DLA SMD-5962-96853 REV C-2008 MICROCIRCUIT DIGITAL ADVANCED HIGH SPEED CMOS OCTAL TRANSPARENT D-TYPE FLIP-FLOP WITH 3-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf

上传人:lawfemale396 文档编号:701134 上传时间:2019-01-01 格式:PDF 页数:18 大小:191.92KB
下载 相关 举报
DLA SMD-5962-96853 REV C-2008 MICROCIRCUIT DIGITAL ADVANCED HIGH SPEED CMOS OCTAL TRANSPARENT D-TYPE FLIP-FLOP WITH 3-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf_第1页
第1页 / 共18页
DLA SMD-5962-96853 REV C-2008 MICROCIRCUIT DIGITAL ADVANCED HIGH SPEED CMOS OCTAL TRANSPARENT D-TYPE FLIP-FLOP WITH 3-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf_第2页
第2页 / 共18页
DLA SMD-5962-96853 REV C-2008 MICROCIRCUIT DIGITAL ADVANCED HIGH SPEED CMOS OCTAL TRANSPARENT D-TYPE FLIP-FLOP WITH 3-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf_第3页
第3页 / 共18页
DLA SMD-5962-96853 REV C-2008 MICROCIRCUIT DIGITAL ADVANCED HIGH SPEED CMOS OCTAL TRANSPARENT D-TYPE FLIP-FLOP WITH 3-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf_第4页
第4页 / 共18页
DLA SMD-5962-96853 REV C-2008 MICROCIRCUIT DIGITAL ADVANCED HIGH SPEED CMOS OCTAL TRANSPARENT D-TYPE FLIP-FLOP WITH 3-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf_第5页
第5页 / 共18页
点击查看更多>>
资源描述

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with NOR 5962-R350-97. - JAK 97-06-27 Monica L. Poelking B Changes in accordance with NOR 5962-R447-97. - CFS 97-09-16 Monica L. Poelking C Update boilerplate to current MIL-PRF-38535 requirements. - MAA 08-05-20 Thomas M. H

2、ess REV SHEET REV SHEET REV C C C SHEET 15 16 17 REV C C C C C C C C C C C C C C REV STATUS OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Ronald Couch CHECKED BY Rajesh. Pithadia DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218 - 3990 http:/www.dscc.dla.mil APPROVED BY Ray

3、mond Monnin DRAWING APPROVAL DATE 96-08-12 MICROCIRCUIT, DIGITAL, ADVANCED HIGH SPEED CMOS, OCTAL TRANSPARENT D-TYPE FLIP-FLOP WITH 3-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON SIZE A CAGE CODE 67268 5962-96853 STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPA

4、RTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A REVISION LEVEL C SHEET 1 OF 17 DSCC FORM 2233 APR 97 5962-E386-08 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SIZE A 5962-96853 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBU

5、S COLUMBUS, OHIO 43218 - 3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are a

6、vailable and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 96853 01 Q R A Federal RHA Device Device Case Lead stock class designator t

7、ype class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M

8、 RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54A

9、HCT574 Octal Transparent D-type Flip-Flop with 3-state outputs, TTL compatible inputs 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the re

10、quirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive desi

11、gnator Terminals Package style R GDIP1-T20 or CDIP2-T20 20 Dual-in-line S GDFP2-F20 or CDFP3-F20 20 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Pr

12、ovided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SIZE A 5962-96853 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218 - 3990 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply volt

13、age range (VCC) -0.5 V dc to +7.0 V dc DC input voltage range (VIN) -0.5 V dc to +7.0 V dc 4/ DC output voltage range (VOUT) . -0.5 V dc to VCC+ 0.5 V dc 4/ DC input clamp current (IIK) (VINVCC) . -20 mA DC output clamp current (IOK) (VOUTVCC). 20 mA Continuous output current (IOUT) (VOUT= 0.0 V to

14、VCC) 25 mA Continuous current through VCCor GND 75 mA Maximum power dissipation at TA= +55C (in still air) (PD ) 700 mW Storage temperature range (TSTG) . -65C to +150C Lead temperature (soldering, 10 seconds). +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (

15、TJ) +175C 1.4 Recommended operating conditions. 2/ 3/ Supply voltage range (VCC) +4.5 V dc to +5.5 V dc Minimum high level input voltage (VIH). +2.0 V Maximum low level input voltage (VIL) +0.8 V Input voltage range (VIN) +0.0 V dc to 5.5 V Output voltage range (VOUT). +0.0 V dc to VCCMaximum high l

16、evel output current (IOH) -8 mA Maximum low level output current (IOL) +8 mA Maximum input rise or fall rate (t/V) 20 ns/V Case operating temperature range (TC). -55C to +125C 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum le

