1、 STD=BSI BS EN 153000-ENGL 1998 3624667 0711424 227 Harmonized system of quality assessment for electronic components Generic specification: Discrete pressure contact power semiconductor devices (Qualification approval) BS EN 153000:1998 The European Standard EN 153000:1998 has the status of a Briti
2、sh Standard ICs 31.080.01 BSI PERMISSIO W STD=BSI BS EN 153000-ENGL 3998 3624669 0733425 363 m Date BS EN 163000:1998 Text affected National foreword This British Standard is the English language version of EN 1530001998 published by the European Electxonic Components Committee (CECC) of the Europea
3、n Committee for Electrotechnical Standardization (CENELEC). The UK pasticipation in its preparation was entrusted to Technical Committee EPU47, Semiconductors, which has the responsibiity to: - aid enquirers to understand the text; - present to the responsible internationallEuropean committee any en
4、quiries on the interpretation, or proposals for change, and keep the UK interests informed - monitor related international and European developments and promulgate them in the UK. A list of organizations represented on this committee can be obtained on request to its secretary. Cross-references The
5、British Standards which implement international or European publications referred to in this document may be found in the BSI Standards Catalogue under the section entitJed “International Standards Correspondence Index”, or by using the “Find” faciity of the BSI Standards Electronic Catalogue. A Bri
6、tish Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. Summary of pages This document comprises a fro
7、nt cover, an inside front cover, the EN title page, pages 2 to 42, an inside back cover and a back cover. This British Standard, having been prepared under the direction of the Electrotechnical Sector Board, was published under the authority of the Standards Board and comes into effect on 15 July 19
8、98 Amendments issued since publication Amd. No. O BSI 1998 ISBN O 680 30206 7 STD-BSI BS EN 153000-ENGL 1998 1b24bb 0711426 OTT I EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN I53000 April 1998 ICs 31.080.00 Descriptors: Quality, electronic components, discrete pressure contact power semicond
9、uctors English version Generic specification: Discrete pressure contact power semiconductor devices (Qualification approval) Fachgrundspezifikation: Druckkontakt-Einzel- Leistungshai bleiterbauelemente (Befhigungsanerkennung) This European Standard was approved by CENELEC on 1995-1 1-28. CENELEC mem
10、bers are bound to comply with the CENICENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographicat references concerning such national standards may be obtained on applicat
11、ion to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat
12、has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic, Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom
13、. CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B - 1050 Brussels _ 1998 CENELEC - All rights of exploitation in any form and by any means reser
14、ved worldwide for CENELEC members. Ref. No. EN 153000:1998 E STD=BSI BS EN 153000-ENGL L998 m 1624669 0711427 T3b Page 2 EN 153000:1998 Foreword This European Standard was prepared by CECC Working Group 7 “Rectifier diodes and thyristors“. In the absence of a current chairman or secretary of CECC Wo
15、rking Group 7, this specification was submitted to the CECC by the UK ONH under the Single Originator Procedure. It is based whenever possible on the publications of International Electrotechnical Commission (IEC) and in particular on those referred to under “Related Documents“. The text of the draf
16、t was submitted to the Unique Acceptance Procedure and was approved by CENELEC as EN 153000 on 1995-11-28. The following dates were fixed: - latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dp) 1998-1 1-01 - lates
17、t date by which the national standards conflicting with the EN have to be withdrawn (dow) 1998- 1 1-0 1 - STD-BSI BS EN 153000-ENGL L998 Lb24bb9 07LL428 972 9 Page 3 EN 153000: 1998 Con tents 1 General 2 Quality assessment procedures 3 Test and measurement procedures (general guidance) Annexes A Gen
18、eral inspection requirements for rectifier diodes and thyristors B Additional electrical test methods C Screening D Dimensions E Direction of applied forces for mechanical tests Figures 1 Test arrangement for reverse-bias test of bipolar transistor B.l Test set-up for veriing second breakdown curren
19、t rating Isa B.2 Test set-up for veriing the collector-emitter sustaining voltage VCEO sus of a transistor B.3 Current-voltage cycle for Method T-011 D. 1 Double-sided bunon device D.2 Stud mounted device E.l Axes defining the direction of applied force: button devices E.2 Axes defining the directio
