1、L - EIA IS-46 87 m 3234600 0002546 T m c -9 -0 e EIA INTERIM STANDARD Test Procedure for Resistance to Soldering (Vapor Phase Technique) for Surface Mount Dev ic es EIA/IS-4-6 ELECTRONIC INDUSTRIES ASSOCIATION ENGINEERING DEPARTMENT EIA IS-46 87 3234b00 0002547 II r NOTICE EIA Engineering Standards
2、and Publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for his par
3、ticular need. Existence of such Standards and Pub- lications shall not in any respect preclude any member or non-member of EIA from manufacturing or selling prducts not conforming to such Standards and Publications, nor shall the existence of such Standards and Publications preclude their voluntary
4、use by those other than EIA members, whether the standard is to be used either domestically or internationally. Recommended Standards and Publications are adopted by EIA without regard to whether or not their adoption may involve patents on articles, materials, or processes. By such action, EIA does
5、 not assume any liability to any patent owner, nor does it assume any obligation whatever to parties adopting the Recom- mended Standard or Publication. EIA INTERIM STANDARDS EIA Interim Standards contain information deemed to be of technical value to the industry, and are published at the request o
6、f the originating Committee without necessarily following the rigorous public review and resolution of comments which is a procedural part of the development of an EIA Recom- mended Standard. EIA interim Standards should be reviewed on an annual basis by the formulating Committee and a decision made
7、 on whether to proceed to develop an EIA Recommended Standard on this subject. EIA Interim Standards must be cancelled by the Committee and removed from the EIA Standards Catalog before the end of their fifth year of existence. This Interim Standard was developed by the EIA P-5.1 Working Group on Co
8、nnectors. Published by ELECTRONIC INDUSTRIES ASSOCIATION Engineering Department 2001 Eye Street, N.W. Washington, D.C. 20006 Printed in U.S.A, .- EIA IS-46 87 W 3234600 O002548 3 W r - EWIS-46 Page 1 TEST PROCEDURE FOR RES1STANC.E TO SOLDERING (VAPOR PHASE TECHNIQUE) FOR SURFACE MOUNT DEVICES 1.0 Sc
9、ope There are two basic processes for soldering surface mount connectors 7- vapor phase and infra-red. systems is exposed to with no insulating medium (e.g. boards) between the termination and connector assembly. heat, the vapor phase system employs a chemical medium (perfluoro-carbon) in a vapor fo
10、rm. must withstand both heat and chemical vapors. features which must be evaluated prior to a material or connector configuration being acceptable for surface mount process. are: Both apply heat which the total connector printed circuit In addition to Connector materials are exposed to these mediums
11、 and thus There are three basic These factors A: Heat Impact B: Dimensional Stability C: Chemical Resistance This procedure establishesa technique to evaluate plastic materials used for connector housings which will be exposed to a vapor phase reflow process. 2.0 Component Configuration 2.1 Classes:
12、 A: Material test bar B: Housing without contacts assembled C: Housing with contacts assembled EIA IS-46 87 W 3234600 0002549 5 W EIA/IS-46 Page 2 2.1.1 When evaluating an item, the class shall be designated with 3 full description of size, configuration, color and contact description, if applicable
13、. 2.1.2 Class A (test bar) may be used for screening purposes. the basic resistance of a material to the soldering process. It evaluates 2.1.3 Class B (housing without contacts assembled) may be used to evaluate the component in its finished state. the resistance of. the material itself, but the imp
14、act of internal molding stress and dimensional stability of the component itself. Class C (housing with contacts) will evaluate the attributes mentioned in 2.1.2 and 2.1.3. of assembly stress and can determine if any housing damage results from reflowing of the contact finish. It will determine not
15、only 2.1.4 It additionally evaluates the impact 3.0 Test Procedure 3-1 Unless otherwise specified, the test procedure performed shall be per EIA I“-56, Procedure 4. NOTE: This procedure exposes the material to both heat and vapors commonly used in SMT processes. 4.0 Evaluation 4.1 Housing Damage 4.1
16、.1 After exposure (EIA TP-56, Procedure 4) the material shall be visually examined under magnification for: A: Physical Features: a) blistering b) melting c) deformation d) cracking e) f) contact retention, if applicable cracking around contacts which have been assembled B: Dimensional Features: a)
17、b) c) d) other dimensions as specified overall length of the sample overall width of the sample overall height of the sample EIA IS-4b 7 m 3234600 0002550 i m EIA/IS/46 Page 3 4.1.2 It is recommended that connectors with mounting or locating features be evaluated with said connectors assembled to a
18、printed circuit board. would be in normal production. The mounting features shall be processed as they 4.1.2.1 In addition to those items indicated in 4.1.1, the following should be evaluated functionally and/or visually as applicable: a) b) functional test, if so specified (e.g. connector/printed l
19、oosening of the mounting or locating feature circuit board retention) 4.1.2 Those connectors which imply a “pressure contact“ to the printed circuit board shall be tested mounted to a printed circuit board to determine if it induces board warpage. 5.0 Summary 5;l The following details shall be speci
20、fied in the individual specification: A: Number of test samples B: C: Allowable change in physical features Allowable change in dimensional features D: Functional tests, if applicable The following details shall be indicated on the data sheet: 5.2 A: Title of test B: Description of test samples C: T
21、est conditions - exposure duration 6.0 Special Notes 6.1 It should be cautioned that a material may be found to be accept- able in one configuration but unacceptable in other configurations. This can be a result of molding stresses, color, additives used, etc. Thus, it is recommended that different configurations be evaluated and material acceptance be granted on a configuration by configuration basis. o
