1、REVISIONSLTR DESCRIPTION DATE (YR -MO -DA) APPROVEDREVSHEETREVSHEET 15 16REV STATUS REV OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14PMIC N/A PREPARED BY Joseph A. Kerby DEFENSE SUPPLY CENTER COLUMBUSSTANDARDMICROCIRCUITDRAWINGCHECKED BYCharles F. Saffle, Jr.COLUMBUS, OHIO 43216THIS DRAWING IS AV
2、AILABLEFOR USE BY ALLDEPARTMENTSAPPROVED BYMonica L. Poelking MICROCIRCUIT, DIGITAL, LOW VOLTAGE CMOS,16-BIT BUFFER/LINE DRIVER WITH THREE-STATEOUTPUTS, MONOLITHIC SILICONAND AGENCIES OF THEDEPARTMENT OF DEFENSE DRAWING APPROVAL DATE99-04-22AMSC N/A REVISION LEVEL SIZEACAGE CODE67268 5962-99505SHEET
3、 1 OF 16DSCC FORM 2233APR 97 5962 -E224 -99DISTRIBUTION STATEMENT A . Approved for public release; distribution is unlimited.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA 5962-99505DEFENSE SUPPLY CENTER COLUMBUSCOL
4、UMBUS, OHIO 43216-5000 REVISION LEVEL SHEET 2DSCC FORM 2234APR 971. SCOPE1.1 Scope . This drawing documents two product assurance class levels consisting of high reliability (device classes Q andM) and space application (device class V). A choice of case outlines and lead finishes are available and
5、are reflected in thePart or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in thePIN.1.2 PIN . The PIN is as shown in the following example:5962 - 99505 01 Q X X* * * * * * * * * * * * * * * * Federal RHA Device Device Case Lead stock cl
6、ass designator type class outline finishdesignator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3)/ Drawing number1.2.1 RHA designator . Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels andare marked with the appropriate RHA designator. D
7、evice class M RHA marked devices meet the MIL-PRF-38535, appendix Aspecified RHA levels and are marked with the appropriate RHA designator. A dash ( -) indicates a non -RHA device.1.2.2 Device type(s) . The device type(s) identify the circuit function as follows:Device type Generic number Circuit fu
8、nction01 54LCX16244 16-bit buffer/line driver with three-state outputs1.2.3 Device class designator . The device class designator is a single letter identifying the product assurance level asfollows:Device class Device requirements documentationM Vendor self -certification to the requirements for MI
9、L-STD-883 compliant,non -JAN class level B microcircuits in accordance with MIL-PRF-38535,appendix AQ or V Certification and qualification to MIL-PRF-385351.2.4 Case outline(s) . The case outline(s) are as designated in MIL-STD-1835 and as follows:Outline letter Descriptive designator Terminals Pack
10、age styleX GDFP1-F48 48 Flat pack1.2.5 Lead finish . The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendixA for device class M.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWI
11、NGSIZEA 5962-99505DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000 REVISION LEVEL SHEET 3DSCC FORM 2234APR 971.3 Absolute maximum ratings . 1 / 2 / 3 /Supply voltage range (V CC ) -0.5 V dc to +7.0 V dcDC input voltage range (V IN ) . -0.5 V dc to +7.0 V dc 4 /DC output voltage range (V OUT )
12、 (high or low state) -0 .5 V dc to V CC +0.5 V dc 4 / 5 /DC output voltage range (V OUT ) (high impedance or power off state) -0.5 V dc to +7.0 V dc 4 /DC input clamp current (I IK ) (V IN V CC ) . 50 mAContinuous output current (I O ) (per pin) . 50 mA 5 /Continuous current through V CC or GND 400
13、mAMaximum power dissipation . 750 mWStorage temperature range (T STG ) -65 C to +150 CLead temperature (soldering, 10 seconds) +300 CThermal resistance, junction-to-case ( JC ) . See MIL-STD-1835Junction temperature (T J ) . +175 C1.4 Recommended operating conditions . 2 / 3 / 6 /Supply voltage rang
14、e (V CC ) (Operating) +2.7 V dc to +3.6 V dcMinimum supply voltage (Data retention only) +1.5 V dcMinimum high level input voltage (V IH ) (V CC = 2.7 V to 3.6 V) . +2.0 VMaximum low level input voltage (V IL ) (V CC = 2.7 V to 3.6 V) . +0.8 VInput voltage range (V IN ) . 0.0 V to +5.5 V dcOutput vo
15、ltage range (V OUT ) (high or low state) 0.0 V to V CCOutput voltage range (V OUT ) (high impedance state) 0.0 V to 5.5 V dcMaximum high level output current (I OH )V CC = 2.7V . -12 mAV CC = 3.0 V to 3.6 V -24 mAMaximum low level output current (I OL ):V CC = 2.7V . +12 mAV CC = 3.0 V to 3.6 V +24
16、mAInput transition rise or fall rate ( t/ V): . 0 to 10 ns/VCase operating temperature range (T C ) -55 C to +125 C_1 / Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at themaximum levels may degrade performance and affect reliability. Maximum
