1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Paragraph 1.3, correct DVCCfrom 0 V dc to +5.0 V dc to 0 V dc to +6.0 V dc. Table I, IMP, correct the limits of 55.5 and 53 dBc from maximum to minimum. Update drawing boilerplate. 02-12-18 Raymond Monnin B Update drawing. -gz 07-01-10 Joseph Rod
2、enbeck REV SHEET REV SHEET REV STATUS REV B B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY Gary Zahn DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Michael C. Jones POST OFFICE BOX 3990 COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil T
3、HIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Raymond Monnin MICROCIRCUIT, HYBRID, DIGITAL-LINEAR, 12-BIT, DUAL CHANNEL, ANALOG TO DIGITAL CONVERTER AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 00-09-14 AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-99610
4、SHEET 1 OF 12 DSCC FORM 2233 APR 97 5962-E142-07Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-99610 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1.
5、 SCOPE 1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance
6、 levels are reflected in the PIN. 1.2 PIN. The PIN shall be as shown in the following example: 5962 - 99610 01 H X X Federal RHA Device Device Case Lead stock class designator type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3) / Drawing numb
7、er 1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follo
8、ws: Device type Generic number Circuit function 01 AD10200TZ Dual channel, 12-bit, 105 MSPS, MCM, analog to digital converter 02 AD10200BZ Dual channel, 12-bit, 105 MSPS, MCM, analog to digital converter 1.2.3 Device class designator. This device class designator shall be a single letter identifying
9、 the product assurance level. All levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K, and E) or QML Listing (Class G and D). The product assurance levels are as follows: Device class Device performance documentation K Highest re
10、liability class available. This level is intended for use in space applications. H Standard military quality class level. This level is intended for use in applications where non-space high reliability devices are required. G Reduced testing version of the standard military quality class. This level
11、 uses the Class H screening and In-Process Inspections with a possible limited temperature range, manufacturer specified incoming flow, and the manufacturer guarantees (but may not test) periodic and conformance inspections (Group A, B, C, and D). E Designates devices which are based upon one of the
12、 other classes (K, H, or G) with exception(s) taken to the requirements of that class. These exception(s) must be specified in the device acquisition document; therefore the acquisition document should be reviewed to ensure that the exception(s) taken will not adversely affect system performance. D
13、Manufacturer specified quality class. Quality level is defined by the manufacturers internal, QML certified flow. This product may have a limited temperature range. 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Term
14、inals Package style X See figure 1 68 Leaded ceramic chip carrier 1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-99610 DEFENSE SUPPL
15、Y CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Analog positive supply voltage (AVCC) 0 V dc to +6.0 V dc Digital positive supply voltage (DVCC). 0 V dc to +6.0 V dc Analog input voltage -0.5 V to AVCC+0.5 V Digital input vo
16、ltage . -0.5 V to DVCC+0.5 V Digital output current 20 mA Power dissipation (PD) 2.2 W Thermal resistance junction-to-case (JC). 2.22C/W Thermal resistance junction-to-ambient (JA) 24.3C/W Junction temperature (TJ) +175C Storage temperature -65C to +150C Lead temperature (soldering, 10 seconds). +30
17、0C 1.4 Recommended operating conditions. Analog positive supply voltage (AVCC) . +4.75 V dc to +5.25 V dc Digital positive supply voltage (DVCC) +3.14 V dc to +3.47 V dc Case operating temperature range (TC): Device type 01 . -55C to +125C Device type 02 . -40C to +85C 2. APPLICABLE DOCUMENTS 2.1 Go
18、vernment specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFI
19、CATION MIL-PRF-38534 - Hybrid Microcircuits, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard for Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcir
20、cuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Ord
21、er of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 1/ Stresses above the
22、 absolute maximum ratings may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-996
23、10 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534
24、 may include the performance of all tests herein or as designated in the device manufacturers Quality Management (QM) plan or as designated for the applicable device class. The manufacturer may eliminate, modify or optimize the tests and inspections herein, however the performance requirements as de
25、fined in MIL-PRF-38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not affect the form, fit, or function of the device for the applicable device class. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimen
26、sions shall be as specified in MIL-PRF-38534 and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Output coding. The output coding shall be as specif
27、ied on figure 3. 3.2.4 Timing diagram. The timing diagram shall be as specified on figure 4. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full specified operating tempera
28、ture range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be ma
29、rked with the PIN listed in 1.2 herein. In addition, the manufacturers vendor similar PIN may also be marked. 3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described herein shall maintain the electrical test data (variables format) fro
30、m the initial quality conformance inspection group A lot sample, for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those which, if any, are guaranteed. This data shall be maintained under document revision level control by the manu
31、facturer and be made available to the preparing activity (DSCC-VA) upon request. 3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this drawing. The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that t
32、he manufacturers product meets the performance requirements of MIL-PRF-38534 and herein. 3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of microcircuits delivered to this drawing. 4. VERIFICATION 4.1 Sampling and inspection.
