1、EIA IS-692 96 3234600 0574357 3b EIA INTERIM STANDARD I Ceramic Capacitor Qualification Specification EIMS-692 MAY 1996 ELECTRONIC INDUSTRIES ASSOCIATION ENGINEERING DEPARTMENT EIA IS-692 96 3234600 0574158 752 NOTICE EIA Engineering Standards and Publications are designed to serve the public intere
2、st through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for his particular need. Existence of such Standards and Publicatio
3、ns shall not in any respect preclude any member or nonmember of EIA fiom manufacturing or selling products not conforming to such Standards and Publications, nor shall the existence of such Standards and Publications preclude their voluntary use by those other than EIA members, whether the standard
4、is to be used either domestically or internationally. Standards and Publications are adopted by EIA in accordance with the American National Standards Institute (ANSI) patent policy. By such action, EIA does not assume any liability to any patent owner, nor does it assume any obligation whatever to
5、parties adopting the Standard or Publication. (From Project Number 3335, formulated under the cognizance of the EIA P-2.1 Ceramic and Mica Dielectric Subcommittee.) EIA INTERIM STANDARDS EIA Interim Standards contain information deemed to be of technical value to the industry, and are published at t
6、he request of the originating Committee without necessarily following the rigorous public review and resolution of comments which is a procedural part of the development of an EIA Standard. EIA Interim Standards should be reviewed on an annual basis by the formulating Committee and a decision made o
7、n whether to proceed to develop an EIA Standard on this subject. EIA Interim Standards must be cancelled by the Committee and removed fiom the EIA Standards Catalog before the end of their fifth year of existence. Published by OELECTRONIC INDUSTRIES ASSOCIATION 1996 Engineering Department 2500 Wilso
8、n Boulevard Arlington, VA 2220 1 PRICE: Please refer to the current Catalog of EM, JEDEC, and TIA STANDARDS and ENGINEERING PUBLICATIONS or call Global Engineering Documents, USA and Canada (1-800-854-7179) International (303-397-7956) All rights reserved Printed in U.S.A. EIA IS-692 96 3234600 0574
9、159 699 = Contents Page Eoreword i1 Clause 1 1.1 1.2 1.3 2 2.1 2.2 2.3 2.4 2.5 2.6 2.7 3 3.1 3.2 4 4.1 4.2 4.3 4.4 4.5 4.6 4.7 4.8 4.9 4.10 4.1 1 4.12 4.13 4.14 Annex Scope 1 Description . 1 Preconditioning 1 Reference documents 1 General requirements 1 Objective . 1 Genericdata . 2 Testsamples 3 De
10、finition of electrical test failure after stressing 3 3 Alternative testing requirements 3 Electrical distributions . 3 Qualification and requalification 3 Qualification of a new device 3 Changes requiring requalification . 4 Qualification tests 4 Generaltests 4 Electrical tests . 5 Visual and mecha
11、nical examination 6 Accelerated life test . 6 Loadhumiditytest 7 Thermalshock . 7 Temperature characteristics . 9 Destructive physical analysis 9 Vibration . 9 Shock . 9 Terminalstrength . 9 Flammability . 10 Solderabilis 10 Surface mount thermal shock . 10 Criteria for passing qualification A Capac
12、itor qualification preconditioning specification . 11 B Detail specification sheets . 16 EIA IS-692 96 3234600 0574160 300 Foreword This specification was prepared by the Electronic Industries Association?s P-2.1 Ceramic Capacitor Subcommittee Task Force on Passive Device Qualification Specification
13、s EIA IS-692 96 3234600 0574161 247 W EIMS-692 Page 1 1 Scope 1.1 Description This specification defines the qualification program for ceramic capacitors. The qualification program is defined in table 1. Specification sheets can be added, as required, to define specific products or to cover unique/s
14、pecific requirements. 1.2 Preconditioning This process is intended to simulate exposure to the thermal and cleaning environments of the assembly process before qualification testing. The component assembly process simulation requirements for different types of processes are described in annex A 1.3
