1、 EIA STANDARD Specification for Serial Attachment 3 Gbs 2X Unshielded Connector EIA-966 December 2012 ANSI/EIA-966-2012 Approved: December 07, 2012 EIA-966NOTICE EIA Engineering Standards and Publications are designed to serve the public interest through eliminating misunderstandings between manufac
2、turers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for his particular need. Existence of such Standards and Publications shall not in any respect preclude any member or nonme
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5、IA specification is considered to have International Standardization implications, but the International Electrotechnical Commission activity has not progressed to the point where a valid comparison between the EIA standard and the IEC document can be made. This Specification does not purport to add
6、ress all safety problems associated with its use or all applicable regulatory requirements. It is the responsibility of the user of this Standard to establish appropriate safety and health practices and to determine the applicability of regulatory limitations before its use. (From Standards Proposal
7、 No. 5201, formulated under the cognizance EIA CE-2.0 Committee on National Connector and Socket Standards, and previously published by the SFF Committee as SFF-8482.) Published by ECIA 2012 Engineering Department 2214 Rock Hill Road; Suite 170 Herndon, VA 20170 PLEASE! DONT VIOLATE THE LAW! This do
8、cument is copyrighted by the ECIA and may not be reproduced without permission. Organizations may obtain permission to reproduce a limited number of copies through entering into a license agreement. For information, contact: IHS 15 Inverness Way East Englewood, CO 80112-5704 or call USA and Canada (
9、1-800-854-7179), International (303-397-7956) (This page left blank) i CONTENTS Clause Page Foreword . iii Background . iv 1 Introduction . 1 1.1 Scope . 1 1.2 Applicable documents . 1 1.3 General description . 2 1.4 Definitions . 4 1.5 Dimensioning requirements 4 2 Printed circuit board layouts . 4
10、 3 General tolerances . 4 4 Backplane fixed (receptacle) interface features 12 4.1 Blind mating 12 4.2 Mating wipe and device clearances 14 4.3 Hot plugging 14 5 Ratings 16 6 Performance requirements 17 Figure 1 Device free (plug) connector 2 2 Backplane fixed (receptacle) connector 3 3 Cable fixed
11、(receptacle) connector . 3 4 Device free (plug) connector 5 5 Device free (plug) connector 6 6 Backplane fixed (receptacle) connector 7 7 Backplane fixed (receptacle) connector . 8 8 Cable fixed (receptacle) connector . 9 9 Through hole printed circuit board detail (pressfit & solder pin) . 10 10 Su
12、rface mount printed circuit board detail 10 11 Hybrid printed circuit board detail 11 12 Blind mate tolerance zones . 13 13 Backplane wipe requirements . 14 ii CONTENTS (continued) Table Page 1 Hot plug contact sequencing . 15 2 Electrical requirements . 17 3 Mechanical requirements 18 4 Environment
13、al requirements . 19 iii Foreword (This Foreword is informative only and is not part of this standard.) This Specification is from EIA Standards Proposal No. 5201, formulated under the cognizance of EIA CE-2.0, Committee on Connector and Socket Standards. This project was conducted in liaison with t
14、he SFF Committee as representing the disk drive industry. Utilization of this Standard is intended to eliminate misunderstandings or confusion between a manufacturer and user with respect to product performance and testing requirements for this as well as other possible applications. The development
15、 work on this specification was done by the SFF Committee, an industry group. The membership of the committee since its formation in August 1990 has included a mix of companies that are leaders across the industry. iv Background (This Background is informative only and is not part of this Specificat
16、ion.) Abstract: This specification defines an Unshielded Input/Output connector for serial interface unshielded devices, backplanes and cables. This specification is made available for public review, and written comments are solicited from readers. Comments received by the members will be considered
17、 for inclusion in future revisions of this specification. The description of a connector in this specification does not assure that the specific component is actually available from connector suppliers. If such a connector is supplied it must comply with this specification to achieve interoperabilit
18、y between suppliers. NOTE - The users attention is called to the possibility that compliance with this standard may require use of an invention covered by patent rights. By publication of this standard, no position is taken with respect to the validity of any such claim(s) or of any patent rights in
