DLA SMD-5962-97584 REV B-2006 MICROCIRCUIT DIGITAL BIPOLAR ADVANCED SCHOTTKY TTL DUAL 4-INPUT POSITIVE-NAND GATE MONOLITHIC SILICON《微型电路 数字型 双极 改进型肖特基晶体管晶体管逻辑电路 双路4输入正与非门 单块硅》.pdf

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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add vendor cage 27014 for device 01. Technical changes in 1.3. - tdn 97-07-18 Raymond Monnin B Update drawing to current requirements. Editorial changes throughout. - gap 06-12-12 Raymond Monnin REV SHET REV SHET REV STATUS REV B B B B B B B B B

2、B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY Tuan Nguyen DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Larry Shaw COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Raymond Monnin MICROCIRCUI

3、T, DIGITAL, BIPOLAR, ADVANCED SCHOTTKY TTL, DUAL 4-INPUT POSITIVE-NAND AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 97-05-30 GATE, MONOLITHIC SILICON AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-97584 SHEET 1 OF 11 DSCC FORM 2233 APR 97 5962-E082-07 Provided by IHSNot for

4、 ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-97584 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class l

5、evels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflect

6、ed in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 97584 01 Q C X Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. De

7、vice classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a

8、 non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54F20 Dual 4-input positive-NAND gate 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance lev

9、el as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The

10、 case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 dual-in-line D GDFP1-F14 or CDFP2-F14 14 flat pack 2 CQCC1-N20 20 leadless square chip carrier 1.2.5 Lead finish. The lead finish is as specifi

11、ed in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-97584 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 R

12、EVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Supply voltage range (VCC) -0.5 V dc to +7.0 V dc Input voltage (VIN) -1.2 V at -18 mA to +7.0 V dc Input current range (II) . -30 mA to 5 mA Voltage range applied to any output in the high state -0.5 V to VCC Current int

13、o any output in the low state .40 mA Maximum power dissipation (PD) . 80 mW Operating free air temperature range -55 C to +125 C Storage temperature range -65 C to +150 C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) +175 C 1.4 Recommended operating condition

14、s. Supply voltage range (VCC) 4.5 V dc to 5.5 V dc High-level input voltage (VIH) . 2 V min Low-level input voltage (VIL) 0.8 V min Input clamp current (IIK) . -18 mA max High-level output current (IOH) -1 mA max Low-level output current (IOL) . 20 mA max Case operating temperature range (TC) . -55

15、C to +125 C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation

16、or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENS

17、E HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or www.dodssp.daps.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Buil

18、ding 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exem

19、ption has been obtained. _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-

20、,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-97584 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and a

21、s specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for n

22、on-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Ca

23、se outline. The case outline shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure

24、3. 3.2.5 Test circuit and switching waveforms. The test circuit and switching waveforms shall be as specified on figure 4. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiatio

25、n parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking.

26、The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA produ

27、ct using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device class

28、es Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufactur

29、er in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSC

30、C-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of confo

31、rmance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification

32、to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufact

33、urers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 8 (see MIL-PRF-38535

34、, appendix A).Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-97584 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance char

35、acteristics. Test Symbol Test Conditions -55C TC +125C Group A subgroups Limits Unit unless otherwise specified Min Max Input clamp voltage VIKVCC = 4.5 V, II= -18 mA 1, 2, 3 -1.2 V High level output voltage VOHVCC = 4.5 V, IOH= -1 mA 1, 2, 3 2.5 V Low-level output voltage VOLVCC = 4.5 V, IOL= 20 mA

36、 1, 2, 3 0.5 V Input current at maximum input voltage IIVCC = 5.5 V, VI= 7 V 1, 2, 3 0.1 mA High-level input current IIHVCC = 5.5 V, VI= 2.7 V 1, 2, 3 20 A Low-level input current IILVCC = 5.5 V, VI= 0.5 V 1, 2, 3 -0.6 mA Short-circuit output current IOS 1/ VCC = 5.5 V, VO= 0 1, 2, 3 -60 -150 mA Sup

37、ply current ICCH VCC = 5.5 V, VI= 0 1, 2, 3 1.4 mA ICCLVCC = 5.5 V, VI= 4.5 V 1, 2, 3 5.1 Functional test VIN = VIHMin or VILMax, Verify output VO, See 4.4.1b 7, 8 Propagation delay time, low-to-high level Y output tPLHSee figure 4 2/ 3/ 9 1.6 5 ns from A, B, C, or D input 10, 11 1.2 7 Propagation d

38、elay time, high-to-low level Y output tPHL9 1 4.3 ns from A, B, C, or D input 10, 11 1 6.5 1/ Not more than one output should be shorted at a time, and the duration of the short circuit should not exceed one second. 2/ For group A subgroup 9, VCC= 5.0 V, CL= 50 pF, RL= 500 . 3/ For group A subgroups

39、 10 and 11, VCC= 4.5 V to 5.5 V, CL= 50 pF, RL= 500 . Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-97584 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR

40、 97 Device type 01 Case outlines C and D 2 Terminal number Terminal symbol 1 1A NC 2 1B 1A 3 NC 1B 4 1C NC 5 1D NC 6 1Y 1C 7 GND NC 8 2Y 1D 9 2A 1Y 10 2B GND 11 NC NC 12 2C 2Y 13 2D 2A 14 VCC2B 15 NC 16 NC 17 NC 18 2C 19 2D 20 VCCFIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reprod

41、uction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-97584 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 INPUTS OUTPUT A B C D Y H H H H L L X X X H X L X X H X X L X H X X X L H FIGURE 2. Trut

42、h table. FIGURE 3. Logic diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-97584 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 8 DSCC FORM 2234 APR 97 NOTES: 1. CLincl

43、udes probe and jig capacitance. 2. All input pulses are supplied by generators having the following characteristics: PRR 1 MHz, tr= tf= 2.5 ns, duty cycle = 50 %. 3. The outputs are measured one at a time with one transition per measurement. FIGURE 4. Test circuit and switching waveforms. Provided b

44、y IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-97584 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 9 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. For device clas

45、ses Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspect

46、ion procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shal

47、l be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C or D. The test circuit shall be maintained by the m

48、anufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein. 4.2.2 Additional criteria for device classes Q and V. a. The burn-in test dur

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