DLA SMD-5962-96702 REV B-2000 MICROCIRCUIT DIGITAL RADIATION HARDENED CMOS DUAL PRECISION MONOSTABLE MULTIVIBRATOR MONOLITHIC SILICON《抗辐射互补金属氧化物半导体 双重精密单稳多谐振荡器 硅单片电路数字微电路》.pdf

上传人:feelhesitate105 文档编号:701031 上传时间:2019-01-01 格式:PDF 页数:21 大小:109.54KB
下载 相关 举报
DLA SMD-5962-96702 REV B-2000 MICROCIRCUIT DIGITAL RADIATION HARDENED CMOS DUAL PRECISION MONOSTABLE MULTIVIBRATOR MONOLITHIC SILICON《抗辐射互补金属氧化物半导体 双重精密单稳多谐振荡器 硅单片电路数字微电路》.pdf_第1页
第1页 / 共21页
DLA SMD-5962-96702 REV B-2000 MICROCIRCUIT DIGITAL RADIATION HARDENED CMOS DUAL PRECISION MONOSTABLE MULTIVIBRATOR MONOLITHIC SILICON《抗辐射互补金属氧化物半导体 双重精密单稳多谐振荡器 硅单片电路数字微电路》.pdf_第2页
第2页 / 共21页
DLA SMD-5962-96702 REV B-2000 MICROCIRCUIT DIGITAL RADIATION HARDENED CMOS DUAL PRECISION MONOSTABLE MULTIVIBRATOR MONOLITHIC SILICON《抗辐射互补金属氧化物半导体 双重精密单稳多谐振荡器 硅单片电路数字微电路》.pdf_第3页
第3页 / 共21页
DLA SMD-5962-96702 REV B-2000 MICROCIRCUIT DIGITAL RADIATION HARDENED CMOS DUAL PRECISION MONOSTABLE MULTIVIBRATOR MONOLITHIC SILICON《抗辐射互补金属氧化物半导体 双重精密单稳多谐振荡器 硅单片电路数字微电路》.pdf_第4页
第4页 / 共21页
DLA SMD-5962-96702 REV B-2000 MICROCIRCUIT DIGITAL RADIATION HARDENED CMOS DUAL PRECISION MONOSTABLE MULTIVIBRATOR MONOLITHIC SILICON《抗辐射互补金属氧化物半导体 双重精密单稳多谐振荡器 硅单片电路数字微电路》.pdf_第5页
第5页 / 共21页
点击查看更多>>
资源描述

1、REVISIONSLTR DESCRIPTION DATE (YR-MO-DA) APPROVEDA Changes in accordance with NOR 5962-R015-98. 98-01-07 Monica L. PoelkingB Update boilerplate to MIL-PRF-38535 and updated appendix A. Editorialchanges throughout. - tmh00-06-06 Monica L. PoelkingREVSHEETREV BBBBBBSHEET 15 16 17 18 19 20REV STATUS RE

2、V BBBBBBBBBBBBBBOF SHETS SHET 123456789101121314PMIC N/A PREPARED BY Rick C. OfficerDEFENSE SUPPLY CENTER COLUMBUSSTANDARDMICROCIRCUITDRAWINGCHECKED BYMonica L. PoelkingCOLUMBUS, OHIO 43216THIS DRAWING IS AVAILABLEFOR USE BY ALLDEPARTMENTSAPPROVED BYMonica L. PoelkingAND AGENCIES OF THEDEPARTMENT OF

3、 DEFENSEDRAWING APPROVAL DATE95-12-06MICROCIRCUIT, DIGITAL, RADIATIONHARDENED CMOS, DUAL PRECISIONMONOSTABLE MULTIVIBRATOR, MONOLITHICSILICONAMSC N/AREVISION LEVELBSIZEACAGE CODE672685962-96702SHEET1 OF 20DSCC FORM 2233APR 97 5962-E263-00DISTRIBUTION STATEMENT A. Approved for public release; distrib

4、ution is unlimited.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA5962-96702DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000REVISION LEVELBSHEET2DSCC FORM 2234APR 971. SCOPE1.1 Scope. This drawing documents tw

5、o product assurance class levels consisting of high reliability (device classes Q andM) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in thePart or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance

