1、 EIA STANDARD TP-56E RESISTANCE TO SOLDERING HEAT TEST PROCEDURE FOR ELECTRICAL CONNECTORS AND SOCKETS EIA-364-56E (Revision of EIA-364-56D) NOVEMBER 2011 EIA Standards Electronic Components Industry Association ANSI/EIA-364-56E-2011 Approved: November 15, 2011 EIA-364-56ENOTICE EIA Engineering Stan
2、dards and Publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for h
3、is particular need. Existence of such Standards and Publications shall not in any respect preclude any member or nonmember of ECIA from manufacturing or selling products not conforming to such Standards and Publications, nor shall the existence of such Standards and Publications preclude their volun
4、tary use by those other than ECIA members, whether the standard is to be used either domestically or internationally. Standards and Publications are adopted by ECIA in accordance with the American National Standards Institute (ANSI) patent policy. By such action, ECIA does not assume any liability t
5、o any patent owner, nor does it assume any obligation whatever to parties adopting the Standard or Publication. This standard is based upon the major technical content of International Electrotechnical Commission standard 512-6, test 12d, resistance to soldering heat, solder bath method, 1984. It co
6、nforms in all essential respects with this IEC standard. This Standard does not purport to address all safety problems associated with its use or all applicable regulatory requirements. It is the responsibility of the user of this Standard to establish appropriate safety and health practices and to
7、determine the applicability of regulatory limitations before its use. (From Standards Proposal No. SP-5220 formulated under the cognizance of the CE-2.0 National Connector Standards Committee). Published by ELECTRONIC COMPONENTS INDUSTRY ASSOCIATION 2011 Engineering Department 2500 Wilson Boulevard,
8、 Suite 310 Arlington, VA 22201 PLEASE ! DONT VIOLATE THE LAW! This document is copyrighted by the ECIA and may not be reproduced without permission. Organizations may obtain permission to reproduce a limited number of copies through entering into a license agreement. For information, contact: IHS 15
9、 Inverness Way East Englewood, CO 80112-5704 or call USA and Canada (1-800-854-7179), International (303-397-7956) i CONTENTS Clause Page 1 Introduction . 1 1.1 Scope . 1 1.2 Object 1 1.3 Reference documents 1 2 Test resources 2 2.1 Equipment . 2 2.2 Material . 3 3 Test specimen 3 3.1 Description 3
10、3.2 Preparation 3 4 Test procedure . 3 4.1 General for Procedure 1 and 2 only 4 4.2 Procedure 1, solder cup . 4 4.3 Procedure 2, solder eyelet tab or post . 4 4.4 Procedure 3, dip and wave solder . 5 4.5 Procedure 5, infrared reflow; or Procedure 6, convection reflow . 6 5 Details to be specified .
11、8 6 Test documentation . 8 Table 1 Test conditions 6 2 Test levels . 7 Annex A Normative . A-1 (This page left blank) EIA-364-56E Page 1 TEST PROCEDURE No. 56E RESISTANCE TO SOLDERING HEAT TEST PROCEDURE FOR ELECTRICAL CONNECTORS AND SOCKETS (From EIA Standards Proposal No. 5220, formulated under th
12、e cognizance ECIA CE-2.0 Committee on National Connector Standards, and previously published in EIA-364-56D.) 1 Introduction 1.1 Scope This standard establishes a test method for determining if connectors or sockets can withstand exposure to soldering conditions either by soldering iron, solder dip,
13、 solder wave, or reflow soldering techniques. 1.2 Object Soldering conditions may affect the electrical characteristics of the connector or socket and/or cause damage to component materials. They may also result in loosening of terminations, softening or distortion of insulation materials, opening o
14、f solder seals, weakening of mechanical joints, etc. 1.3 Reference documents The following documents form a part of this standard to the extent indicated herein. In the event of conflict between this standard and the referenced document this standard shall take precedence. ANSI/EIA/IPC J-STD-004: Re
15、quirements for Soldering Fluxes ANSI/EIA/IPC J-STD-006: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications IPC-CH-65: Guidelines for Cleaning Printed Circuit Boards and Assemblies IPC/JEDEC J-STD-020: Moisture/Reflow Sensitiv
16、ity Classification for Non-hermetic Solid State Surface Mount Devices EIA-364-56E Page 2 2 Test resources 2.1 Equipment 2.1.1 Solder pot A solder pot of sufficient size to accommodate a mounting board (see 2.1.3) and of sufficient depth so that connector or socket terminations do not touch the botto
17、m of the pot shall be used. This apparatus shall be capable of maintaining the solder at the specified temperature. The temperature shall be measured in the center of the pot at a depth of at least 12.70 millimeters (0.500 inch), but no deeper than 25.4 millimeters (1.00 inch) below the surface of t