17、 junction temperature shall not be exceededexcept for allowable short duration burn-in screening conditions in accordance with method 5004 of MIL-STD-883.2 / Unless otherwise noted, all voltages are referenced to GND.3 / The l imits for the parameters specified herein shall apply over the full speci
18、fied V CC range and case temperature rangeof -55 C to +125 C.4 / The input and output negative voltage ratings may be exceeded provided that the input and output clamp current ratingsare observed.5 / The value of V CC is provided in the recommended operating conditions table.6 / Unused inputs must b
19、e held high or low to prevent them from floating.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA 5962-99505DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000 REVISION LEVEL SHEET 4DSCC FORM 2234APR 972. APPLICAB
20、LE DOCUMENTS2.1 Government specification, standards, and handbooks . The following specification, standards, and handbooks form apart of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed inthe issue of the Department of Defense In
21、dex of Specifications and Standards (DoDISS) and supplement thereto, cited in thesolicitation.SPECIFICATIONDEPARTMENT OF DEFENSEMIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.STANDARDSDEPARTMENT OF DEFENSEMIL -STD -883 - Test Method Standard Microcircuits.MIL-STD-973 -
22、 Configuration Management.MIL-STD-1835 - Interface Standard For Microcircuit Case Outlines.HANDBOOKSDEPARTMENT OF DEFENSEMIL-HDBK-103 - List of Standard Microcircuit Drawings (SMDs).MIL -H DBK -780 - Standard Microcircuit Drawings.(Unless otherwise indicated, copies of the specification, standards,
23、and handbooks are available from the StandardizationDocument Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)2.2 Order of precedence . In the event of a conflict between the text of this drawing and the references cited herein, the textof this drawing takes precedence. Noth
24、ing in this document, however, supersedes applicable laws and regulations unless aspecific exemption has been obtained.3. REQUIREMENTS3.1 Item requirements . The individual item requirements for device classes Q and V shall be in accordance withMIL-PRF-38535 and as specified herein or as modified in
25、 the device manufacturers Quality Management (QM) plan. Themodification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements fordevice class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as sp
26、ecifiedherein.3.2 Design, construction, and physical dimensions . The design, construction, and physical dimensions shall be as specifiedin MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.3.2.1 Case outlines . The case outlines shall be
27、in accordance with 1.2.4 herein.3.2.2 Terminal connections . The terminal connections shall be as specified on figure 1.3.2.3 Truth table . The truth table shall be as specified on figure 2.3.2.4 Logic diagram . The logic diagram shall be as specified on figure 3.3.2.5 Ground bounce load circuit and
28、 waveforms . The ground bounce load circuit and waveforms shall be as specified onfigure 4.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA 5962-99505DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000 REVISION LE
29、VEL SHEET 5DSCC FORM 2234APR 973.2.6 Switching waveforms and test circuit . The switching waveforms and test circuit shall be as specified on figure 5.3.2.7 Radiation exposure circuit . The radiation exposure circuit shall be as specified when available.3.3 Electrical performance characteristics and
30、 postirradiation parameter limits . Unless otherwise specified herein, theelectrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the fullcase operating temperature range.3.4 Electrical test requirements . The electrical test requi
31、rements shall be the subgroups specified in table II. The electricaltests for each subgroup are defined in table I.3.5 Marking . The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also bemarked as listed in MIL-HDBK-103. For packages where marking of t
32、he entire SMD PIN number is not feasible due to spacelimitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, theRHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Markin
33、g for device class M shall be in accordance with MIL-PRF-38535, appendix A.3.5.1 Certification/compliance mark . The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required inMIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535,