6、 (RHA) levels are reflected in thePIN.1.2 PIN. The PIN is as shown in the following example:5962 R 96702 01 V X CG0DG0D G0DG0D G0DG0DG0DG0D G0DG0D G0DG0DG0DG0D G0D G0D G0D G0DFederal RHA Device Device Case Lead stock class designator type class outline finishdesignator (see 1.2.1) (see 1.2.2) design

7、ator (see 1.2.4) (see 1.2.5) / (see 1.2.3)/ Drawing number1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels andare marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix Aspecified RHA l

8、evels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.1.2.2 Device type(s). The device type(s) identify the circuit function as follows:Device type Generic number Circuit function01 14538B Radiation hardened CMOS dualprecision monostable multivibrator 1.2.3

9、Device class designator. The device class designator is a single letter identifying the product assurance level asfollows:Device class Device requirements documentationM Vendor self-certification to the requirements for MIL-STD-883 compliant,non-JAN class level B microcircuits in accordance with MIL

10、-PRF-38535,appendix AQ or V Certification and qualification to MIL-PRF-385351.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:Outline letter Descriptive designator Terminals Package styleE CDIP2-T16 16 dual-in-line packageX CDFP4-F16 16 flat package1.2.5 Lea

11、d finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,appendix A for device class M.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA5962-96702DEFENSE SUPPLY CENTER COLU

12、MBUSCOLUMBUS, OHIO 43216-5000REVISION LEVELBSHEET3DSCC FORM 2234APR 971.3 Absolute maximum ratings. 1/ 2/ 3/Supply voltage range (VDD).-0.5 V dc to +20 V dcInput voltage range -0.5 V dc to VDD + 0.5 V dcDC input current, any one input 10 mADevice dissipation per output transistor100 mWStorage temper

13、ature range (TSTG)-65C to +150CLead temperature (soldering, 10 seconds). +265CThermal resistance, junction-to-case (JC):Case E. 24C/WCase X. 29C/WThermal resistance, junction-to-ambient (JA):Case E. 73C/WCase X. 114C/WJunction temperature (TJ). +175CMaximum power dissipation at TA = +125C (PD): 4/Ca

14、se E. 0.68 WCase X. 0.44 W1.4 Recommended operating conditions.Supply voltage range (VDD). 3.0 V dc to +18 V dcCase operating temperature range (TC) . -55C to +125CInput voltage (VIN). 0 V to VDDOutput voltage (VOUT) . 0 V to VDDRadiation features:Total dose . 1 x 105Rads (Si)Single event phenomenon

15、 (SEP) effectivelinear energy threshold, no upsets or latchup (see 4.4.4.4). 75 MEV/(cm2/mg) 5/Dose rate upset (20 ns pulse) 5 x 108 Rads(Si)/s 5/Dose rate latch-up . 2 x 108Rads(Si)/s 5/Dose rate survivability . 5 x 1011Rads(Si)/s 5/2. APPLICABLE DOCUMENTS2.1 Government specification, standards, an

16、d handbooks. The following specification, standards, and handbooks form apart of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed inthe issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplem

17、ent thereto, cited in thesolicitation.SPECIFICATIONDEPARTMENT OF DEFENSEMIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.STANDARDSDEPARTMENT OF DEFENSEMIL-STD-883 - Test Method Standard Microcircuits.MIL-STD-973 - Configuration Management.MIL-STD-1835 - Interface Standar

18、d For Microcircuit Case Outlines.1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at themaximum levels may degrade performance and affect reliability.2/ Unless otherwise specified, all voltages are referenced to VSS.3/ The limits for the para

19、meters specified herein shall apply over the full specified VCC range and case temperature range of -55C to +125C unless otherwise noted.4/ If device power exceeds package dissipation capability, provide heat sinking or derate linearly (the derating isbased on JA) at the following rate:Case E 13.7 m

20、W/CCase X 8.8 mW/C5/ Guaranteed by design or process but not tested.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA5962-96702DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000REVISION LEVELBSHEET4DSCC FORM 2234A

21、PR 97HANDBOOKSDEPARTMENT OF DEFENSEMIL-HDBK-103 - List of Standard Microcircuit Drawings (SMDs).MIL-HDBK-780 - Standard Microcircuit Drawings.(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the StandardizationDocument Order Desk, 700 Robbins Aven

