1、BSI Standards PublicationPackaging of components for automatic handlingPart 3: Packaging of surface mount components on continuous tapesBS EN 60286-3:2013BS EN 60286-3:2013Incorporating corrigendum October 2013BS EN 60286-3:2013 BRITISH STANDARDNational forewordThis British Standard is the UK implem
2、entation of EN 60286-3:2013, incorporating corrigendum October 2013. It is identical to IEC 60286-3:2013. It supersedes BS EN 60286-3:2007, BS EN 60286-3-1:2009 and BS EN 60286-3-2:2009, which are withdrawn.The UK participation in its preparation was entrusted to Technical Committee EPL/40X, Capacit
3、ors and resistors for electronic equipment.A list of organizations represented on this committee can be obtained on request to its secretary.This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. The British Standar
4、ds Institution 2013. Published by BSI Standards Limited 2013ISBN 978 0 580 85022 6ICS 31.020; 31.240Compliance with a British Standard cannot confer immunity from legal obligations.This British Standard was published under the authority of the Standards Policy and Strategy Committee on 31 August 201
5、3.Amendments/corrigenda issued since publicationDate Text affected30 November 2013 Implementation of CENELEC corrigendum October 2013: CENELEC foreword supersession information correctedEUROPEAN STANDARDEN 60286-3NORME EUROPENNEEUROPISCHE NORMAugust 2013CENELECEuropean Committee for Electrotechnical
6、 StandardizationComit Europen de Normalisation ElectrotechniqueEuropisches Komitee fr Elektrotechnische NormungManagement Centre: Avenue Marnix 17, B - 1000 Brussels 2013 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.Ref. No. EN 60286-3:2013
7、 EICS 31.020; 31.240 Supersedes EN 60286-3:2007English versionPackaging of components for automatic handling -Part 3: Packaging of surface mount components on continuous tapes(IEC 60286-3:2013)Emballage de composants pour oprations automatises -Partie 3: Emballage des composants pour montage en surf
8、ace en bandes continues(CEI 60286-3:2013)Gurtung und Magazinierung von Bauelementen fr die automatische Verarbeitung -Teil 3: Gurtung von oberflchenmontierbaren Bauelementen auf Endlosgurten(IEC 60286-3:2013)This European Standard was approved by CENELEC on 2013-06-21. CENELEC members are bound to c
9、omply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENEL
10、EC Management Centre or to any CENELEC member.This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre h
11、as the same status as the official versions.CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, La
12、tvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom.BS EN 60286-3:2013Incorporating corrigendum October 2013EN 60286-3:2013 - 2 -ForewordThe text of document 40/2200/FDIS, future edition
13、 5 of IEC 60286-3, prepared by IEC/TC 40“Capacitors and resistors for electronic equipment“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 60286-3:2013.The following dates are fixed: latest date by which the document has to beimplemented at national level bypublication
14、of an identical nationalstandard or by endorsement(dop) 2014-03-21 latest date by which the nationalstandards conflicting with thedocument have to be withdrawn(dow) 2016-06-21This document supersedes EN 60286-3:2007.EN 60286-3:2013 includes the following significant technical changes with respect to
15、 EN 60286-3:2007:a) integration of EN 60286-3-1:2009 as type 1b (Packaging of surface mount components on continuous pressed carrier tapes);b) integration of EN 60286-3-2:2009 as type 2b (Packaging of surface mount components on blister carrier tapes 4 mm in width).Attention is drawn to the possibil
16、ity that some of the elements of this document may be the subject of patent rights. CENELEC and/or CEN shall not be held responsible for identifying any or all such patent rights.Endorsement noticeThe text of the International Standard IEC 60286-3:2013 was approved by CENELEC as a European Standard
17、without any modification.In the official version, for Bibliography, the following notes have to be added for the standards indicated:IEC 60286-3-1:2009 NOTE Harmonised as EN 60286-3-1:2009 (not modified).IEC 60286-3-2:2009 NOTE Harmonised as EN 60286-3-2:2009 (not modified).IEC/TR 62258-3 NOTE Harmo
18、nised as CLC/TR 62258-3.ISO 11469 NOTE Harmonised as EN ISO 11469.BS EN 60286-3:2013This document supersedes EN 60286-3:2007, EN 60286-3-1:2009 and EN 60286-3-2:2009.EN 60286-3:2013 - 2 -ForewordThe text of document 40/2200/FDIS, future edition 5 of IEC 60286-3, prepared by IEC/TC 40“Capacitors and