18、he solder. 2.1.2 Heat sinks or shielding The use of heat sinks or shielding is prohibited except when it is part of the connector or socket. When applicable, heat sinks or shielding shall be specified in the referencing document along with details such as materials of construction, part dimensions,
19、method of attachment, and location of the necessary protection. 2.1.3 Mounting board 2.1.3.1 A mounting board suitable for the specified test temperature may be used. When applicable, the through-hole size shall be such that the diametrical clearance between it and the component terminals shall not
20、exceed 0.71 millimeter (0.028 inch) nor be less than 0.15 millimeter (0.0006 inch), unless otherwise specified in the referencing document. For Procedure 3, the board shall have no circuitry or copper surfaces. For Procedures 5 and 6, through-holes may be plated through. 2.1.3.2 The mounting board s
21、hall be of appropriate size so that it protrudes 19.05 millimeters (0.750 inch) minimum around the periphery of the connector or socket. For Procedure 3, its thickness shall allow the component terminals to protrude at least 0.762 millimeter (0.030 inch). 2.1.4 Reflow chambers The reflow chambers or
22、 equivalent equipment shall be of sufficient size to accommodate the mounting board or substrate containing the connector or socket to be evaluated. They shall be capable of generating the specified temperature and environment. 2.1.5 Pre-heat equipment A suitable air circulating chamber shall be use
23、d that will maintain the temperature of the connector or socket within the tolerance and for the duration specified. EIA-364-56E Page 3 2.2 Material 2.2.1 Solder The solder alloy shall conform to EIA/IPC J-STD-006, unless otherwise specified in the referencing document. In any case, it shall be suit
24、able to attain the specified solder temperature. 2.2.2 Flux When applicable, the flux shall conform to either a no clean, a mildly activated, a highly activated, or a corrosive (pH 1-2) type as found in EIA/IPC J-STD-004. If not specified in the referencing document a mildly activated type ROM0 (pre
25、viously RMA) shall be used. In any case, it shall be suitable to insure solder wicking on the connector or socket terminations. 3 Test specimen 3.1 Description The test specimens shall be selected from an actual lot of production connectors or sockets per the referencing document. 3.2 Preparation 3.
26、2.1 All test specimens shall be tested in their normal condition for assembly soldering. 3.2.2 The test specimens shall not be touched by fingers or otherwise contaminated, nor shall their terminations be wiped, cleaned, scraped, or abraded. Special preparation of terminations, such as bending or re
27、-orienting before testing, shall be specified in the referencing document. 4 Test procedure Testing shall be performed with solder terminations attached to the connector or socket, unless otherwise specified in the referencing document. Which of five test procedures to use depends on the applicable
28、solder process. Note that Procedure 4 is obsolete. Procedure 1: Solder cup Procedure 2: Solder eyelet tab and post Procedure 3: Dip and wave solder Procedure 4: Vapor phase reflow (OBSOLETE) Procedure 5: Infrared reflow Procedure 6: Convection reflow EIA-364-56E Page 4 4.1 General for Procedures 1 a
29、nd 2 only 4.1.1 Unless otherwise specified in the referencing document, a minimum length of 25.4 millimeters (1.00 inch) of the applicable copper wire size shall be properly prepared and inserted into the termination. 4.1.2 A flux (see 2.2.2) shall be applied to the test specimens. 4.1.3 Unless othe
30、rwise specified in the referencing document, a pencil type soldering iron rated for 25 watts shall be used. When required due to the size of the terminations being evaluated, the appropriate wattage of the soldering iron shall be specified in the referencing document. 4.2 Procedure 1, solder cup 4.2
31、.1 The soldering iron tip shall be heated (to a temperature specified in the referencing document) and applied to the termination (for a duration specified in the referencing document). In the absence of such a specification, the soldering iron tip shall be heated to 360 C 10 C (680 F 18 F) for a Sn
32、Pb solder application or 426 C 10 C (799 F 18 F) for a lead-free solder application and shall be applied to the termination for a duration that allows the solder to become liquid and remain in a liquid state for 4 to 5 seconds. 4.2.2 Remove the soldering iron and perform a visual inspection at 10X p
33、lus any measurements specified in the referencing document. 4.3 Procedure 2, solder eyelet tab or post 4.3.1 The soldering iron tip shall be heated (to a temperature specified in the referencing document) and applied to the termination (for a duration specified in the referencing document). In the a