20、n of applied force: cylindrical devices Page 4 8 13 24 31 37 41 42 23 31 33 35 41 41 42 42 STDmBSI BS EN L53000-ENGL Lqqd = Lb24bbq 07LL427 807 Page 4 EN 153000: 1998 1 General 1.1 Scope This document applies to discrete pressure contact power semiconductor devices namely rectifier diodes, transisto
21、rs, thyristors and their derivatives. The requirements also cover encapsulated assemblies. The document does not apply to stacks or assemblies made with these encapsulated components. 1.2 Related documents CECC O0 007 CECC O0 111 EN 100114-1 EN 100114-2 IEC 60027 IEC 60050 IEC 60068 IEC 60068-1 IEC
22、60068-2-2 IEC 60068-2-6 Basic specification: Sampling plans and procedures for inspection attributes RP 11: Specifications Rule of procedure - Quality Assessment Procedures Part 1 : CECC requirements for the approval of an organization Part 2: CECC requirements for the qualification approval, the re
23、lease for delivery and the validity of release of electronic components Letters symbols to be used in electrical technology (several parts) International Electrotechnical Vocabulary Basic environmental testing procedures, namely: Part 1: General Dry heat: Test Ba Vibration (sinusoidal): Test Fc IEC
24、60068-2-14 Change of temperature: Tests Na, Nb and Nc IEC 60068-2-17 Sealing: Tests Qc. Qk and Ql IEC 60148 IEC 60191 IEC 60410 IEC 60617 IEC 60747-2 IEC 60747-6 Letter symbols for semiconductor devices and integrated microcircuits Mechanical standardization of semiconductor devices (several parts)
25、Sampling plans and procedures for inspection of attributes (see also CECC O0 007) Graphical symbols for diagrams Semiconductor devices and integrated circuits Part 2. Rectifier diodes Semiconductor devices and integrated circuits Part 6. Thyristors _ STD-BSI BS EN 153000-ENGL 1998 3b24bb9 0711430 52
26、0 m Page 5 EN i 53000: i998 IS0 497 Guide to the choice of series of preferred numbers and of series containing more rounded values of preferred numbers IS0 1000 SI units and recommendations for the use of their multiples and of certain other units ISO/R 20 15 Numbering of weeks *superseded by IS0 8
27、601: 1988: Data elements and interchange formats - information interchange - Representation of dates and times 1.3 Units, symbols and terminology Units, graphical symbols, letter symbols and terminology shall, whenever possible, be taken from the following documents: IEC 60027 Letter symbols to be u
28、sed in electrical technology IEC 60050 In ternat ional electro technical vocabulary IEC 6061 7 Graphical symbols for diagrams IS0 1000 SI units and recommendations for the use of their multiples and of certain other units Any other units. symbols and terminology peculiar to one of the components cov
29、ered by a L ceneric specification. shall be taken from the relevant IEC or IS0 documents, listed under “Related documents“. 1.1 Standard and preferred values Ratings and characteristics shall be chosen from IEC 60747-2 and IEC 60747-6 at the time of producing the Detail Specification in conjunction
30、with the customer requirements. 1.5 Marking of component and package The following shall be marked on the device. in the following order of precedence. as space permits. All the information. except the.termina1 marking, shall appear on the primary pack used as initial protection or wrapping for deli
31、very: a) Terminal identification (i 51) b) Type designation (1 S.2) c) Date code (1 S.4) andor: (1 53) factory identification code or manufacturers name or trade-mark d) Mark of Conformity unless a Certificate of Conformity is used STD=BSI BS EN 153000-ENGL 3998 W 3624669 0711433 467 W Page 6 EN 153
32、000: 1998 In addition, the primary pack shall be marked with the detail specification reference, followed by the letter defining the level of quality assessment (annex A) and, if applicable, by the letter identiGing the screening sequence (annex C). Example: EN 153 002-000 F-C. The detail specificat
33、ion shall prescribe the information actually marked on the device. 1.5.1 Terminal identification The terminals shall be identified in at least one of the following ways: - in accordance with the specified outline or base drawing; - in accordance with one of the methods given in 2.5.1.1, 2.5.1.2 or 2
34、.5.1.3; - as specified in the detail specification. 1.5.1.1 Diodes Polarity of diodes shall be clearly indicated by one or more of the following methods: - the rectifier arrow graphical symbol pointing towards the cathode; - a colour code as follows: Red shall be used for the cathode. Black shall be
