1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update drawing to current requirements. Editorial changes throughout. - gap 06-12-05 Raymond Monnin REV SHET REV SHET REV STATUS REV A A A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY Rajesh Pithadia DEFENSE SUPPLY
2、 CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Rajesh Pithadia COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Raymond Monnin MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED SCHOTTKY TTL, TRIPLE 3-INPUT POSITIVE AND AND AGENCIES O
3、F THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 97-05-15 GATE, MONOLITHIC SILICON AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-97581 SHEET 1 OF 11 DSCC FORM 2233 APR 97 5962-E621-06 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD
4、MICROCIRCUIT DRAWING SIZE A 5962-97581 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (
5、device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 97581 01
6、 Q C X Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels a
7、nd are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit functi
8、on as follows: Device type Generic number Circuit function 01 54F11 Triple 3-input positive-AND gates 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certifi
9、cation to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter D
10、escriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line D GDFP1-F14 or CDFP2-F14 14 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for dev
11、ice class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-97581 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Supp
12、ly voltage range (VCC) -0.5 V dc to +7.0 V dc Input voltage range (VIN) 2/ . -1.2 V dc to +7.0 V dc Input current range -30 mA to +5 mA Voltage range applied to any output in the high state -0.5 V to VCCCurrent into any output in the low state . 40 mA Storage temperature range -65C to 150C Power dis
13、sipation . 53.35 mW Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) 175C 1.4 Recommended operating conditions. Supply voltage range (VCC) 4.5 V dc to 5.5 V dc High-level input voltage (VIH) . 2 V min Low-level input voltage (VIL) 0.8 V max Input clamp current (
14、IIK) . -18 mA max High-level output current (IOH) -1 mA max Low-level output current (IOL) . 20 mA max Case operating temperature range (TC) . -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a pa
15、rt of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STAND
16、ARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available
17、online at http:/assist.daps.dla.mil/quicksearch/ or www.dodssp.daps.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein
18、, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels
19、 may degrade performance and affect reliability. 2/ The input voltage ratings may be exceeded provided the input current ratings are observed. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-97581 DEFENSE SUP
20、PLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers
21、 Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Des
22、ign, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.
23、2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagrams. The logic diagrams shall be as specified on figure 3. 3.3 Electrical performance characteristics and postirr
24、adiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements
25、 shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not
26、 feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be
27、 in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate
28、of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to b
29、e listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF
30、-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot o
31、f microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for
32、 device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment fo
33、r device class M. Device class M devices covered by this drawing shall be in microcircuit group number 8 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-97581 DEFENSE SUPPLY C
34、ENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55C TC +125C Group A subgroups Limits 2/ Unit unless otherwise specified Min Max Input clamp voltage VIKVCC= 4.5 V, II= -18 mA 1, 2, 3 -
35、1.2 V High-level output voltage VOHVCC= 4.5 V, IOH= -1 mA 1, 2, 3 2.5 V Low-level output voltage VOLVCC= 4.5 V, IOL= 20 mA 1, 2, 3 0.5 V Input current IIVCC= 5.5 V, VI= 7.0 V 1, 2, 3 0.1 mA High-level input current IIHVCC= 5.5 V, VI= 2.7 V 1, 2, 3 20 A Low-level input current IILVCC= 5. 5 V, VI= 0.5
36、 V 1, 2, 3 -0.6 mA Short-circuit output current IOS3/ VCC= 5.5 V, VO= 0 V 1, 2, 3 -60 -150 mA Supply current, all outputs high ICCHVCC= 5.5 V, VI= 4.5 V 1, 2, 3 6.2 mA Supply current, all outputs low ICCLVCC= 5.5 V, VI= 0 V 1, 2, 3 9.7 mA Functional test 4/ VIN= VIHMin or VILMax Verify output VO, Se
37、e 4.4.1c 7, 8 Propagation delay time from tPLHVCC= 5.0 V, See figure 4 9 2.2 5.6 ns A, B, or C to Y VCC= 4.5 V to 5.5 V, See figure 4 10, 11 1.7 7.5 tPHLVCC= 5.0 V, See figure 4 9 1.7 5.5 VCC= 4.5 V to 5.5 V, See figure 4 10, 11 1.2 7.5 1/ Each input/output, as applicable, shall be tested at the spe
38、cified temperature, for the specified limits, to the tests in table I herein. Output terminals not designated shall be high level logic, low level logic, or open except for all ICCtests, where the output terminals shall be open. When performing these tests, the current meter shall be placed in the c
39、ircuit such that all current flows through the meter. 2/ For negative and positive voltage and current values, the sign designates the potential difference in reference to GND and the direction of current flow, respectively, and the absolute value of the magnitude, not the sign, is relative to the m
40、inimum and maximum limits, as applicable, listed herein. 3/ Not more than one output should be shorted at a time, and the duration of the short circuit should not exceed one second. 4/ Tests shall be performed in sequence, attributes data only. Functional tests shall include the truth table and othe
41、r logic patterns used for fault detection. The test vectors used to verify the truth table shall, at a minimum, test all functions of each input and output. All possible input to output logic patterns per function shall be guaranteed, if not tested, to the truth table in figure 2 herein. Functional
42、tests shall be performed in sequence as approved by the qualifying activity on qualified devices. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-97581 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990
43、 REVISION LEVEL A SHEET 6 DSCC FORM 2234 APR 97 Device type 01 Case outline C and D 2 Terminal number Terminal symbol 1 1A NC 2 1B 1A 3 2A 1B 4 2B 2A 5 2C NC 6 2Y 2B 7 GND NC 8 3Y 2C 9 3A 2Y 10 3B GND 11 3C NC 12 1Y 3Y 13 1C 3A 14 VCC3B 15 NC 16 3C 17 NC 18 1Y 19 1C 20 VCCFIGURE 1. Terminal connecti
44、ons. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-97581 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 7 DSCC FORM 2234 APR 97 INPUTS OUTPUT A B C Y H H H H L X X L X L X L
45、 X X L L H = High voltage level L = Low voltage level X = Dont care FIGURE 2. Truth table. FIGURE 3. Logic diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-97581 DEFENSE SUPPLY CENTER COLUMBUS COLUMBU
46、S, OHIO 43218-3990 REVISION LEVEL A SHEET 8 DSCC FORM 2234 APR 97 NOTES 1. CLincludes probe and jig capacitance. 2. All input pulses have the following characteristics; PRR = 1 MHz, tr= tf 2.5 ns, duty cycle = 50%. 3. The outputs are measured one at a time with one transition per measurement. FIGURE
47、 4. Switching waveforms. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-97581 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 9 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampl
48、ing and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on a