22、ue, Building 4D, Philadelphia, PA 19111-5094.)2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the textof this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless aspecific

23、 exemption has been obtained.3. REQUIREMENTS3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance withMIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. Themodification in the QM plan shal

24、l not affect the form, fit, or function as described herein. The individual item requirements fordevice class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specifiedherein.3.1.1 Microcircuit die. For the requirements for microcircuit die, see append

25、ix A to this document.3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specifiedin MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.3.2.1 Case outlines. The case outlines sha

26、ll be in accordance with 1.2.4 herein.3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.3.2.3 Radiation exposure circuit. The radiation test connections shall be as specified in table III herein.3.3 Electrical performance characteristics and postirradiation param

27、eter limits. Unless otherwise specified herein, theelectrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the fullcase operating temperature range.3.4 Electrical test requirements. The electrical test requirements shall be the sub

28、groups specified in table II. The electricaltests for each subgroup are defined in table I.3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also bemarked as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number

29、is not feasible due to spacelimitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, theRHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shal

30、l be in accordance with MIL-PRF-38535, appendix A.3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required inMIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A.3.6 Certificate

31、 of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate ofcompliance shall be required from a manufacturer in order to be

32、 listed as an approved source of supply in MIL-HDBK-103 (see6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for thisdrawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38

33、535and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V inMIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of micr

34、ocircuits deliveredto this drawing.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA5962-96702DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000REVISION LEVELBSHEET5DSCC FORM 2234APR 973.8 Notification of change f

35、or device class M. For device class M, notification to DSCC-VA of change of product (see 6.2herein) involving devices acquired to this drawing is required for any change as defined in MIL-STD-973.3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring

36、 activity retainthe option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be madeavailable onshore at the option of the reviewer.3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in

37、microcircuit group number 39 (see MIL-PRF-38535, appendix A).4. QUALITY ASSURANCE PROVISIONS4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance withMIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. Th

38、e modification in the QM planshall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall bein accordance with MIL-PRF-38535, appendix A.4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, an

39、d shall be conductedon all devices prior to qualification and technology conformance inspection. For device class M, screening shall be inaccordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection.4.2.1 Additional criteria for device cla

40、ss M.a. Burn-in test, method 1015 of MIL-STD-883.(1) Test condition A, B, C or D. The test circuit shall be maintained by the manufacturer under document revisionlevel control and shall be made available to the preparing or acquiring activity upon request. The test circuit shallspecify the inputs, o

41、utputs, biases, and power dissipation, as applicable, in accordance with the intent specified intest method 1015.(2) TA = +125C, minimum.b. Interim and final electrical test parameters shall be as specified in table IIA herein.4.2.2 Additional criteria for device classes Q and V.a. The burn-in test

42、duration, test condition and test temperature, or approved alternatives shall be as specified in thedevice manufacturers QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained underdocument revision level control of the device manufacturers Technology Review Board (TR

43、B) in accordance withMIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shallspecify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in testmethod 1015 of MIL-STD-883.b. Interim an

44、d final electrical test parameters shall be as specified in table IIA herein.c. Additional screening for device class V beyond the requirements of device class Q shall be as specified inMIL-PRF-38535, appendix B.4.3 Qualification inspection for device classes Q and V. Qualification inspection for de

45、vice classes Q and V shall be inaccordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein forgroups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4).4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be

46、 in accordance withMIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified herein except where option 2 ofMIL-PRF-38535 permits alternate in-line control testing. Quality conformance inspection for device class M shall be inaccordance with MIL-PRF-38535, appendix A and as speci

47、fied herein. Inspections to be performed for device class M shall bethose specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4).Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMI

48、CROCIRCUIT DRAWINGSIZEA5962-96702DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000REVISION LEVELBSHEET6DSCC FORM 2234APR 97TABLE I. Electrical performance characteristics.LimitsTest SymbolConditions-55C 4.5 V, VOL 9.0 V, VOL 13.5 V, VOL 4.5 V, VOL 9.0 V, VOL 13.5 V, VOL VDD/2VOL VDD/2VInput ca