17、vels may degrade performance and affect reliability. 2/ Unless otherwise noted, all voltages are referenced to GND. 3/ The limits of the parameters specified herein shall apply over the full specified VCCrange and case temperature range of -55C to +125C. Unused inputs must be held high or low 4/ The

18、 input and output voltage ratings may be exceeded provided that the input and output current ratings are observed. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SIZE A 5962-96853 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS

19、, OHIO 43218 - 3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues

20、of these documents are those cited in the solicitation. or contract DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard E

21、lectronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Orde

22、r Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. EL

23、ECTRONIC INDUSTRIES ALLIANCE (EIA) JESD 7A - Standard for Description of 54/74HCXXXX and 54/74HCTXXXX High-Speed CMOS Devices. (Copies of these documents are available online at http:/www.eia.org/ or from the Electronic Industries Alliance, 2500 Wilson Boulevard, Arlington, VA 22201-3834.) 2.3 Order

24、 of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Ite

25、m requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as descri

26、bed herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified

27、in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth tabl

28、e. The truth table shall be as specified on figure 2. 3.2.4 Block or Logic diagram. The block or logic diagram shall be as specified on figure 3. 3.2.5 Ground bounce load circuit and waveforms. The ground bounce load circuit and waveforms shall be as specified on figure 4. 3.2.6 Switching waveforms

29、and test circuit. The switching waveforms and test circuit shall be as specified on figure 5. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SIZE A 5962-96853 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218 - 3990 R

30、EVISION LEVEL C SHEET 5 DSCC FORM 2234 APR 97 3.3 Electrical performance characteristics and post-irradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and post-irradiation parameter limits are as specified in table I and shall apply over the ful

31、l case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, th

32、e manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for

33、 device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compli

34、ance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein

35、). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shal

36、l affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V

37、 in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired

38、 to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentatio

39、n shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 36 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking

40、permitted without license from IHS-,-,-SIZE A 5962-96853 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218 - 3990 REVISION LEVEL C SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Limits 3/ Test and MIL-STD-883 test method 1/ Symbol Test

41、conditions 2/ -55C TC +125C +4.5 V VCC +5.5 V unless otherwise specified VCCGroup A subgroups Min Max Unit IOH= -50 A 1, 2, 3 4.4 1 3.94 High level output voltage 3006 VOHFor all inputs affecting output under test, VIN= 2.0 V or 0.8 VFor all other inputs, VIN= VCCor GND IOH= -8 mA 4.5 V 2, 3 3.8 V I

42、OL= +50 A 1, 2, 3 0.1 1 0.36 Low level output voltage 3007 VOLFor all inputs affecting output under test, VIN= 2.0 V or 0.8 VFor all other inputs, VIN= VCCor GND IOL= +8 mA 4.5 V 2, 3 0.44 V 1 +0.1 Input current high 3010 IIHFor input under test, VIN= VCCFor all other inputs, VIN= VCCor GND 5.5 V 2,

43、 3 +1.0 A 1 -0.1 Input current low 3009 IILFor input under test, VIN= GND For all other inputs, VIN= VCCor GND 5.5 V 2, 3 -1.0 A 1 +0.25 Three-state output leakage current high 3021 IOZH 4/ VOUT= VCC5.5 2, 3 +2.5 A 1 -0.25 Three-state output leakage current low 3020 IOZL 4/ VOUT= GND 5.5 2, 3 -2.5 A

44、 1 4.0 Quiescent supply current 3005 ICCFor all inputs, VIN= VCCor GND IOUT= 0.0 A 5.5 V 2, 3 40.0 A 1 1.35 Quiescent supply current delta, TTL input levels 3005 ICC5/ For input at 3.4 V Other inputs at VCCor GND 5.5 V 2, 3 1.5 mA Input capacitance 3012 CINTC= +25C, VIN= VCCor GND See 4.4.1c 5.0 V 4

45、 10.0 pF Output capacitance COUTTC= +25C, VOUT= VCCor GND See 4.4.1c 5.0 V 4 10.0 pF Power dissipation capacitance CPD6/ CL= 50 pF minimum f = 1 MHz See 4.4.1c 5.0 V 4 30.0 pF See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS

46、-,-,-SIZE A 5962-96853 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218 - 3990 REVISION LEVEL C SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Limits 3/ Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ -55C TC

47、+125C +4.5 V VCC +5.5 V unless otherwise specified VCCGroup A subgroups Min Max Unit VOLP7/ 5.0 V 4 1.5 V Low level ground bounce noise VOLV7/ 5.0 V 4 -1.5 V VOHP7/ 5.0 V 4 0.75 V High level VCCbounce noise VOHV7/ VIH= 3.0 V, VIL= 0.0 V TA= +25C See 4.4.1d See figure 4 5.0 V 4 -1.25 V 4.5 V Function

