1、 EIA STANDARD TP-93 Repeated Wire Connection and Disconnection Test Procedure for Insulation Displacement Contacts (IDC) for Electrical Connectors EIA-364-93 July 1997 ANSI/EIA-364-93-1997(R2015) Approved: February 28, 1997 Reaffirmed: March 27, 2015 EIA-364-93NOTICE EIA Engineering Standards and Pu
2、blications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for his particula
3、r need. Existence of such Standards and Publications shall not in any respect preclude any member or nonmember of ECIA from manufacturing or selling products not conforming to such Standards and Publications, nor shall the existence of such Standards and Publications preclude their voluntary use by
4、those other than ECIA members, whether the standard is to be used either domestically or internationally. Standards and Publications are adopted by ECIA in accordance with the American National Standards Institute (ANSI) patent policy. By such action, ECIA does not assume any liability to any patent
5、 owner, nor does it assume any obligation whatever to parties adopting the Standard or Publication. This EIA standard is considered to have International Standardization implication, but the International Electrotechnical Commission activity has not progresses to the point where a valid comparison b
6、etween the EIA Standard and the IEC document can be made. This Standard does not purport to address all safety problems associated with its use or all applicable regulatory requirements. It is the responsibility of the user of this Standard to establish appropriate safety and health practices and to
7、 determine the applicability of regulatory limitations before its use. (From Standards Proposal No. 3654, formulated under the cognizance of the CE-2.0 Committee on EIA National Connector and Socket Standards, and reaffirmed per Standards Proposal No. 5346.10). Published by Electronic Components Ind
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