1、BSI Standards PublicationWB11885_BSI_StandardCovs_2013_AW.indd 1 15/05/2013 15:06Mechanical standardization of semiconductor devicesPart 4: Coding system and classification into forms of package outlines for semiconductor device packagesBS EN 601914:2014+A1:2018EUROPEAN STANDARDEN 60191-4+A1:2018NOR
2、ME EUROPENNEEUROPISCHE NORMMay 2018CENELECEuropean Committee for Electrotechnical StandardizationComit Europen de Normalisation ElectrotechniqueEuropisches Komitee fr Elektrotechnische NormungCEN-CENELECManagement Centre:Avenue Marnix 17, B- 1000 Brussels 2014 CENELEC - All rights of exploitation in
3、 any form and by any means reserved worldwide for CENELEC members.Ref. No. EN 60191-4:2014 EICS 31.080English versionMechanical standardization of semiconductor devices- Part 4: Coding system and classification into forms of package outlinesforsemiconductor device packages(IEC 60191-4:2013)Normalisa
4、tion mcanique des dispositifs semiconducteurs - Partie 4: Systme de codification etclassification en formes des botiers pourdispositifs semiconducteurs(CEI 60191-4:2013)Mechanische Normung von Halbleiterbauelementen - Teil 4: Codierungssystem fr Gehuse und Eingruppierung der Gehuse nachder Gehusefor
5、m frHalbleiterbauelemente(IEC 60191-4:2013)This European Standard was approved by CENELEC on 2013-11-14. CENELEC members are bound to complywith the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alterat
6、ion.Up-to-date lists and bibliographical references concerning such national standards may be obtained onapplication to the CEN-CENELEC Management Centre or to any CENELEC member.This European Standard exists in three official versions (English, French, German). A version in any otherlanguage made b
7、y translation under the responsibility of a CENELEC member into its own language and notifiedto the CEN-CENELEC Management Centre has the same status as the official versions.CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,the Czech Republi
8、c, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany,Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland,Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom.Nation
9、al forewordThis British Standard is the UK implementation of EN 601914:2014+A1:2018. It is identical to IEC 601914:2013, incorporating amendment 1:2018. It supersedes BS EN 601914:2014, which is withdrawn.The UK participation in its preparation was entrusted to Technical Committee EPL/47, Semiconduc
10、tors.A list of organizations represented on this committee can be obtained on request to its secretary.This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. The British Standards Institution 2018 Published by BSI S
11、tandards Limited 2018ISBN 978 0 580 95747 5ICS 31.080.01Compliance with a British Standard cannot confer immunity from legal obligations.This British Standard was published under the authority of the Standards Policy and Strategy Committee on 31 March 2014.Amendments/corrigenda issued since publicat
12、ionDate Text affected31 May 2018 Implementation of IEC amendment 1:2018 with CENELEC endorsement A1:2018: Annex C addedBRITISH STANDARDBS EN 601914:2014+A1:2018EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM May 2018 CENELEC European Committee for Electrotechnical Standardization Comit Europen de
13、Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Avenue Marnix 17, B - 1000 Brussels 2014 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 60191-4:2014 E ICS 31.080 Engl
14、ish version Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:2013) Normalisation mcanique des dispositifs semiconducteurs - Partie 4: Systme de codification et classification e
15、n formes des botiers pour dispositifs semiconducteurs (CEI 60191-4:2013) Mechanische Normung von Halbleiterbauelementen - Teil 4: Codierungssystem fr Gehuse und Eingruppierung der Gehuse nach der Gehuseform fr Halbleiterbauelemente (IEC 60191-4:2013) This European Standard was approved by CENELEC on
16、 2013-11-14. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may
17、 be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and no
18、tified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany
19、 Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. BS EN 601914:2014+A1:2018EN 60191-4:2014/A1 - 2 - European foreword The text of documen
20、t 47D/837/FDIS, future edition 3 of IEC 60191-4, prepared by SC 47D, Semiconductor devices packaging, of IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60191-4:2014. The following dates were fixed: latest date by which the EN has to
21、 be implementedat national level by publication of an identicalnational standard or by endorsement(dop) 2014-09-21 latest date by which the national standards conflictingwith the EN have to be withdrawn(dow) 2016-11-14 This European Standard supersedes EN 60191-4:1999 and its Amendments A1:2002 and
22、A2:2002. EN 60191-4:2014 includes the following significant changes with respect to EN 60191-4:1999: a) Material code “S“ is added to indicate a silicon based package.b) Description of “WL“ is added to be used for general use.Attention is drawn to the possibility that some of the elements of this do
23、cument may be the subject of patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 60191-4:2013 was approved by CENELEC as a European Standard without any modification. Foreword to ame
24、ndment A1 The text of document 47D/897/CDV, future edition 3 of IEC 60191-4:2013/A1, prepared by IEC/TC 47D “Semiconductor devices packaging, of IEC technical committee 47: Semiconductor devices“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 60191-4:2014/A1:2018. The f
25、ollowing dates are fixed: latest date by which the document has to beimplemented at national level bypublication of an identical nationalstandard or by endorsement(dop) 2019-02-01 latest date by which the nationalstandards conflicting with thedocument have to be withdrawn(dow) 2021-05-01 Attention i
26、s drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 60191-4:2013/A1:2018 was approved by CENELEC a
27、s a European Standard without any modification. BS EN 601914:2014+A1:2018EN 60191-4:2014/A1:2018 (E) 2 IEC 60191-4:2013+AMD1:2018 CSV IEC 2018 CONTENTS FOREWORD . 3 1 Scope . 5 2 Coding system of package outlines for semiconductor devices 5 3 Classification into forms of package outlines for semicon
28、ductor devices 5 4 Coding system for semiconductor-device packages . 6 4.1 General . 6 4.2 New descriptive codes . 6 4.3 Descriptive designators 6 4.3.1 General remarks 6 4.3.2 Minimum descriptive designator . 6 4.3.3 Terminal-position prefix 8 4.3.4 Package-body-material prefix . 8 4.3.5 Package-sp
29、ecific feature prefix 9 4.3.6 Lead-form and terminal-count suffixes . 9 4.3.7 Detailed information field . 11 5 Coding system of package-outline styles . 12 Annex A (informative) Examples of descriptive coding system application . 15 Annex B (informative) Derivation and application of the descriptiv
30、e coding system Common package names 22 Annex C (informative) Terminology of semiconductor package outlines . 25 Figure 1 Descriptive coding for semiconductor device packages . 7 Figure 2 Relationship of codes to profile . 10 Figure A.1 Typical package styles and descriptive coding system (1 of 4) .
