2.0 V or 0.8 V IOH= -24 mA 4.5 V 1, 2, 3 2.0 V Low level output voltage 3007 VOLFor all inputs affecting output under test VIN= 2.0 V or 0.8 V IOL= 48 mA 4.5
40、V 1, 2, 3 0.55 V Three-state output leakage current high 3021 IOZH4/ 5/ For control inputs affecting output under test, VIN= 2.0 V or 0.8 V VOUT= 2.7 V 5.5 V 1, 2, 3 10 A Three-state output leakage current low 3020 IOZL4/ 5/ For control inputs affecting output under test, VIN= 2.0 V or 0.8 V VOUT= 0
41、.5 V 5.5 V 1, 2, 3 -10 A Control inputs 1, 2, 3 +1.0 Input current high 3010 IIH6/ For input under test VIN= VCCA or B ports 5.5 V 1, 2, 3 +20.0 A Control inputs 1, 2, 3 -1.0 Input current low 3009 IIL6/ For input under test VIN= GND A or B ports 5.5 V 1, 2, 3 -20.0 A Off-state leakage current IOFFF
42、or input or output under test VINor VOUT= 4.5 V 0.0 V 1 100 A High-state leakage current ICEXFor output under test VOUT= 5.5 V Outputs at high logic state 5.5 V 1, 2, 3 50 A Output current 3011 IO7/ VOUT= 2.5 V 5.5 V 1, 2, 3 -50 -180 mA Outputs high 5.5 V 1, 2, 3 2.0 Outputs low 5.5 V 1, 2, 3 32.0 Q
43、uiescent supply current 3005 ICCFor all inputs VIN= VCCor GND IOUT= 0 A Outputs disabled 5.5 V 1, 2, 3 2.0 mA Data inputs, Outputs enabled 5.5 V 1, 2, 3 50.0 Data inputs, Outputs disabled 5.5 V 1, 2, 3 50.0 Quiescent supply current delta, TTL input level ICC8/ For input under test VIN= 3.4 V For all
44、 other inputs VIN= VCCor GND Control inputs 5.5 V 1, 2, 3 50.0 A See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95841 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 R
45、EVISION LEVEL A SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Limits 3/ Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ -55C TC +125C +4.5 V VCC +5.5 V unless otherwise specified VCCGroup A subgroups Min Max Unit Input capacitance 3012 CINTC
46、= +25C, VIN= 2.5 V or 0.5 V See 4.4.1c 5.0 V 4 10.5 pF I/O port capacitance 3012 CI/OTC= +25C, VOUT= 2.5 V or 0.5 V See 4.4.1c 5.0 V 4 14.5 pF Low level ground bounce noise VOLP9/ 5.0 V 4 880mV Low level ground bounce noise VOLV9/ 5.0 V 4 -1250mV High level VCCbounce noise VOHP9/ 5.0 V 4 1375mV High
47、 level VCCbounce noise VOHV9/ VIH= 3.0 V, VIL= 0.0 V TA= +25C See figure 4 See 4.4.1d 5.0 V 4 -550mV 4.5 V 7, 8 L H Functional test 3014 10/ VIH= 2.0 V, VIL= 0.8 V Verify output VOSee 4.4.1b 5.5 V 7, 8 L H 5.0 V 9 4.3 Pulse duration, CLK high or low twCL= 50 pF minimum RL= 500 See figure 5 4.5 V and
48、 5.5 V 10, 11 4.3 ns 5.0 V 9 3.5 Setup time, high or low, mAn before mCLKAB or mBn before mCLKBA tsCL= 50 pF minimum RL= 500 See figure 5 4.5 V and 5.5 V 10, 11 4.0 ns 5.0 V 9 0.5 Hold time, high or low, mAn after mCLKBA or mBn after mCLKAB thCL= 50 pF minimum RL= 500 See figure 5 4.5 V and 5.5 V 10, 11 0.5 ns 5.0 V 9 125 Maximum operating frequency fMAXCL= 50 pF minimum RL= 500 See figure 5 4.5 V and 5.5 V 10, 11 125 MHz 5.0 V 9 1.5 4.0 tPLH111/ CL= 50 pF minimum RL= 500 See figure 5 4.5 V and 5.5 V 10, 11 1.0 5.0 ns 5.0 V 9 1.5 4.1 Propagation delay time, mCLKAB to
