1、BRITISH STANDARDBS EN 60191-6-16:2007Mechanical standardization of semiconductor devices Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGAThe European Standard EN 60191-6-16:2007 has the status of a British StandardICS 31.080.01g49g50g3g38g50g51g60g44g49g42g3
2、g58g44g55g43g50g56g55g3g37g54g44g3g51g40g53g48g44g54g54g44g50g49g3g40g59g38g40g51g55g3g36g54g3g51g40g53g48g44g55g55g40g39g3g37g60g3g38g50g51g60g53g44g42g43g55g3g47g36g58BS EN 60191-6-16:2007This British Standard was published under the authority of the Standards Policy and Strategy Committee on 31 J
3、uly 2007 BSI 2007ISBN 978 0 580 55248 9National forewordThis British Standard is the UK implementation of EN 60191-6-16:2007. It is identical to IEC 60191-6-16:2007.The UK participation in its preparation was entrusted to Technical Committee EPL/47, Semiconductors.A list of organizations represented
4、 on this committee can be obtained on request to its secretary.This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application.Compliance with a British Standard cannot confer immunity from legal obligations.Amendments issued
5、 since publicationAmd. No. Date CommentsEUROPEAN STANDARD EN 60191-6-16 NORME EUROPENNE EUROPISCHE NORM June 2007 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue
6、de Stassart 35, B - 1050 Brussels 2007 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 60191-6-16:2007 E ICS 31.080.01 English version Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor test
7、s and burn-in sockets for BGA, LGA, FBGA and FLGA (IEC 60191-6-16:2007) Normalisation mcanique des dispositifs semi-conducteurs - Partie 6-16: Glossaire des supports de test et de dverminage pour les BGA, LGA, FBGA et FLGA (CEI 60191-6-16:2007) Mechanische Normung von Halbleiterbauelementen - Teil 6
8、-16: Glossar fr Fassungen fr die Prfung und Voralterung von BGA, LGA, FBGA und FLGA (IEC 60191-6-16:2007) This European Standard was approved by CENELEC on 2007-05-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this Europea
9、n Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (Englis
10、h, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Be
11、lgium, Bulgaria, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom. Foreword
12、 The text of document 47D/679/FDIS, future edition 1 of IEC 60191-6-16, prepared by SC 47D, Mechanical standardization for semiconductor devices, of IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60191-6-16 on 2007-05-01. The follow
13、ing dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2008-02-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2010-05-01 Annex ZA has been ad
14、ded by CENELEC. _ Endorsement notice The text of the International Standard IEC 60191-6-16:2007 was approved by CENELEC as a European Standard without any modification. _ EN 60191-6-16:2007 2 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 6-16: Glossary of semiconductor tests and burn-in s
15、ockets for BGA, LGA, FBGA and FLGA 1 Scope This part of IEC 60191 gives a glossary of semiconductor sockets for BGA, LGA, FBGA and FLGA. This standard intends to establish definitions and unification of terminology relating to tests and burn-in sockets for BGA, LGA, FBGA and FLGA. 2 Normative refere
16、nces The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60191-1:1966, Mechanical standardization
17、 of semiconductor devices Part 1: Preparation of outline drawings of semiconductor devices IEC 60191-2:1966, Mechanical standardization of semiconductor devices Part 2: Dimensions IEC 60191-3:1999, Mechanical standardization of semiconductor devices Part 3: General rules for the preparation of outli
18、ne drawings of integrated circuits IEC 60191-4:1999, Mechanical standardization of semiconductor devices Part 4: Coding system and classification into forms of package outlines for semiconductor devices 3 Terms and definitions For the purposes of this document, the following terms and definitions ap
19、ply. NOTE 1 Long terms are indicated in two lines. NOTE 2 A symbol indicates the dimensional symbol in drawing. NOTE 3 A dash (-) in the columns of “Drawing part” and “Symbol” indicates no correspondence to symbols or drawing parts. EN 60191-6-16:2007 3 3.1 General Table 1 General No. Term Definitio
20、n Symbol Drawing part 101 IC socket connector to electrically connect and mechanically hold IC package - - 102 production socket socket used in the production of PCB assemblies for electrical equipment to facilitate package replacement - - 103 test and burn-in socket socket mainly used for electrica
21、l characteristics test, burn-in and reliability test of package with its production process. Designed for reliable contact, durable actuation and high environmental operating temperature - - 104 clamshell type socket socket having a style that surrounds the package with hinged base and lid - Figure
22、1 105 open-top type socket socket having a style to load/unload package from the top opening of socket by pressing down the cover mechanism - Figure 2 3.2 Clamshell type Table 2 Clamshell type No. Term Definition Symbol Drawing part 201 base base part to hold contacts and other socket parts and to b
23、e assembled on PCB - Figure 1(1) 202 lid part making a pair with base whose function is to hold the package - Figure 1(2) 203 latch latch to fix the cover with base at closed position - Figure 1(3) 204 hinge hinge to join base and lid - Figure 1(4) 205 alignment plate supporting part to align termin
24、als with through holes on PCB for ease of socket terminal insertion - Figure 1(5) 206 alignment pin pin mounted on socket to define relative position of socket with PCB - Figure 1(6) 207 contact electrically connecting part of socket consisting of contact point with package lead and terminal portion
