1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add case outline X. Update thermal resistance data in paragraph 1.3. Change to output voltage range test in table I. - rrp 98-09-10 R. MONNIN B Drawing updated to reflect current requirements. gt 02-12-31 R. MONNIN C Update case outline letter X
2、descriptive designator under paragraph 1.2.4 and delete figure 1. - ro 08-07-28 R. HEBER D Add device type 02. Make changes to paragraphs 1.2.2, 1.2.4, and 1.3. Make changes to Table I and figure 1. rrp 12-07-30 C. SAFFLE REV SHEET REV SHEET REV STATUS REV D D D D D D D D D D OF SHEETS SHEET 1 2 3 4
3、 5 6 7 8 9 10 PMIC N/A PREPARED BY RAJESH PITHADIA DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY RAJESH PITHADIA APPROVED BY MIC
4、HAEL A. FRYE MICROCIRCUIT, LINEAR, LOW DROPOUT VOLTAGE REGULATOR, MONOLITHIC SILICON DRAWING APPROVAL DATE 96-07-05 AMSC N/A REVISION LEVEL D SIZE A CAGE CODE 67268 5962-96505 SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E022-12 Provided by IHSNot for ResaleNo reproduction or networking permitted withou
5、t license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96505 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M)
6、and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following ex
7、ample: 5962 - 96505 01 Q E A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2) Device class designator Case outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-3853
8、5 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) ide
9、ntify the circuit function as follows: Device type 1/ Generic number Circuit function 01 LM2991WG Negative, low dropout, adjustable regulator 02 LM2991GW Negative, low dropout, adjustable regulator 1.2.3 Device class designator. The device class designator is a single letter identifying the product
10、assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case ou
11、tline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line X 1/ GDFP1-G16 16 Flat pack with gullwing leads 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 f
12、or device classes Q and V or MIL-PRF-38535, appendix A for device class M. 1/ For case outline X, package material for device type 01 is aluminum nitride and package material for device type 02 is aluminum oxide. Provided by IHSNot for ResaleNo reproduction or networking permitted without license fr
13、om IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96505 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 2/ Input voltage -26 V to +0.3 V Power dissipation (PD) Internally limited 3/ Storage temperature range (TSTG) . -65
14、C to +150C Lead temperature (soldering, 10 seconds) +260C Junction temperature (TJ) . +150C Thermal resistance, junction-to-case (JC): Case E . 5C/W Case X (Device type 01) 1/ 3C/W Case X (Device type 02) 1/ 6C/W Thermal resistance, junction-to-ambient (JA): Case E . 75C/W still air at 0.5 W 35C/W 5
15、00 linear feet per minute (LFPM) at 0.5 W Case X (Device type 01) 1/ . 119C/W still air at 0.5 W 73C/W 500 linear feet per minute (LFPM) at 0.5 W Case X (Device type 02) 1/ . 130C/W still air at 0.5 W 80C/W 500 linear feet per minute (LFPM) at 0.5 W 1.4 Recommended operating conditions. Maximum inpu
16、t voltage (operational) . -26 V Ambient operating temperature range (TA) . -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise
17、specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835
18、- Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.dla.mil/quicksearch/ or from the Standardiza
19、tion Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) _ 2/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 3/ The maximum power dissipation
20、 is a function of TJMAX, JA, and TA. The maximum allowable power dissipation at any ambient temperature is PD= (TJMAX- TA) / JA. If this dissipation is exceeded, the die temperature will rise above +125C, and the device will eventually go into thermal shutdown at a TJof approximately +160C. Provided
21、 by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96505 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 4 DSCC FORM 2234 APR 97 2.2 Order of precedence. In the event of a conflict between the tex
22、t of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for devic
23、e classes Q and V shall be in accordance with MIL-PRF-38535 as specified herein, or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class
24、 M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL
25、-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.3 Electrical performance characteristics and postirradiation parameter limi
26、ts. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgro
27、ups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to spa
28、ce limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with
29、MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For d
30、evice classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an appro
31、ved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38
32、535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of m
33、icrocircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DLA Land and Maritime -VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification
34、 and review for device class M. For device class M, DLA Land and Maritime, DLA Land and Maritimes agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of th
35、e reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 52 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICRO
36、CIRCUIT DRAWING SIZE A 5962-96505 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Refer
37、ence voltage VREF5 mA IO 1 A 1 01,02 -1.234 -1.186 V 5 mA IO 1 A, VO- 1 V VIN - 26 V 2, 3 -1.27 -1.15 Output voltage range VOVIN= -10 V 1 01,02 -3 V VIN= -26 V -24 VIN= -26 V 2, 3 -25 Load regulation VRLD50 mA IO 1 A 1 01,02 -12 12 mV 2, 3 -15 15 Line regulation VRLNIO= 5 mA, VO- 1 V VIN - 26 V 1, 2
38、, 3 01,02 -26 26 mV Dropout voltage VDOIO= 0.1 A, 1 01,02 0.2 V VO 100 mV 2, 3 0.3 IO= 1 A, 1 0.8 VO 100 mV 2, 3 1 Quiescent current IQIO 1 A 1, 2, 3 01,02 5 mA Dropout quiescent current IDQIO 1 A, VIN= VO1, 2, 3 01,02 50 mA Rejection ratio RR VRIPPLE= 1 V, FRIPPLE= 1 kHz, IO= 5 mA 1 01,02 50 dB Out
39、put noise voltage VON10 Hz - 100 kHz, 1 01,02 450 V IO= 5 mA 2, 3 500 ON /OFF input voltage - VOUT: ON 1, 2, 3 01 0.8 V 02 0.6 VOUT: OFF 01,02 2.4 See footnote at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRA
40、WING SIZE A 5962-96505 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions 1/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max ON /
41、OFF input current - V ON /OFF = 0.6 V, 1 01,02 10 A VOUT: ON 2, 3 25 V ON /OFF = 2.4 V, 1 100 VOUT: OFF 2, 3 150 Output leakage current - VIN= -26 V, VOUT= 0 V, 1 01,02 250 A V ON /OFF = 2.4 V 2, 3 300 Current limit - VOUT= 0 V 1 01,02 1.5 2.5 A 2, 3 1.0 4.0 1/ Unless otherwise specified, VIN= -10 V
42、, VO= -3 V, IO= 1 A, CO= 47 F, RL= 2.7 k. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96505 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 7 DSCC FORM 2234 APR 97 Device type 01 01
43、, 02 Case outlines E X Terminal number Terminal symbol 1 NC NC 2 NC ADJUST 3 INPUT ON /OFF 4 ON / OFF GND 5 GND NC 6 OUTPUT NC 7 NC OUTPUT 8 NC NC 9 NC NC 10 NC NC 11 NC NC 12 NC NC 13 NC NC 14 ADJUST NC 15 NC NC 16 NC INPUT NC = No connection. FIGURE 1. Terminal connections. Provided by IHSNot for
44、ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96505 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 8 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling
45、and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall b
46、e in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance wit
47、h method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under doc
48、ument revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein. 4.2.2 Additional criteria for device classes Q and V. a. The burn-in test duration