19、 connection therewith. If a patent holder has filed a statement of willingness to grant a license under these rights on reasonable and nondiscriminatory terms and conditions to applicants desiring to obtain such a license, then details may be obtained from the standards developer. EIA-966 Page 1 Spe
20、cification for Serial Attachment 3 Gbs 2X Unshielded Connector (From EIA Standards Proposal No. 5201, formulated under the cognizance EIA CE-2.0 Committee on National Connector and Socket Standards, and previously published by the SFF Committee as SFF-8482.) 1. Introduction 1.1 Scope 1.1.1 This spec
21、ification defines the mechanical and connector contact performance requirements for a composite connector system. This composite system is designed to support high speed serial signals and power on different contacts within the same housing. 1.1.2 Intended applications for this connector system incl
22、ude Serial Attached SCSI (SAS) as specified in the SAS standards and for other applications requiring such a connector system. 1.1.3 The SFF Committee was formed in August, 1990 to broaden the applications for storage devices, and is an ad hoc industry group of companies representing system integrat
23、ors, peripheral suppliers, and component suppliers. 1.2 Applicable documents The following documents form a part of this specification to the extent indicated herein. In the event of conflict between this specification and the referenced documents, this specification shall take precedence. 1.2.1 Ind
24、ustry documents ASME Y14.5M Dimensioning and Tolerancing T10/1562-D Serial Attached SCSI EIA-364 Electrical Connector/Socket Test Procedures Including Environmental Classifications (see Table 2, 3 and 4 for relevant test procedures) EIA-966 Page 2 1.3 General description 1.3.1 This connector system
25、is designed to allow devices to connect to cable assemblies or to PCBs with the same device connector interface. 1.3.2 The free (plug) interface incorporates three different contact sets (CS), see Figure 1. Two of these sets (CS1 and CS2) contain 7 contacts each and typically are used for high speed
26、 serial signals. The high speed signals are grouped into differential pairs flanked with Grounds (G-S-S-G-S-S-G). The third set (CS3) contains 15 contacts and typically would be used for low frequency purposes such as power and control. Figure 1 - Device free (plug) connector EIA-966 Page 3 1.3.3 Th
27、e backplane fixed (receptacle) interface supports free (plug) interfaces that have CS1 only or has both CS1 and CS2 contacts, see Figure 2. Blind mating is supported by the guides built into the mating interface and a provision for hot plugging is supported by the contact sequencing that is possible
28、 by using the offset contact positions. There is no provision for positive mating interface retention in this version. Figure 2 - Backplane fixed (receptacle) connector 1.3.4 The cable fixed (receptacle) supports free (plug) interfaces that have CS1 only or has both CS1 and CS2 contacts, see Figure
29、3. The cable fixed (receptacle) interface incorporates a passive latching retention system to prevent accidental disconnection of the interface. Figure 3 - Cable fixed (receptacle) connector 1.3.5 For cabled backplane implementation, the cable connector shall provide all feature requirements of the
30、backplane fixed (receptacle). EIA-966 Page 4 1.4 Definitions 1.4.1 Fixed Used to describe the gender of the mating side of a connector that accepts its mate upon mating. This gender is frequently, but not always, associated with the common terminology “receptacle”. Other terms commonly used are “fem
31、ale” and “socket connector”. The term “fixed” is adopted from EIA standard terminology as the gender that most commonly exists on the fixed end of a connection, for example, on the board or bulkhead side. In this document “fixed” is specifically used to describe the mating side gender. 1.4.2 Free Us
32、ed to describe the gender of the mating side of a connector that penetrates its mate upon mating. This gender is frequently, but not always, associated with the common terminology “plug”. Other terms commonly used are “male” and “pin connector”. The term “free” is adopted from EIA standard terminolo
33、gy as the gender that most commonly exists on the free end of a connection, for example, on the cable side. In this document “free” is specifically used to describe the mating side gender. 1.5 Dimensioning requirements 1.5.1 Connector interface The dimension requirements for the connector are limite
34、d to the mating interface only. In order to provide a uniform fit and to support the features outlined for each use model, all listed dimensions shall be met. 2. Printed circuit board layouts PCB layouts are included to provide a base line design for multisourcing of connectors and are not intended