49、pacitance CIN 1/ Any input, See 4.4.1c All 4 7.5 pF9 600VDD = 5 V, VIN = VDD or GND10, 11 810M, D, L, R 2/ 9 810VDD = 10 V, VIN = VDD or GND 9 1/ 300Propagation delay 4/time, +TR or -TR to Qor QtPHL1,tPLH1VDD = 15 V, VIN = VDD or GNDAll9 1/ 220ns9 500VDD = 5 V, VIN = VDD or GND10, 11 675M, D, L, R 2/ 9 675VDD = 10 V, VIN = VDD or

展开阅读全文
相关资源
猜你喜欢
  • DIN ETS 300493-1997 Transmission and Multiplexing (TM) - Synchronous Digital Hierarchy (SDH) information model of the Sub Network Connection Protection (SNCP) for the Network Eleme.pdf DIN ETS 300493-1997 Transmission and Multiplexing (TM) - Synchronous Digital Hierarchy (SDH) information model of the Sub Network Connection Protection (SNCP) for the Network Eleme.pdf
  • DIN ETS 300495-1998 Broadband Integrated Services Digital Network (B-ISDN) - Signalling system No 7 - Interworking between Broadband ISDN User Part (B-ISUP) and Digital Subscriber  .pdf DIN ETS 300495-1998 Broadband Integrated Services Digital Network (B-ISDN) - Signalling system No 7 - Interworking between Broadband ISDN User Part (B-ISUP) and Digital Subscriber .pdf
  • DIN ETS 300496-1998 Broadband Integrated Services Digital Network (B-ISDN) - Signalling system No 7 - Interworking between Broadband ISDN User Part (B-ISUP) and narrowband ISDN Use.pdf DIN ETS 300496-1998 Broadband Integrated Services Digital Network (B-ISDN) - Signalling system No 7 - Interworking between Broadband ISDN User Part (B-ISUP) and narrowband ISDN Use.pdf
  • DIN ETS 300498-1-1997 Open Document Architecture (ODA) - ODA communication services - Part 1 Basic services English version ETS 300498-1 1996《开放式文件体系结构(ODA) ODA通信服务 第1部分 基本服务》.pdf DIN ETS 300498-1-1997 Open Document Architecture (ODA) - ODA communication services - Part 1 Basic services English version ETS 300498-1 1996《开放式文件体系结构(ODA) ODA通信服务 第1部分 基本服务》.pdf
  • DIN ETS 300498-2-1999 Open Document Architecture (ODA) - ODA communication services - Part 2 Joint synchronous editing joint document presentation viewing (Endorsement of the Engli.pdf DIN ETS 300498-2-1999 Open Document Architecture (ODA) - ODA communication services - Part 2 Joint synchronous editing joint document presentation viewing (Endorsement of the Engli.pdf
  • DIN ETS 300499-1998 Radio Equipment and Systems (RES) - Digital Enhanced Cordless Telecommunications Global System for Mobile communications (DECT GSM) interworking profile - Mobil.pdf DIN ETS 300499-1998 Radio Equipment and Systems (RES) - Digital Enhanced Cordless Telecommunications Global System for Mobile communications (DECT GSM) interworking profile - Mobil.pdf
  • DIN ETS 300500-1996 European digital cellular telecommunications system (Phase 2) - Principles of telecommunication services supported by a GSM Public Land Mobile Network (PLMN) En.pdf DIN ETS 300500-1996 European digital cellular telecommunications system (Phase 2) - Principles of telecommunication services supported by a GSM Public Land Mobile Network (PLMN) En.pdf
  • DIN ETS 300501-1995 European digital cellular telecommunications system (Phase 2) - Bearer services supported by a GSM Public Land Mobile Network (PLMN) English version ETS 300501 .pdf DIN ETS 300501-1995 European digital cellular telecommunications system (Phase 2) - Bearer services supported by a GSM Public Land Mobile Network (PLMN) English version ETS 300501 .pdf
  • DIN ETS 300502-1995 European digital cellular telecommunications system (Phase 2) - Teleservices supported by a GSM Public Land Mobile Network (PLMN) English version ETS 300502 199.pdf DIN ETS 300502-1995 European digital cellular telecommunications system (Phase 2) - Teleservices supported by a GSM Public Land Mobile Network (PLMN) English version ETS 300502 199.pdf
  • 相关搜索

    当前位置:首页 > 标准规范 > 国际标准 > 其他

    copyright@ 2008-2019 麦多课文库(www.mydoc123.com)网站版权所有
    备案/许可证编号:苏ICP备17064731号-1