DLA SMD-5962-97604 REV B-2009 MICROCIRCUIT DIGITAL LOW VOLTAGE CMOS QUADRUPLE 2-INPUT POSITIVE-NOR GATE MONOLITHIC SILICON.pdf

上传人:priceawful190 文档编号:701241 上传时间:2019-01-01 格式:PDF 页数:17 大小:108.38KB
下载 相关 举报
DLA SMD-5962-97604 REV B-2009 MICROCIRCUIT DIGITAL LOW VOLTAGE CMOS QUADRUPLE 2-INPUT POSITIVE-NOR GATE MONOLITHIC SILICON.pdf_第1页
第1页 / 共17页
DLA SMD-5962-97604 REV B-2009 MICROCIRCUIT DIGITAL LOW VOLTAGE CMOS QUADRUPLE 2-INPUT POSITIVE-NOR GATE MONOLITHIC SILICON.pdf_第2页
第2页 / 共17页
DLA SMD-5962-97604 REV B-2009 MICROCIRCUIT DIGITAL LOW VOLTAGE CMOS QUADRUPLE 2-INPUT POSITIVE-NOR GATE MONOLITHIC SILICON.pdf_第3页
第3页 / 共17页
DLA SMD-5962-97604 REV B-2009 MICROCIRCUIT DIGITAL LOW VOLTAGE CMOS QUADRUPLE 2-INPUT POSITIVE-NOR GATE MONOLITHIC SILICON.pdf_第4页
第4页 / 共17页
DLA SMD-5962-97604 REV B-2009 MICROCIRCUIT DIGITAL LOW VOLTAGE CMOS QUADRUPLE 2-INPUT POSITIVE-NOR GATE MONOLITHIC SILICON.pdf_第5页
第5页 / 共17页
点击查看更多>>
资源描述

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Make corrections to figure 5. Update boilerplate. jak 00-08-16 Monica L. Poelking B Update the boilerplate paragraphs to current requirements as specified in MIL-PRF-38535. - jak 09-05-01 Thomas M. Hess REV SHEET REV B B SHEET 15 16 REV STATUS RE

2、V B B B B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Gary L. Gross STANDARD MICROCIRCUIT DRAWING CHECKED BY Charles F. Saffle, Jr. DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL D

3、EPARTMENTS APPROVED BY Monica L. Poelking MICROCIRCUIT, DIGITAL, LOW VOLTAGE CMOS, QUADRUPLE 2-INPUT POSITIVE-NOR GATE, AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 97-07-30 MONOLITHIC SILICON AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-97604 SHEET 1 OF 16 DSCC FORM 2233

4、 APR 97 5962-E281-09 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962- 97604 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This dra

5、wing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation

6、 Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 97604 01 Q C A Federal RHA Device Device Case Lead stock class designator type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2

7、.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appro

8、priate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54LVC02A Quadruple 2-input positive-NOR gate 1.2.3 Device class designator. The device class designator is a

9、 single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and quali

10、fication to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line D GDFP1-F14 or CDFP2-F14 14 Flat pack 2 CQCC1-N20 20 Square leadless chip carr

11、ier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962- 97604 DEFEN

12、SE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) -0.5 V dc to +6.5 V dc DC input voltage range (VIN) -0.5 V dc to +6.5 V dc 4/ DC output voltage range (VOUT) . -0.5 V dc to VCC+0.5 V d

13、c 4/ 5/ DC input clamp current (IIK) (VINVCC) 50 mA Continuous output current (IOL) (VO= 0 to VCC) 50 mA Continuous current through VCCor GND 100 mA Maximum power dissipation at TA= +55C (in still air) 500 mW 6/ Storage temperature range (TSTG) . -65C to +150C Lead temperature (soldering, 10 seconds

14、). +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) +150C 1.4 Recommended operating conditions. 2/ 3/ 7/ Supply voltage range (VCC): Operating. +2.0 V dc to +3.6 V dc Data retention only (minimum). +1.5 V dc Minimum high level input voltage (VIH) (VCC= 2.7

15、 V to 3.6 V) +2.0 V dc Maximum low level input voltage (VIL) (VCC= 2.7 V to 3.6 V). +0.8 V dc Input voltage range (VIN) 0.0 V to +5.5 V dc Output voltage range (VOUT). 0.0 V to VCCMaximum high level output current (IOH): VCC= 2.7V . -12 mA VCC= 3.0 V -24 mA Maximum low level output current (IOL): VC

16、C= 2.7V . +12 mA VCC= 3.0 V +24 mA Case operating temperature range (TC). -55C to +125C _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Unless otherwise noted, all vo

17、ltages are referenced to GND. 3/ The limits for the parameters specified herein shall apply over the full specified VCCrange and case temperature range of -55C to +125C. 4/ The input and output negative voltage ratings may be exceeded provided that the input and output clamp current ratings are obse

18、rved. 5/ The value of VCC is provided in the recommended operating conditions table. 6/ The maximum package power dissipation is calculated using a junction temperature of 150C and a board trace length of 750 mils. 7/ Unused inputs must be held high or low to prevent them from floating. Provided by

19、IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962- 97604 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standar

20、ds, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrat

21、ed Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HD

22、BK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following document(s

23、) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL

24、-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535,

25、appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device c

26、lass M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as sp

27、ecified on figure 3. 3.2.5 Ground bounce load circuit and waveforms. The ground bounce test circuit and waveforms shall be as specified on figure 4.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962- 97604 DEFEN

28、SE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 3.2.6 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 5. 3.3 Electrical performance characteristics and postirradiation parameter limits.