19、resistors for electronic equipment“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 60286-3:2013.The following dates are fixed: latest date by which the document has to beimplemented at national level bypublication of an identical nationalstandard or by endorsement(dop)
20、2014-03-21 latest date by which the nationalstandards conflicting with thedocument have to be withdrawn(dow) 2016-06-21This document supersedes EN 60286-3:2007.EN 60286-3:2013 includes the following significant technical changes with respect to EN 60286-3:2007:a) integration of EN 60286-3-1:2009 as
21、type 1b (Packaging of surface mount components on continuous pressed carrier tapes);b) integration of EN 60286-3-2:2009 as type 2b (Packaging of surface mount components on blister carrier tapes 4 mm in width).Attention is drawn to the possibility that some of the elements of this document may be th
22、e subject of patent rights. CENELEC and/or CEN shall not be held responsible for identifying any or all such patent rights.Endorsement noticeThe text of the International Standard IEC 60286-3:2013 was approved by CENELEC as a European Standard without any modification.In the official version, for Bi
23、bliography, the following notes have to be added for the standards indicated:IEC 60286-3-1:2009 NOTE Harmonised as EN 60286-3-1:2009 (not modified).IEC 60286-3-2:2009 NOTE Harmonised as EN 60286-3-2:2009 (not modified).IEC/TR 62258-3 NOTE Harmonised as CLC/TR 62258-3.ISO 11469 NOTE Harmonised as EN
24、ISO 11469.BS EN 60286-3:2013- 3 - EN 60286-3:2013Annex ZA (normative)Normative references to international publicationswith their corresponding European publicationsThe following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. Fo
25、r dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. Publication
26、Year Title EN/HD YearIEC 60191-2 - Mechanical standardization of semiconductor devices -Part 2: Dimensions- -IEC 61340-5-1 - Electrostatics -Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirementsEN 61340-5-1 -IEC/TR 61340-5-2 - Electrostatics -Part 5-2: Protec
27、tion of electronic devices from electrostatic phenomena - User guideCLC/TR 61340-5-2 -BS EN 60286-3:2013 2 60286-3 IEC:2013 CONTENTS INTRODUCTION . 7 1 General 8 1.1 Scope 8 1.2 Normative references 8 2 Terms and definitions . 8 3 Structure of the specification 10 4 Dimensional requirements for tapi
28、ng. 10 4.1 Component cavity positioning requirements . 10 4.1.1 Requirements for types 1a, 1b, 2a, 2b and 3 10 4.1.2 Requirements for types 4 . 10 4.2 Component cavity dimension requirements (tape types 1a, 1b, 2a, 2b and 3) 11 4.3 Type 1a Punched carrier tape, with top and bottom cover tape (tape w
29、idths: 8 mm and 12 mm) . 12 4.4 Type 1b Pressed carrier tape, with top cover tape (tape width: 8 mm) 14 4.5 Type2a Blister carrier tape, with single round sprocket holes and tape pitches down to 2 mm (tape widths: 8 mm, 12 mm, 16 mm and 24 mm) . 16 4.6 Type 2b Blister carrier tape, with single round
30、 sprocket holes and with 1mm tape pitch (tape widths: 4 mm) 18 4.7 Type 3 Blister carrier tape, with double sprocket holes (32 mm to 200 mm) 20 4.8 Type 4 Adhesive-backed punched plastic carrier tape for singulated bare die and other surface mount components (8 mm, 12 mm, 16 mm and 24 mm) . 22 5 Pol
31、arity and orientation requirements of components in the tape 25 5.1 Requirements for all tape types . 25 5.2 Specific requirements for type 1a 25 5.3 Specific requirements for type 4 25 6 Carrier tape requirements . 25 6.1 Taping materials 25 6.2 Minimum bending radius (for all types) 26 6.3 Camber
32、. 26 7 Cover tape requirements (for type 1a, 1b, 2a, 2b and 3) . 27 8 Component taping and additional tape requirements 28 8.1 All types 28 8.2 Specific requirements for type 1b 28 8.3 Specific tape requirements for type 2b. 28 8.4 Specific requirement for type 4 28 8.4.1 General . 28 8.4.2 Coordina
33、te system . 29 8.4.3 Component positioning and lateral displacement (see Figures 19 and 23) . 30 8.5 Specific requirements for tapes containing die products 31 8.5.1 General . 31 8.5.2 Tape design for tapes containing die products . 31 8.5.3 Cleanliness 31 8.5.4 Die lateral movement (Types 1a, 2a an
34、d 2b) 32 9 Reel requirements 32 9.1.1 General . 32 BS EN 60286-3:2013 2 60286-3 IEC:2013 CONTENTS INTRODUCTION . 7 1 General 8 1.1 Scope 8 1.2 Normative references 8 2 Terms and definitions . 8 3 Structure of the specification 10 4 Dimensional requirements for taping. 10 4.1 Component cavity positio