34、appendix A.3.6 Certificate of compliance . For device classes Q and V, a certificate of compliance shall be required from a QML -38535listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate ofcompliance shall be required from a
35、 manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see6.6.2 herein). The certificate of compliance submitted to DSCC -VA prior to listing as an approved source of supply for thisdrawing shall affirm that the manufacturers product meets, for device classes Q and V, t
36、he requirements of MIL-PRF-38535and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.3.7 Certificate of conformance . A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 orfor device class M in MIL-PRF-38535, appendix A shall be
37、provided with each lot of microcircuits delivered to this drawing.3.8 Notification of change for device class M . For device class M, notification to DSCC -VA of change of product (see 6.2herein) involving devices acquired to this drawing is required for any change as defined in MIL-STD-973.3.9 Veri
38、fication and review for device class M . For device class M, DSCC, DSCCs agent, and the acquiring activity retainthe option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be madeavailable onshore at the option of the reviewer.3.10 Microcircui
39、t group assignment for device class M . Device class M devices covered by this drawing shall be inmicrocircuit group number 37 (see MIL-PRF-38535, appendix A).Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA 5962-9950
40、5DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000 REVISION LEVEL SHEET 6DSCC FORM 2234APR 97Table I. Electrical performance characteristics .Test andMIL-STD-883test method 1 /Symbol Test conditions 2 /-55 C T C +125 C+2.7 V V CC +3.6 VDevicetypeandV CC Group AsubgroupsLimits 3 / Unitunless ot
41、herwise specified DeviceclassMin MaxHigh level output voltage3006V OH For all inputs affectingoutput under test, V IN = V IL or V IHI OH = -100 AAllAll2.7 Vand3.6 V1, 2, 3 V CC-0.2V4 / For all other inputs, V IN = V CC or GND I OH = -12 mAAllAll2.7 V 1, 2, 3 2.23.0 V 2.4I OH = -24 mA AllAll3.0 V 1,
42、2, 3 2.2Low level output voltage3007V OL For all inputs affectingoutput under test, V IN = V IL or V IHI OL = 100 AAllAll2.7 Vand3.6 V1, 2, 3 0.2 V4 / For all other inputs, V IN = V CC or GNDI OL = 12 mA AllAll2.7 V 1, 2, 3 0.4I OL = 24 mA AllAll3.0 V 1, 2, 3 0.55Input current high 3010I IH All inpu
43、tsFor input under test, V IN = 5.5 VFor all other inputs,AV IN = V CC or GNDAllAll3.6 V 1, 2, 3 +5.0Input current low 3009I IL All inputsFor input under test, V IN = 0.0 VFor all other inputs,AV IN = V CC or GNDAllAll3.6 V 1, 2, 3 -5.0Three-state outputleakage currentI OZH Ahigh30215 / V OUT = 5.5 V
44、 AllAll2.7 Vand3.6 V1, 2, 3 +5.0Three-state outputleakage current lowI OZL 5 /A3020V OUT = GND AllAll2.7 Vand3.6 V1, 2, 3 -5.0Quiescent supply currentI CC Outputs high, low, and disabledFor all inputs, V IN = V CC or GNDI OUT = 0.0 AAllAll3.6 V 1, 2, 3 20.0 A3005 For all inputs, 3.6 V V IN 5.5 VFor
45、all outputs, 3.6 V V OUT 5.5 V5 /AllAll2.7 Vand 3.6 V1, 2, 3 -20.0 20.0Quiescent supply current delta, TTL input levels3005I CC6 /One input at V IN = V CC 0.6 VOther inputs at V IN = V CC or GNDAllAll2.7 Vand3.6 V1, 2, 3 500 AOff-state leakage currentI OFF For input or output under test,V IN or V OU
46、T = 5.5 VAll other inputs or outputs at 0.0 VAllAll0.0 V 1, 2, 3 10.0 ASee footnotes at end of table.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA 5962-99505DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000 R
47、EVISION LEVEL SHEET 7DSCC FORM 2234APR 97Table I. Electrical performance characteristics Continued.Test andMIL-STD-883test method 1 /Symbol Test conditions 2 /-55 C T C +125 C+2.7 V V CC +3.6 VDevicetypeandV CC Group AsubgroupsLimits 3 / Unitunless otherwise specified DeviceclassMin MaxNegative inpu
48、tclamp voltage3022V IC- For input under test, I IN = -18 mA AllAll3.0 V 1, 2, 3 -1.2 VInput capacitance3012C IN T C = +25 CSee 4.4.1cAllAllGND 4 10 pFOutput capacitance3012C OUT5 /T C = +25 CSee 4.4.1cAllAll3.3 V 4 12 pFPower dissipation capacitanceper bufferC PD T C = +25 C f = 10 MHz, See 4.4.1cOutputs enabledAllAll3.3 V 4 40 pFLow level ground bounce noiseV OLP7 /V IH = 2.7 V, V IL = 0.0 VT A = +25 CSee figure 4AllAll3.3 V 4 1200 mVLow level ground bounce noiseV OLV7 /See 4.4.1d AllAll3.3 V 4 -1