33、Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. 4.2 Screening. Screening shall be in accordance with
34、MIL-PRF-38534. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either DSCC-VA or the acquiring a
35、ctivity upon request. Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TAas specified in accordance with table I of method 1015 of MIL-STD-883. b. Interim and final elect
36、rical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWI
37、NG SIZE A 5962-99610 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ unless otherwise specified Group A subgroups Device types Limits Unit Min Max Output offset OUTOFFSE
38、T1,2,3 01,02 -12 +12 LSB Gain error 2/ AVERROR1,2,3 01,02 -9 +9 %FS Reference output voltage VREF1,2,3 01,02 2.4 2.6 V Analog positive supply current 3/ IACC1,2,3 01,02 410 mA Digital positive supply current 3/ IDCC1,2,3 01,02 40 mA Power dissipation 4/ PD1,2,3 01,02 2.2 W Digital output, logic “1“
39、5/ voltage VOH1,2,3 01,02 +3.1 V Digital output, logic “0“ 5/ voltage VOL1,2,3 01,02 0.2 V Input voltage standing wave ratio (VSWR) 6/ 7/ VSWR 4,5,6 01,02 1.25:1 ratio Analog input bandwidth high 6/ AINBWH 4,5,6 01,02 200 MHz Analog input bandwidth low 6/ AINBWL 4,5,6 01,02 1 MHz Maximum conversion
40、rate CNVMAX4,5,6 01,02 105 MSPS Minimum conversion rate 6/ CNVMIN4,5,6 01,02 10 MSPS Duty cycle 6/ DC 4,5,6 01,02 45 55 % See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-99610 D
41、EFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions 1/ unless otherwise specified Group A subgroups Device types Limits Unit Min Max 4 64 fIN= 41 MHz 5,6 62 4 62.5 f
42、IN= 71 MHz 5,6 61.5 Signal to noise ratio (without harmonics) 8/ SNR fIN= 121 MHz 4,5,6 01,02 61 dBFS 4 63 fIN= 41 MHz 5,6 60.5 4 61 fIN= 71 MHz 5,6 57 4 56 Signal to noise ratio (with harmonics) 9/ SINAD fIN= 121 MHz 5,6 01,02 53 dBFS 4 73 fIN= 41 MHz 5,6 67.5 4 67 fIN= 71 MHz 5,6 60 4 61 Spurious
43、free dynamic range 10/ SFDR fIN= 121 MHz 5,6 01,02 55 dBFS 4 55.5 Two tone intermodulation distortion 11/ IMD f1IN= 121 MHz, f2IN= 122 MHz 5,6 01,02 53 dBc Power supply rejection ratio 3/ 6/ PSRR +4.75 V AVCC +5.25 V 7,8 01,02 5 mV/V Differential nonlinearity 6/ DNL 7,8 01,02 -0.99 +0.99 LSB Integra
44、l nonlinearity 6/ INL 7,8 01,02 -3 +3 LSB See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-99610 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 7
45、 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions 1/ unless otherwise specified Group A subgroups Device types Limits Unit Min Max Encode input common mode 6/ ENINCM 7,8 01,02 1.2 2.0 V Encode input resistance, single-ended 6/ ENRIN 7,8 01,02
46、3 8 k Channel to channel isolation 6/ 12/ ISO 7,8 01,02 80 dB Digital input, logic “1“ voltage 3/ 6/ VIH9,10,11 01,02 2.0 V Digital input, logic “0“ voltage 3/ 6/ VIL9,10,11 01,02 0.8 V Differential input (Encode, Encode) 6/ DIFFIN 9,10,11 01,02 0.4 +5.0 V Output valid time 5/ 6/ 13/ tV9,10,11 01,02
47、 3.0 ns Output propagation delay 5/ 6/ 14/ tPD9,10,11 01,02 4.5 8.0 ns 1/ Unless otherwise specified, AVCC= +5.0 V dc and DVCC= +3.3 V dc and ENCODE = 105 MSPS. Device type 01 test temperature is -55C TC +125C. Device type 02 test temperature is -40C TC +85C. 2/ Gain error measured at 2.5 MHz. 3/ Su
48、pply voltages should remain stable to within 5 % for normal operation. 4/ Power dissipation is measured with encode at rated speed and 0 dBm analog input. 5/ The digital output load during test is not to exceed an ac load of 10 pF or a dc current of 40 A. 6/ Parameter shall be tested as part of device initial characterization and after design and process changes. Parameter shall be guaranteed to the limits specified in table I for all lots not specifically tested. 7/ Input