15、Reference documents The current revision of the referenced documents will be in effect at the date of agreement to the qualification plan. Subsequent qualification plans will automatically use the latest revisions of these referenced documents. EM- 1 9 8 -D EIA-469-B EIA-52 1 EM-595 MIL-STD-202 MIL-
16、STD- 105 MIL-HDBK-H53 Military Handbook - Guide for Attribute Lot Sampling Inspection UL-94 IEC-695-2-2 Needle-Flame Test ASTM-2863 MIL-STD-883 Ceramic Dielectric Capacitors Standard Test Method for Destructive Physical Analysis of High- Reliability Ceramic Monolithic Capacitors Application Guide fo
17、r Ceramic Capacitors-Electrical Visual Mechanical - Multilayer Ceramic Chip Capacitor Test Methods for Electronic and Electrical Component Parts Sampling Procedures and Tables for Inspection by Attributes Tests for Flammability of Plastic Materials Flammability of Plastics Using the Oxygen Index Met
18、hod Test Methods for Electronic and Electrical Component Parts 2 General requirements This specification includes requirements with the intention of developing a set of robust qualification tests that would enable a supplier to leverage test results to satis the requirements of multiple OEM customer
19、s. EIA IS-692 96 3234600 0574162 183 EIMS-692 Page 2 2.1 Objective The objective of this qualification program is to ensure that the device to be qualified meets a minimum set of qualification requirements. 2.2 Generic data 2.2.1 The use of generic data to satis approval levels and sampling plan Tes
20、t method Capacitor inspection Sample size per lot Total sample size Defects permitted 4.2 Electrical 240 720 O characteristics 4.3 Visual and mechanical 5 15 O 4.4 Life test 40 120 O 4.5 Load humidity test 40 120 O 4.6 Thermal shock 40 120 O 4.7 Temperature 40 120 O characteristics 4.8 DPA 5 15 O 4.
21、9 Vibration 5 15 O I 4.10 Shock I 4.11 Terminal strength 5 15 O I 4.12 Flammability Present dcate of compliance 4.13 Solderability 20 60 O 4.14 Surface mount thermal 40 120 O shock 4.2 Electrical characteristics Total samples required in table 1 shall be measured initially before subsequent testing.
22、 When required, capacitance, dissipation factor, insulation resistance, dielectric withstanding voltage, etc., shall be measured at the conditions (test frequency, voltage, etc.) specified in EIA-198-D. All initial measurements shall meet the following requirements in table 2. Table LElectrical requ
23、irements I I Electrical properties Ceramic capacitor classesper EIA-198-D Class I (eg., COG) Class II (eg., X7R) Class III (eg., WU) Class III (eg., Y5V) Capacitance within tolerance within tolerance within tolerance within tolerance Maximum DF Yo o. 1 2.5 4 4 IR (GQ or resistor- capacitor product,
24、whichever is less) 100 GQ or 1 kn-F 100 GR or 1 kQ-F 10 GQ or 100 Q-F 10 GR or 100 8-F EIA IS-692 96 3234600 0574166 29 EINIS-692 Page 6 4.3 Visual and mechanical examination Capacitors shall be examined to veri9 that visual criteria and mechanical dimensions meet the requirements defined in the spe
25、cification sheet (see annex B), or referenced document EM-595. The more severe specification shall apply. 4.3.1 Chips or chipouts greater than 0.08 mm (0.003 in) in depth or extending more than 50% of a side or 50% of the top or bottom are not acceptable. (Usually due to a fracture and found on the
26、edges.) 4.3.2 Pinholes that extend to a depth of more than 0.05 mm (0.002 in) or that expose the metal electrode are unacceptable. 4.4 Accelerated life test Capacitors shall be tested per EIA-198-D, Method 201, except: a) Preconditioning is required. b) Twice rated voltage for 1000 hours. c) Test te
27、mperature shall be maximum rated temperature. d) Measurements shali bemade at O h, 250 h, 500 h, and 1000 h. e) Requirements at intermediate and post-test readouts shall be in accordance with the table below or EM-198-D. Table eight (8) parts shall be tested to Test Condition A (pull test) and seven