31、 17 Figure A.2 Examples of lead forms (or terminal shapes) . 21 Figure B.1 Descriptive coding system for common name of semiconductor-device package 22 Table 1 Package-outline-style codes. 8 Table 2 Terminal-position prefixes 9 Table 3 Prefixes for predominant package-body material 10 Table 4 Prefix
32、es for package-specific features 10 Table 5 Suffixes for lead form (or terminal shape) . 12 Table A.1 Descriptive coding system application . 16 Table B.1 Basic package code and names 23 Table B.2 Common package name and descriptive code examples . 24 Table C.1 Package name and parts name 26 BS EN 6
33、01914:2014+A1:2018IEC 60191-4:2013+AMD1:2018 CSV 3 IEC 2018 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 4: Coding system and classification into forms of package outlines for semiconductor device packages FOREWORD 1) The International Electrot
34、echnical Commission (IEC) is a worldwide organization for standardization comprisingall national electrotechnical committees (IEC National Committees). The object of IEC is to promoteinternational co-operation on all questions concerning standardization in the electrical and electronic fields. Tothi
35、s end and in addition to other activities, IEC publishes International Standards, Technical Specifications,Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IECPublication(s)”). Their preparation is entrusted to technical committees; any IEC National Co
36、mmittee interestedin the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closelywith the International Organization for Standardization (ISO) in ac
37、cordance with conditions determined byagreement between the two organizations.2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an internationalconsensus of opinion on the relevant subjects since each technical committee has representation from allinte
38、rested IEC National Committees.3) IEC Publications have the form of recommendations for international use and are accepted by IEC NationalCommittees in that sense. While all reasonable efforts are made to ensure that the technical content of IECPublications is accurate, IEC cannot be held responsibl
39、e for the way in which they are used or for anymisinterpretation by any end user.4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publicationstransparently to the maximum extent possible in their national and regional publications. Any divergencebetween
40、 any IEC Publication and the corresponding national or regional publication shall be clearly indicated inthe latter.5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformityassessment services and, in some areas, access to IEC marks of conformi
41、ty. IEC is not responsible for anyservices carried out by independent certification bodies.6) All users should ensure that they have the latest edition of this publication.7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts andmembers of i
42、ts technical committees and IEC National Committees for any personal injury, property damage orother damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) andexpenses arising out of the publication, use of, or reliance upon, this IEC Publication or any othe
43、r IECPublications.8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications isindispensable for the correct application of this publication.9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subj
44、ect ofpatent rights. IEC shall not be held responsible for identifying any or all such patent rights.DISCLAIMER This Consolidated version is not an official IEC Standard and has been prepared for user convenience. Only the current versions of the standard and its amendment(s) are to be considered th
45、e official documents. This Consolidated version of IEC 60191-4 bears the edition number 3.1. It consists of the third edition (2013-10) documents 47D/837/FDIS and 47D/848/RVD and its amendment 1 (2018-03) documents 47D/897/CDV and 47D/904/RVC. The technical content is identical to the base edition a
46、nd its amendment. This Final version does not show where the technical content is modified by amendment 1. A separate Redline version with all changes highlighted is available in this publication. BS EN 601914:2014+A1:2018 4 IEC 60191-4:2013+AMD1:2018 CSV IEC 2018 International Standard IEC 60191-4
47、has been prepared by subcommittee 47D: Semiconductor devices packaging, of IEC technical committee 47: Semiconductor devices. This third edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: a) Material code
48、S“ is added to indicate a silicon based package. b) Description of “WL“ is added to be used for general use. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all the parts in the IEC 60191 series, published under the general title Mechanical standardiza
49、tion of semiconductor devices, can be found on the IEC website. The committee has decided that the contents of the base publication and its amendment will remain unchanged until the stability date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. IMPORTANT The colour inside logo on the cover page of t