48、al test 3014 8/ VIH= 2.0 V, VIL= 0.8 V Verify output VOSee 4.4.1b 5.5 V 7, 8 L H 9 5.0 Pulse duration, CLK high or low twCL= 50 pF minimum RL= 500 See figure 5 4.5 V and 5.5 V 10, 11 5.5 ns 9 3.0 Setup time, data before CLK tsuCL= 50 pF minimum RL= 500 See figure 5 4.5 V and 5.5 V 10, 11 3.5 ns Hold time, data after CLK thCL= 50 pF minimum RL= 500 See figure 5 4.5 V and 5.5 V 9, 10, 11 1.5 ns 9 130 CL= 15 pF minimum RL= 500 See figure 5 4.5 V and 5.5 V 10, 11 110 9 85 Maximum operatin

展开阅读全文
相关资源
猜你喜欢
  • DIN CWA 14050-16-2001 en 5264 Extensions for Financial Services (XFS) interface specification - Release 3 0 - Part 16 Application Programming Interface (API) Service Provider Inter.pdf DIN CWA 14050-16-2001 en 5264 Extensions for Financial Services (XFS) interface specification - Release 3 0 - Part 16 Application Programming Interface (API) Service Provider Inter.pdf
  • DIN CWA 14050-17-2001 en 9920 Extensions for Financial Services (XFS) interface specification - Release 3 0 - Part 17 Printer device class interface Migration from Version 2 0 (see.pdf DIN CWA 14050-17-2001 en 9920 Extensions for Financial Services (XFS) interface specification - Release 3 0 - Part 17 Printer device class interface Migration from Version 2 0 (see.pdf
  • DIN CWA 14050-18-2001 en 5216 Extensions for Financial Services (XFS) interface specification - Release 3 0 - Part 18 Identification card device class interface Migration from Vers.pdf DIN CWA 14050-18-2001 en 5216 Extensions for Financial Services (XFS) interface specification - Release 3 0 - Part 18 Identification card device class interface Migration from Vers.pdf
  • DIN CWA 14050-19-2001 en 6554 Extensions for Financial Services (XFS) interface specification - Release 3 0 - Part 19 Cash dispenser device class interface Migration from Version 2.pdf DIN CWA 14050-19-2001 en 6554 Extensions for Financial Services (XFS) interface specification - Release 3 0 - Part 19 Cash dispenser device class interface Migration from Version 2.pdf
  • DIN CWA 14050-2-2001 Extensions for Financial Services (XFS) interface specification - Release 3 0 - Part 2 Service classes definition (Englisch version CWA 14050-2 2000)《金融服务辅助设备接.pdf DIN CWA 14050-2-2001 Extensions for Financial Services (XFS) interface specification - Release 3 0 - Part 2 Service classes definition (Englisch version CWA 14050-2 2000)《金融服务辅助设备接.pdf
  • DIN CWA 14050-20-2001 en 8864 Extensions for Financial Services (XFS) interface specification - Release 3 0 - Part 20 Pin keypad device class interface Migration from Version 2 0 (.pdf DIN CWA 14050-20-2001 en 8864 Extensions for Financial Services (XFS) interface specification - Release 3 0 - Part 20 Pin keypad device class interface Migration from Version 2 0 (.pdf
  • DIN CWA 14050-21-2001 en 2333 Extensions for Financial Services (XFS) interface specification - Release 3 0 - Part 21 Depository device class interface Migration from Version 2 0 (.pdf DIN CWA 14050-21-2001 en 2333 Extensions for Financial Services (XFS) interface specification - Release 3 0 - Part 21 Depository device class interface Migration from Version 2 0 (.pdf
  • DIN CWA 14050-22-2001 en 2528 Extensions for Financial Services (XFS) interface specification - Release 3 0 - Part 22 Text terminal unit device class interface Migration from Versi.pdf DIN CWA 14050-22-2001 en 2528 Extensions for Financial Services (XFS) interface specification - Release 3 0 - Part 22 Text terminal unit device class interface Migration from Versi.pdf
  • DIN CWA 14050-23-2002 en 7035 Extensions for Financial Services (XFS) interface specification - Release 3 01 - Part 23 Sensors and indicators unit device class interface Migration .pdf DIN CWA 14050-23-2002 en 7035 Extensions for Financial Services (XFS) interface specification - Release 3 01 - Part 23 Sensors and indicators unit device class interface Migration .pdf
  • 相关搜索

    当前位置:首页 > 标准规范 > 国际标准 > 其他

    copyright@ 2008-2019 麦多课文库(www.mydoc123.com)网站版权所有
    备案/许可证编号:苏ICP备17064731号-1