25、 to be soldered on PCB - Figure 1(7) 208 contact point section of the contact making connection with package - Figure 1,(8) 209 terminal electrical connector protruding from socket base in order to solder on PCB. Part of the contact - Figure 1(9) 210 platform part to hold package - Figure 1(10) 211
26、pusher part to hold package and to maintain stable contact of package leads with socket contacts - Figure 1(11) 212 package guide guide for package established in socket to align package leads with socket contact - Figure 1(12) 213 mounting flange flange to mount socket on PCB - Figure 1(13) 214 soc
27、ket width socket width excluding mounting flange W Figure 1 215 maximum socket width maximum socket width including mounting flange W1Figure 1 216 socket length socket length excluding protrusion of the latch at its closed position L Figure 1 217 maximum socket length maximum socket length including
28、 protrusion of the latch at its closed position L1Figure 1 218 latch moving distance distance of the latch movement beyond socket length L3Figure 1 EN 60191-6-16:2007 4 Table 2 Clamshell type (continued) No. Term Definition Symbol Drawing part 219 socket height distance from socket mounting plane to
29、 the lid top surface at its closed position A Figure 1 220 maximum socket height distance from socket mounting plane to the lid top surface including protruded section with its closed position A4Figure 1 221 maximum height with opened lid maximum socket height from its mounting plane with the lid at
30、 fully open position including protrusions A5Figure 1 222 lid open angle angle of the lid at fully open position Figure 1 223 base width width of socket base W2Figure 1 224 base length length of socket base L2Figure 1 225 seating plane height height from socket mounting surface to the platform top s
31、urface A2Figure 1 226 terminal length length from socket mounting plane to terminal tip A3Figure 1 EN 60191-6-16:2007 5 3.3 Open-top type Table 3 Open-top type No. Term Definition Symbol Drawing part 301 base base part to hold contacts and other socket parts and to be assembled on PCB - Figure 2(1)
32、302 cover part to actuate the pusher and contact point of the contact - Figure 2(2) 303 bumper protective part surrounding the base - Figure 2,(3) 304 alignment plate supporting part to align terminals with through holes on PCB for ease of socket terminal insertion - Figure 2(4) 305 alignment pin pi
33、n mounted on socket to define relative position of socket with PCB - Figure 2(5) 306 contact electrically connecting part of socket consisting of contact point with package lead and terminal portion to be soldered on PCB - Figure 2 (6) 307 contact point section of the contact making a connection wit
34、h package - Figure 2(7) 308 terminal electrical connector protruding from socket base in order to solder on PCB, a part of contact - Figure 2(8) 309 platform part to hold package. In case of the open top type socket, this functionality is likely built in main body of socket - Figure 2(9) 310 pusher
35、part to hold package and to maintain stable contact of package leads with socket contacts - Figure 2(10) 311 package guide guide for package established in socket to align package leads with socket contact - Figure 2(11) 312 retainer part to retain package - Figure 2(12) 313 socket width socket widt
36、h excluding bumper and others W Figure 2 314 maximum socket width maximum socket width including bumper and others W1Figure 2 315 socket length socket length excluding bumper and others L Figure 2 316 maximum socket length maximum socket length including bumper and others L1Figure 2 317 socket heigh
37、t height of socket from its mounting plane A Figure 2 318 end stroke height distance from socket mounting plane to top surface of the cover in its fully depressed position A1Figure 2 319 seating plane height distance from socket mounting plane to top surface of the platform without package A2Figure
38、2 320 terminal length length from socket mounting plane to terminal tip A3Figure 2 EN 60191-6-16:2007 6 3.4 Printed circuit board Table 4 Printed circuit board No. Term Definition Symbol Drawing part 401 mounting hole hole drilled on PCB to mount socket mechanically - Figure 3(1) 402 alignment hole
39、hole drilled on PCB to align relative position of socket and PCB - Figure 3(2) 403 socket mounting pattern description including dimension of mounting hole, alignment hole and plated-through hole with their relative positional dimension - Figure 3 404 socket mounting area area on PCB where is requir
40、ed for socket mounting and operation - Figure 3(3) 405 socket mounting width width of socket mounting area WpFigure 3 406 socket mounting length length of socket mounting area LpFigure 3 407 maximum socket mounting width width of socket mounting area including mounting flange or bumper Wp1Figure 3 E
41、N 60191-6-16:2007 7 W2W W1L3L2L L11312IC package 12 2 4 10 1 6 5 9 A4AA2A5A33 IEC 598/07 Figure 1 Clamshell type socket EN 60191-6-16:2007 8 W11311 IC package 102 3 1 5 4 8 6 7 W L1LAA1A2A312IEC 599/07 Figure 2 Open-top type socket EN 60191-6-16:2007 9 Lp3 2 2 1 WpWp1e IEC 600/07 Figure 3 Socket mou
42、nting pattern _ EN 60191-6-16:2007 10 Annex ZA (normative) Normative references to international publications with their corresponding European publications The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies
43、. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. Publication Year Title EN/HD Year IEC 60191-1 1966 Mechanical
44、standardization of semiconductor devices - Part 1: Preparation of drawings of semiconductor devices - - IEC 60191-2 1966 Mechanical standardization of semiconductor devices - Part 2: Dimensions - - IEC 60191-3 1999 Mechanical standardization of semiconductor devices - Part 3: General rules for the p
45、reparation of outline drawings of integrated circuits EN 60191-3 1999 IEC 60191-4 1999 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages EN 60191-4 1999 EN 60191-6-16:2007 11 BS EN 60191-6-1
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