28、 (7) parts shall be tested to Test Condition C (bend test). b) For nonleaded chip capacitors, all fifteen (15) parts shall be tested to Test Condition D (shear test). c) Post-test requirements. Capacitors shall be visually examined for evidence of loosening or rupturing of the terminals. Breakage of
29、 lead wire or solder interface, which does not expose ceramic, shall not constitute a failure. Electrical measurements are not required. 4.12 Flammability This test does not apply to ceramic chip capacitors. The encapsulating material, when applicable, shall be certified to meet the minimum flammabi
30、lity requirements of UL-94 V-O or V-1 and an oxygen index of 28% minimum as defined in ASTM-2863-91. The supplier must provide certificates of compliance to both tests upon request. When UL and oxygen-index testing are not feasible, the IEC “needle-flame“ test (EC 695-2-2), may be used. In all cases
31、, appropriate documentation must be maintained. 4.13 Solderability Capacitors shall be tested per EIA-198-D, Method 301, except: both terminals (terminations) shall be tested. 4.14 Surface mount thermal shock Capacitors shall be tested per EIA-198-D, Method 307. EIA IS-692 96 3234600 0574171 196 EI
32、AIIS-692 Page 11 Annex A Ceramic capacitor qualification specification A.l Preconditioning This process is intended to simulate exposure to the thermal and cleaning environments of the assembly process before qualification testing. The component assembly process simulation requirements are described
33、 by the figures which follow. The substrate material shall be 1.57 mm (0.062 in) FR4. Capacitors shall be subjected to the following conditions sequentially as listed in table A. 1 before qualification. A.l.l Wave solder exposure process This profile is intended to be used for components applied to
34、the top side of a board. Capacitors shall be run through this profile one time. See figure A. 1. A.1.2 Wave solder immersion process This profile is intended to be used for components applied to the bottom side of a board. Capacitors shall be run through this profile one time. See figure A.2. A.1.3
35、Reflow process Capacitors shall be run through this profile four times. See figure A.3. A.1.4 Cleaning - aqueous Capacitors shall be run through three cycles. See figure A.4. Table A.l-Surface mount and leaded capacitors I Top side SMT z 1812 Top size leaded Top and bottom side SMT 5 1210 Condition
36、A.l.l No No Yes A. 1.2 Yes No No A. 1.3 Yes Yes No A. 1.4 Y es Yes Yes EIA IS-692 96 m 3234600 0574372 O22 m EIALIS-692 Page 12 Figure A.l- Recommended wave solder preconditioning profile EIA IS-692 96 = 3234600 0574373 Tb9 250 EIMS-692 Page 13 #) O 50. loo 150 2Qo 250 fimm Figure A.2 - Recommended
37、wave solder immersion preconditioning profile EIA IS-692 96 D 3234600 0574374 9T.5 D EIAAS-692 Page 14 m I/ , I I o L-*.“& - _. . . . . - - _ o t 4 e 0 10 12 k(0 Figure A.3 - Recommended reflow oven preconditioning profde m 10 O EIA IS-692 96 3234600 0574175 831 EIMS-692 Page 15 RECOMMENDED AOUEOUS
38、CLEANING PRECONDITIONING PROFILE - 75+-5Cbor570+ -1Os.C. Mu Spray Pressum = 105 + -5 Figure A.4 - Recommended aqueous cleaning preconditioning profile EIAAS-692 Page 16 EIA IS-692 96 3234600 O574376 778 b Annex B Detail specification sheets The detail specification sheets shall be per EM-198-D. Styl
39、e Specification Sheet Ceramic disc capacitors:styles CC025, CC030, CC039 19811 500 volt tubular, radial-leaded ceramic capacit0rs:style CC4020 19812 Multiple layer, unencapsulated, ceramic dielectric chip capacitors: styles CC402, CC603, CCSOS, CC1206, CC1210, CC1812, CC1825 Ceramic, conformally coa
40、ted, radial lead capacitors: styles CC 15 15, CC2020, CC3030, CC4040, CC5050 19813 19814 Ceramic radial lead capacitors:styles CC19 19, CC2929 19815 Ceramic axial lead capacitors, glass-encapsulated: styles AGI 7 1 O, AG20 1 O, AG26 1 O, AG3 O 15, AG40 15 Single and multiple layer, encapsulated ceramic dielectric two-pin dual in-line capacitors:style DP25 10 Multiple layer, ceramic dielectric, high-voltage, capacitors (radial-encapsulated and uncapsulated chips) 19817 19818 19819