34、bsence of such a specification, the soldering iron tip shall be heated to 360 C 10 C (680 F 18 F) for a SnPb solder application or 426 C 10 C (799 F 18 F) for a lead-free solder application and shall be applied to the termination for a duration that allows the solder to become liquid and remain in a
35、 liquid state for 4 to 5 seconds. 4.3.2 Unless otherwise specified in the referencing document, the solder and soldering iron shall be applied at a distance of 1.91 millimeters (0.075 inch) to 2.54 millimeters (0.100 inch) from the plastic housing. 4.3.3 Remove the soldering iron and perform a visua
36、l inspection at 10X plus any measurements specified in the referencing document. EIA-364-56E Page 5 4.4 Procedure 3, dip and wave solder 4.4.1 Test specimen preparation 4.4.1.1 Unless otherwise specified in the referencing document, the test specimens shall be mounted on a board with their terminati
37、ons inserted in through-holes. They shall not be in contact with each other, but they shall be in contact with the board. The mounting board shall be as described in 2.1.3. 4.4.1.2 A flux (see 2.2.2) shall be applied to the test specimens. 4.4.1.3 Any special preparation of test specimens prior to t
38、esting shall be defined in the referencing document. It could include bending of the terminations, cleaning (such as that found in IPC-CH-65), application of a special flux, pre-tinning of the terminations, and/or attachment of heat sinks or shielding (see 2.1.2). 4.4.2 Test specimen solder immersio
39、n/emersion 4.4.2.1 Unless otherwise specified in the referencing document, test specimens shall be placed in an air circulating chamber (see 2.1.5) and pre-heated at 150 C 5 C for a minimum of 2 minutes. 4.4.2.2 Test specimens mounted on a board shall be immersed in a solder pot (see 2.1.1) containi
40、ng molten solder (see 2.2.1) so that the bottom of the board contacts the solder. 4.4.2.3 Terminations of test specimens not mounted on a board shall be immersed in a solder pot (see 2.1.1) containing molten solder (see 2.2.1) to the depth specified in the referencing document. If not defined, they
41、shall be immersed to a minimum depth of 0.762 millimeter (0.030 inch). The terminations shall be immersed simultaneously, component geometry permitting. 4.4.2.4 The test condition shall be specified in the referencing document. When not defined, one shall be selected from table 1. The default test c
42、ondition to be used for a Sn/Pb solder application is test condition G, whereas that to be used for a lead-free solder is test condition H. Unless otherwise specified in the referencing document, the test specimens for test conditions G and H shall be subjected to 2 passes. After each pass the test
43、specimens shall be removed from the solder and allowed to cool and stabilize at room ambient conditions. Dross shall be removed from the solder prior to immersion. The surface of the solder shall be kept bright and clean. EIA-364-56E Page 6 4.4.3 Test specimen measurements and observations 4.4.3.1 U
44、pon completion of all passes, perform a visual inspection at 10X magnification plus any measurements specified in the referencing document. Table 1 Test conditions Test condition Solder temperature Immersion duration, seconds Immersion and emersion rate, per second A 350 C 10 C (662 F 18 F) 3 0.5 25
45、.4 millimeters 6.35 millimeters (1.00 inch 0.25 inch) B 260 C 5 C (500 F 9 F) 10 1 25.4 millimeters 6.35 millimeters (1.00 inch 0.25 inch) C 260 C 5 C (500 F 9 F) 10 2 D 260 C 5 C (500 F 9 F) 20 2 E 280 C 5 C (536 F 9 F) 30 2 F (see note 1) G (see note 2) 265 C 5 C (509 F 9 F) 10 2 H (see note 2) 27
46、5 C 5 C (527 F 9 F) 10 2 NOTES 1 Test condition F superseded by test condition D. 2 Test conditions G and H shall be performed for 2 passes. 4.5 Procedure 5, infrared reflow, or Procedure 6, convection reflow 4.5.1 Test specimen preparation 4.5.1.1 The test specimens shall be placed on a mounting bo
47、ard (see 2.1.3) or substrate surface in a position that is to be expected during normal use of the connector or socket. Unless otherwise specified in the referencing document, they shall be exposed, unfastened, to the reflow conditions. 4.5.1.2 Unless otherwise specified in the referencing document,
48、 flux shall not be applied. EIA-364-56E Page 7 4.5.2 Test specimen exposure to reflow conditions 4.5.2.1 A test chamber with infrared (Procedure 5) or convection (Procedure 6) heating capability and of such size to accommodate all test specimens shall be used. The chamber shall be of a single or mul
49、tiple temperature zone construction, with or without a conveyor transport system, as long as it is capable of meeting the reflow conditions of 4.5.2.2 and 4.5.2.3. 4.5.2.2 Unless otherwise specified in the referencing document, the reflow profile shall meet the requirements specified in the latest version of IPC/JEDEC J-STD-020, exclusive of the peak/classification temperature. 4.5.2.3 Unless otherwise specified in the referencing