35、to address the electrical performance characteristics of PCB construction. Electrical performance characteristics, including impedance and crosstalk, should also be considered when determining the hole diameter. Printed circuit board (PCB) layer stack up, hole drill diameter, trace layer location, P
36、CB material, copper plane anti-pads, hole pad diameter, and PCB thickness all have major contribution to the final electrical characteristics of the connector land pattern. PCB thickness of greater than 2.54 mm (0.100“) with FR-4 material may result in a differential impedance of less than 85 ohms w
37、hen the thru-hole patterns are used. 3. General tolerances Unless otherwise stated, the following tolerances shall apply: Two (2) place dimension: 0.20 millimeters Angular dimension: 3 degrees EIA-966 Page 5 Figure 4 - Device free (plug) connector EIA-966 Page 6 Figure 5 - Device fixed (plug) connec
38、tor EIA-966 Page 7 Figure 6 - Backplane fixed (receptacle) connector EIA-966 Page 8 Figure 7 - Backplane fixed (receptacle) connector EIA-966 Page 9 Figure 8 - Cable fixed (receptacle) connector EIA-966 Page 10 Figure 9 Through hole printed circuit board detail (pressfit & solder pin) Figure 10 Surf
39、ace mount printed circuit board detail Pad widths listed as reference dimensions are left open to the manufacturer to determine based on their internal design standards. In order to determine the pad widths for surface mount leads the following dimensions and tolerances shall apply: Solder leads on
40、1.27mm spacing: 0.40 millimeter 0.08 millimeter Solder leads on 0.80mm spacing: 0.30 millimeter 0.05 millimeter EIA-966 Page 11 Figure 11 Hybrid printed circuit board detail EIA-966 Page 12 Hole sizes listed as reference dimensions are left open to the manufacturer to determine based on their intern
41、al design standards. In order to determine the hole diameter for solder pins the following pin width dimensions and tolerances shall apply: Solder pins on 1.27 millimeters spacing: 0.40 millimeter 0.08 millimeter Solder pins on 0.80millimeter spacing: 0.40 millimeter 0.08 millimeter Pad widths liste
42、d as reference dimensions are left open to the manufacturer to determine based on their internal design standards. In order to determine the pad widths for surface mount leads the following dimensions and tolerances shall apply: Solder leads on 1.27 millimeters spacing: 0.40 millimeter 0.08 millimet
43、er Solder leads on 0.80 millimeter spacing: 0.30 0.05 millimeter 4. Backplane fixed (receptacle) interface features 4.1 Blind mating 4.1.1 The process of mating an unshielded serial attachment connector pair should be accomplished in a “free fit“ manner where no excessive mechanical stresses are pla
44、ced on the connectors during or after the mating process. The mating process should be considered in the context of the packaging surrounding the device with the connectors. Stresses considered include those transmitted to the mated connector through the device: for example, the weight of the drive,
45、 that resulting from resilient device guide members in the enclosure, the device retention mechanism, acceleration stresses (mechanical shock testing) and interference with enclosure parts. Mechanical interference between the device with the mated connectors and fixed or solid parts of the packaging
46、 will generally not be tolerated by the unshielded serial attachment system. 4.1.2 The mating interface specifications require a two stage process to arrive at the final mated contact: The first stage must be delivered by the device enclosure system to achieve center to center alignment of less than
47、 1.5 millimeters in the longitudinal axis and less than 1.0 millimeter in the horizontal axis prior to any part of the connector pair engaging. This is the blind mate tolerance zone depicted in Figure 12. The second stage (connector blind mate pre-alignment features) positions the connectors from 1.
48、5 millimeters / 1.0 millimeter initial engagement through to a point where the main connector chamfers engage (normal connector engagement). EIA-966 Page 13 4.1.3 Connector designers should recognize that certain lateral movement between free gender contacts and fixed gender contacts may occur betwe
49、en the time the prealignment features engage and the contacts reach the final mated position. 4.1.4 The positional requirements in Figure 13 define the fully mated condition. CAUTION When mating unshielded serial attachment connectors without the aid of guide rails (or other premating guiding systems not part of the connector) there is a risk of shorting signals to power. This event may damage the devices on either side of the connector. Figure 12 Blind mate tolerance zones EIA-966 Page 14 4.2 Mating wipe and device