35、ning requirements . 10 4.1.1 Requirements for types 1a, 1b, 2a, 2b and 3 10 4.1.2 Requirements for types 4 . 10 4.2 Component cavity dimension requirements (tape types 1a, 1b, 2a, 2b and 3) 11 4.3 Type 1a Punched carrier tape, with top and bottom cover tape (tape widths: 8 mm and 12 mm) . 12 4.4 Typ
36、e 1b Pressed carrier tape, with top cover tape (tape width: 8 mm) 14 4.5 Type2a Blister carrier tape, with single round sprocket holes and tape pitches down to 2 mm (tape widths: 8 mm, 12 mm, 16 mm and 24 mm) . 16 4.6 Type 2b Blister carrier tape, with single round sprocket holes and with 1mm tape p
37、itch (tape widths: 4 mm) 18 4.7 Type 3 Blister carrier tape, with double sprocket holes (32 mm to 200 mm) 20 4.8 Type 4 Adhesive-backed punched plastic carrier tape for singulated bare die and other surface mount components (8 mm, 12 mm, 16 mm and 24 mm) . 22 5 Polarity and orientation requirements
38、of components in the tape 25 5.1 Requirements for all tape types . 25 5.2 Specific requirements for type 1a 25 5.3 Specific requirements for type 4 25 6 Carrier tape requirements . 25 6.1 Taping materials 25 6.2 Minimum bending radius (for all types) 26 6.3 Camber . 26 7 Cover tape requirements (for
39、 type 1a, 1b, 2a, 2b and 3) . 27 8 Component taping and additional tape requirements 28 8.1 All types 28 8.2 Specific requirements for type 1b 28 8.3 Specific tape requirements for type 2b. 28 8.4 Specific requirement for type 4 28 8.4.1 General . 28 8.4.2 Coordinate system . 29 8.4.3 Component posi
40、tioning and lateral displacement (see Figures 19 and 23) . 30 8.5 Specific requirements for tapes containing die products 31 8.5.1 General . 31 8.5.2 Tape design for tapes containing die products . 31 8.5.3 Cleanliness 31 8.5.4 Die lateral movement (Types 1a, 2a and 2b) 32 9 Reel requirements 32 9.1
41、.1 General . 32 BS EN 60286-3:201360286-3 IEC:2013 3 9.1.2 Reel dimensions related to tape (see Figure 24 and Table 23) . 32 9.1.3 Reel hole dimensions (see Figure 25 and Table 24) 34 9.2 Marking . 34 10 Tape reeling requirements 35 10.1 All types 35 10.2 Specific requirements for type 1a 35 10.3 Sp
42、ecific requirements for type 4 35 10.4 Leader and trailer tape (see Figure 27) . 36 10.4.1 Leader . 36 10.4.2 Trailer 36 10.5 Recycling 36 10.6 Missing components 36 Annex A (normative) Recommended measuring methods for type 1b . 37 Bibliography 39 Figure 1 Sectional view of component cavity (type 1
43、b) . 9 Figure 2 8 mm and 12 mm punched carrier-tape dimensions (4 mm cavity pitch) . 12 Figure 3 Illustration of 2 mm and 1 mm cavity pitch and maximum pocket offset 12 Figure 4 Maximum component tilt, rotation and lateral movement 12 Figure 5 Dimensions (P0 = 4 mm/P1 = 2 mm) and (P0 = 4 mm/P1 = 1 m
44、m) 14 Figure 6 Illustration of 2 mm and 1 mm cavity pitch and maximum pocket offset 14 Figure 7 Maximum component tilt, rotation and lateral movement 14 Figure 8 Blister carrier tape dimensions (8 mm, 12 mm, 16 mm and 24 mm) 16 Figure 9 Illustration of 2 mm cavity pitch and pocket offset 16 Figure 1
45、0 Maximum component tilt, rotation and lateral movement 16 Figure 11 Type 2b carrier tape . 18 Figure 12 Maximum pocket offset . 18 Figure 13 Maximum component tilt, rotation and lateral movement 18 Figure 14 Blister carrier tape 20 Figure 15 Elongated sprocket hole skew 20 Figure 16 Maximum compone
46、nt tilt, rotation and lateral movement 20 Figure 17 Adhesive-backed punched carrier-tape dimensions (4 mm compartment pitch) 23 Figure 18 Illustration of 2 mm compartment pitch . 23 Figure 19 Maximum component planar rotation and lateral displacement . 23 Figure 20 Bending radius . 26 Figure 21 Camb
47、er (top view) 27 Figure 22 Type 4 coordinate system 30 Figure 23 Component clearance and positioning method . 31 Figure 24 Reel . 32 Figure 25 Reel hole presentation . 34 Figure 26 Tape reeling and label area on the reel 35 Figure 27 Leader and trailer . 36 Figure A.1 Carrier tape thickness measurem
48、ent points 37 BS EN 60286-3:2013 4 60286-3 IEC:2013 Figure A.2 Cavity cross-section 37 Figure A.3 Cavity depth dimension . 38 Table 1 component size codes . 9 Table 2 Constant dimensions of 8 mm and 12 mm punched carrier tape 13 Table 3 Variable dimensions of 8 mm and 12 mm punched carrier tape . 13
49、 Table 4 Component tilt, planar rotation and lateral movement 13 Table 5 Constant dimensions of 8 mm pressed carrier tape . 15 Table 6 Variable dimensions of 8 mm pressed carrier tape 15 Table 7 Component tilt, planar rotation and lateral movement 15 Table 8 Constant dimensions of 8 mm to 24 mm blister carrier tape . 17 Table 9 Variable dimensions of 8 mm to 24 mm blister carrier tape 17 Table 10 Component tilt, rotation and lateral movement . 17 Tab