35、 used for the anode. 1 51.2 Transistors When so specified in the detail specification. transistor terminals shall be identified by the following colour code: Collector terminai Red Emitter terminal Blue Base terminal Yellow STD-BSI BS EN 153000-ENGL L99B = 1624669 0711432 3T3 Page 7 EN 153000: 1998
36、Fourth terminal if present: - if connected to collector, emitter or base: the relevant colour of this electrode; - if connected to anything else (for instance a shield): uncoded. When it is appropriate to identi only one terminal, the collector shall be marked. 1.5.1.3 Thyristors The thyristors term
37、inals shall be indicated by one of the following methods: - The thyristor graphical symbol with the mow directed towards the cathode terminai. - A colour code as follows: Cathode terminal(s) Red; andor Anode terminal(s) Blue (or black) Gate terminal(s) Yellow (or white). 1 S.2 Type designation The t
38、ype designation shall be given in letters and figures. 1 S.3 Manufacturers name or trae-name Where the certificate of conformity enables traceability to a manufacturers factory, the manufacturers name or trade-name is sufficient. In all other cases, the factory identification code shall be used. 1 S
39、.4 Date code system The date code system is as ISOR 2015 for the week, preceded by the last two digits of the year (example: 9245 - 45th week of 1992). 1.6 Subcontracting Subcontracting within the rules of EN 1001 14-2. subclause 1.2 is not permitted. 1.7 Validity of release Release is valid for a p
40、eriod of 2 years. See 2.3.5 for the requirements for subsequent de livery. STD-BSI BS EN 153000-ENGL 1998 Lb24bb9 0711433 23T Page 8 EN 153000: 1998 2 Quality assessment procedures 2.1 General The quality assessment tests are subdivided into Group A, Group B tests which are performed on each lot. Gr
41、oup C tests which are performed periodically and Group D tests which are performed for design proving only. The following CECC ongoing product assessment procedure is designed to produce consistent high reliability power semiconductor devices and enable a manufacturer once approved (see EN 1001 14-1
42、) to claim “Qualification Approval“. 2.1 . Manufacturing and system control The company shall be audited to ensure that quality and manufacturing control systems are in place. based on EN 1 O0 1 14- 1. which incorporates the requirements of EN IS0 9000. 2.1.2 Primary stage of manufacture The primary
43、 stage for bipolar semiconductor devices is the first process which changes the monocrystalline semiconductor material from being wholly P-type or wholly N-type. 2.1.3 Definition of a production lot Unless otherwise stated, a production or inspection lot (hereinafter referred to as “lot“) shall cons
44、ist of devices having structurally similar design, manufactured on the same production line. and normally assembled during a maximum of 6 weeks. (Maximum lot size 500 pieces). 2.1 .-I Smcturally similar components The crucial criterion for grouping of types of devices as structurally similar is that
45、 the differences between the various types have no influence on the results of the test for which the group has been formed. Rotation within the group shall be performed to ensure all types are tested. 2.2 Qualification approval procedures New product ranges shall be subject to groups A. B, C and D
46、testing prior to approval being given. Approval shall consist of a review of the test data by the Chief Inspector and subsequent authorisation by him of approved status for that product range. Potential customers shall have this information made available to them on request as a Test Report. The Tes
47、t Repon shall consist of a listing of tests performed, conditions of testing, sample sizes and results of individual measurements before and after each test. STDmBSI BS EN 153000-ENGL 1998 1624669 0711434 176 m Page 9 EN 153000: 1998 2.3 Quality conformance inspection requirements Quality conformanc
48、e inspection shall be based on samples taken from each lot of structurally similar product (see 2.1.4). Where no product has failed assessment, device release to the customer shall be on a continual basis. Where a failure has occurred that is attributed to faulty manufacturing, corrective action sha
49、ll be taken and a hold put on the product until that or subsequent lots have been proven to meet the full requirements of the subgroup in which the failure occurred. Lots shall continue to be held for that subgroup until 3 batches have passed without failure, when sampling and continual release shall be re-introduced. In the most serious instances of failure, product may be required to be withdrawn from stock and the customer shall be notified accordingly. 2.3.1 Division into groups and sub-groups Group A inspect
