1、 EIA STANDARD Adhesive Backed Punched Plastic Carrier Taping of Singulated Bare Die and Other Surface Mount Components for Automatic Handling of Devices Generally Less Than 1.0mm Thick EIA-747-B (Revision of EIA-747-A) February 2014 EIA-747-B ANSI/EIA-747-B Approved: February 4, 2014 NOTICE EIA Engi
2、neering Standards and Publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper p
3、roduct for his particular need. Existence of such Standards and Publications shall not in any respect preclude any member or nonmember of ECIA from manufacturing or selling products not conforming to such Standards and Publications, nor shall the existence of such Standards and Publications preclude
4、 their voluntary use by those other than ECIA members, whether the standard is to be used either domestically or internationally. Standards and Publications are adopted by ECIA in accordance with the American National Standards Institute (ANSI) patent policy. By such action, ECIA does not assume any
5、 liability to any patent owner, nor does it assume any obligation whatever to parties adopting the Standard or Publication. This EIA Standard is considered to have International Standardization implication, but the International Electrotechnical Commission activity has not progressed to the point wh
6、ere a valid comparison between the EIA Standard and the IEC document can be made. This Standard does not purport to address all safety problems associated with its use or all applicable regulatory requirements. It is the responsibility of the user of this Standard to establish appropriate safety and
7、 health practices and to determine the applicability of regulatory limitations before its use. (From Standards Proposal No. 5254, formulated under the cognizance of the Automated Component Handling Committee. Published by Electronic Components Industry Association 2014 Engineering Department 2214 Ro
8、ck Hill Road, Suite 265 Herndon, VA 20170 PLEASE! DONT VIOLATE THE LAW! This document is copyrighted by the ECIA and may not be reproduced without permission. Organizations may obtain permission to reproduce a limited number of copies through entering into a license agreement. For information, conta
9、ct: IHS 15 Inverness Way East Englewood, CO 80112-5704 or call USA and Canada (1-877-413-5184), International (303-397-7956) i ADHESIVE BACKED PUNCHED PLASTIC CARRIER TAPING OF SINGULATED BARE DIE AND OTHER SURFACE MOUNT COMPONENTS FOR AUTOMATIC HANDLING OF DEVICES GENERALLY LESS THAN 1.0mm THICK CO
10、NTENTS 1 SCOPE 1 2 INTRODUCTION 1 3 APPLICABLE DOCUMENTS 1 4 REQUIREMENTS 2 5 COORDINATE SYSTEM AND DIMENSIONS 4 FIGURES Figure 1 Standard Die Orientation . 4 Figure 2 Coordinate System . 5 Figure 3 Component location in tape . 7 Figure 4 Component planar rotation and lateral displacement 7 Figure 5
11、 Adhesive Backed Punched Carrier Configuration 8 Figure 6 Tape Leader if used, Dimensions B and D will apply. Table 3 Reel Dimensions All Dimensions in Millimeters See Clause 4 for Requirements Tape Size A Max B* Min C D* Min N Min* W1 W2Max W3Min/Max 8mm 330 1.5 13.0 +0.50 / -0.20 20.2 50 8.4 +1.5/
12、-0.0 14.4 7.9/10.9 12mm 12.4 +2.0/-0.0 18.4 11.9/15.4 16mm 360 16.4 +2.0/-0.0 22.4 15.9/19.4 24mm 100 24.4 +2.0/-0.0 30.4 23.0/27.4 *Drive spokes optional; if used, Dimensions B and D will apply * See Note 2 Table 2 ECIA Document Improvement Proposal If in the review or use of this document, a poten
13、tial change is made evident for safety, health or technical reasons, please fill in the appropriate information below and mail or FAX to: Electronic Components Industry Association EIA Standards & Technology Department 2214 Rock Hill Rd., Suite 265 Herndon, VA 20170 FAX: (571-323-0245) Document No.:
14、 Document Title: Submitters Name: Telephone No.: FAX No.: e-mail: Address: Urgency of Change: Immediate: At next revision: Problem Area: a. Clause Number and /or Drawing: b. Recommended Changes: c. Reason/Rationale for Recommendation: Additional Remarks: Signature: Date: FOR ECIA USE ONLY Responsible Committee: Chairman: Date comments forwarded to Committee Chairman: Electronic Components Industry Association 2214 Rock Hill Road, Suite 170 * Herndon, VA 20170 * tel 571-323-0294 * fax 571-323-0245