29、Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups spe

30、cified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limi

31、tations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF

32、-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device c

33、lasses Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved sou

34、rce of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for de

35、vice class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered t

36、o this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device

37、 class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device cl

38、ass M devices covered by this drawing shall be in microcircuit group number 36 (see MIL-PRF-38535, appendix A).Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962- 97604 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, O

39、HIO 43218-3990 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ -55C TC +125C +2.0 V VCC +3.6 V Devicetype VCCGroup A subgroups Limits 3/ Unit unless otherwise specified Min Max High level ou

40、tput voltage 3006 VOHFor all inputs affecting output under test, VIH= 2.0 V or VIL= 0.8 V IOH= -100 A All 2.7 V and 3.6 V 1,2,3 VCC-0.2 V For all inputs affecting output under test, VIH= 2.0 V or VIL= 0.8 V All 2.7 V 1,2,3 2.2 IOH= -12 mA 3.0 V 2.4 For all inputs affecting output under test, VIH= 2.

41、0 V or VIL= 0.8 V IOH= -24 mA All 3.0 V 1,2,3 2.2 Low level output voltage 3007 VOLFor all inputs affecting output under test, VIH= 2.0 V or VIL= 0.8 V IOL= 100 A All 2.7 V and 3.6 V 1,2,3 0.2 V For all inputs affecting output under test, VIH= 2.0 V or VIL= 0.8 V IOL= 12 mA All 2.7 V 1,2,3 0.4 For a

42、ll inputs affecting output under test, VIH= 2.0 V or VIL= 0.8 V IOL= 24 mA All 3.0 V 1,2,3 0.55 Input current high 3010 IIHFor input under test, VIN= 5.5 V All 3.6 V 1,2,3 +5.0 A Input current low 3009 IIL For input under test, VIN= GND All 3.6 V 1,2,3 -5.0 Quiescent supply current 3005 ICCVIN= VCCo

43、r GND IOUT= 0.0 A All 3.6 V 1,2,3 10.0 A Quiescent supply current delta TTL input levels 3005 ICCFor input under test, VIN= VCC - 0.6 V, other inputs at VCCor GND All 2.7 V and 3.6 V 1,2,3 500.0A See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted with

44、out license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962- 97604 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/

45、 -55C TC +125C +2.0 V VCC +3.6 V Device type VCCGroup A subgroups Limits 3/ Unit unless otherwise specified Min Max Input capacitance 3012 CINTC= +25C VIN= VCCor GND See 4.4.1c All 3.3 V 4 10.0 pF Power dissipation capacitance CPD4/ CL= 50 pF minimum f = 1 MHz See 4.4.1c All 3.3 V 4 13.0 pF Low leve

46、l ground bounce noise VOLP 5/ VIN= 2.7 V, VIL= 0.0 V TA= +25 C See figure 4 All 3.0 V 4 1500 mV Low level ground bounce noise VOLV5/ See 4.4.1d All 3.0 V 4 -1500 High level VCCbounce noise VOHP5/ All 3.0 V 4 500 High level VCCbounce noise VOHV5/ All 3.0 V 4 -850 Functional test 3014 6/ VIH= 2.0 V or

47、 VIL= 0.8 V Verify output VOUTSee 4.4.1b All 2.0 V and 3.6 V 7,8 L H Propagation delay time, mA or mB to mY 3003 tPLHtPHL7/ CL= 50 pF minimum See Figure 5 All 2.7 V 9,10,11 5.4 ns 3.0 V and 3.6 V 1.0 4.4 Output skew tsk(o) 8/ CL= 50 pF minimum See Figure 4 All 3.0 V and 3.6 V 9 1.0 ns See footnotes

48、on next sheet. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962- 97604 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 8 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued 1/ For tests not listed in the referenced MIL-STD-883 (e.g. ICC), utilize the general test procedure of 883 under the conditions listed herein. 2/ Each input/output, as applicable, shall be te

展开阅读全文
相关资源
猜你喜欢
相关搜索

当前位置:首页 > 标准规范 > 国际标准 > 其他

copyright@ 2008-2019 麦多课文库(www.mydoc123.com)网站版权所有
备案/许可证编号:苏ICP备17064731号-1