1、raising standards worldwideNO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBSI Standards PublicationMechanical structures for electronic equipment Dimensions of mechanical structures of the 482,6 mm (19 in) seriesPart 3-107: Dimensions of subracks and plug-in units, small form
2、factorBS EN 60297-3-107:2012National forewordThis British Standard is the UK implementation of EN 60297-3-107:2012. It isidentical to IEC 60297-3-107:2012.The UK participation in its preparation was entrusted to Technical CommitteeEPL/48, Electromechanical components and mechanical structures for el
3、ec-tronic equipment.A list of organizations represented on this committee can be obtained onrequest to its secretary.This publication does not purport to include all the necessary provisions of acontract. Users are responsible for its correct application. The British Standards Institution 2012Publis
4、hed by BSI Standards Limited 2012ISBN 978 0 580 68232 2ICS 31.240Compliance with a British Standard cannot confer immunity fromlegal obligations.This British Standard was published under the authority of the StandardsPolicy and Strategy Committee on 30 April 2012.Amendments issued since publicationA
5、md. No. Date Text affectedBRITISH STANDARDBS EN 60297-3-107:2012EUROPEAN STANDARD EN 60297-3-107 NORME EUROPENNE EUROPISCHE NORM March 2012 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung
6、 Management Centre: Avenue Marnix 17, B - 1000 Brussels 2012 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 60297-3-107:2012 E ICS 31.240 English version Mechanical structures for electronic equipment - Dimensions of mechanical s
7、tructures of the 482,6 mm (19 in) series - Part 3-107: Dimensions of subracks and plug-in units, small form factor (IEC 60297-3-107:2012) Structures mcaniques pour quipements lectroniques - Dimensions des structures mcaniques de la srie 482,6 mm (19 pouces) - Partie 3-107: Dimensions des bacs et blo
8、cs enfichables de petit facteur de forme(CEI 60297-3-107:2012) Bauweisen fr elektronische Einrichtungen - Mae der 482,6 mm-(19-Zoll-)Bauweise - Teil 3-107: Mae von Baugruppentrgern und Baugruppen, kleiner Formfaktor (IEC 60297-3-107:2012) This European Standard was approved by CENELEC on 2012-02-14.
9、 CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained
10、 on application to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to th
11、e CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
12、 Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. BS EN 60297-3-107:2012EN 60297-3-107:2012 - 2 - Foreword The text of document 48D/492/FDIS, future edition 1 of IEC 60297-3-107, prepared
13、by SC 48D, “Mechanical structures for electronic equipment“, of IEC TC 48, “Electromechanical components and mechanical structures for electronic equipment“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 60297-3-107:2012. The following dates are fixed: latest date by wh
14、ich the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2012-11-14 latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2015-02-14 Attention is drawn to the possibility that some
15、 of the elements of this document may be the subject of patent rights. CENELEC and/or CEN shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 60297-3-107:2012 was approved by CENELEC as a European Standard without
16、 any modification. BS EN 60297-3-107:2012- 3 - EN 60297-3-107:2012 Annex ZA (normative) Normative references to international publications with their corresponding European publications The following documents, in whole or in part, are normatively referenced in this document and are indispensable fo
17、r its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
18、applies. Publication Year Title EN/HD Year IEC 60297-3-100 - Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-100: Basic dimensions of front panels, subracks, chassis, racks and cabinets EN 60297-3-100 - IEC 61076-4-116 - Co
19、nnectors for electronic equipment - Product requirements - Part 4-116: Printed board connectors - Detail specification for a high-speed two-part connector with integrated shielding function EN 61076-4-116 - PICMG AMC.0 - Advanced Mezzanine Card Specification - - PICMG MicroTCA.0 - Micro Telecommunic
20、ations Computing Architecture - - PICMG MicroTCA.1 - Air Cooled Rugged MicroTCA Specification - - BS EN 60297-3-107:2012 2 60297-3-107 IEC:2012 CONTENTS INTRODUCTION . 6 1 Scope and object 7 2 Normative references . 7 3 Arrangement overview (4U shown) . 8 4 Subrack dimensions . 9 4.1 Subrack dimensi
21、ons front mounting area . 9 4.2 Subrack dimensions, rear view, backplane mounting area . 12 5 Plug-in unit dimensions 13 6 Connector and related printed board dimensions 14 6.1 Connector according to PICMG-MicroTCA.0/ IEC 61076-4-116, fixed board connector and related printed board dimensions 14 6.1
22、.1 PICMG- MicroTCA.0/ IEC 61076-4-116 connector, isometric view . 14 6.1.2 Connector according to PICMG- MicroTCA.0/ IEC 61076-4-116, fixed board connector and related printed board arrangement overview 14 6.1.3 Printed board dimensions 15 6.1.4 Printed board dimensions, 4U example 16 6.1.5 Connecto
23、r according to PICMG-MTCA.0, fixed board connector dimensions 17 6.2 Two part connector according to IEC 61076-4-116 and related printed board dimensions 17 6.2.1 Two part connector, isometric view 17 6.2.2 Two part connector, arrangement overview . 18 6.2.3 Two part connector, printed board dimensi
24、ons . 18 6.2.4 Two part connector, fixed board connector dimensions 19 6.3 Two part connector with PIU PB component side attachment features . 19 6.3.1 Two part connector, arrangement overview . 19 6.3.2 Two part connector, printed circuit board dimensions, 2 U . 19 6.3.3 Two part connector, connect
25、or mounted on backplane, 2 U . 20 7 Backplane dimensions 21 7.1 Backplane dimensions using two part connector according to IEC 61076-4-116 21 8 Subrack and plug-in units with electromagnetic shielding (EMC) provisions 23 8.1 General . 23 8.2 Subrack EMC provisions . 23 8.3 Plug-in unit and filler pa
26、nels EMC provisions . 24 9 Subrack and plug in units electrostatic discharge provisions (ESD) 24 9.1 General . 24 9.2 Subrack ESD provisions 25 9.3 Plugin unit ESD provisions, front mounted . 26 10 Nomenclature . 27 Annex A (informative) Connector hole pattern at the backplane . 29 Annex B (informat
27、ive) Rear mounted plug-in unit implementation . 30 Annex C (informative) Hot swap latch function . 32 Annex D (informative) Subrack latch mechanism interface dimensions for ruggedized applications 33 Annex E (informative) Subrack ESD contact interface dimensions . 34 BS EN 60297-3-107:201260297-3-10
28、7 IEC:2012 3 Figure 1 Arrangement overview . 8 Figure 2 Subrack dimensions, front view 10 Figure 3 Subrack dimensions, side view 11 Figure 4 Subrack dimensions, top view 12 Figure 5 Subrack dimensions, rear view . 12 Figure 6 Plug-in unit dimensions 13 Figure 7 PICMG- MicroTCA.0/ IEC 61076-4-116 con
29、nector, isometric view 14 Figure 8 PICMG- MicroTCA.0/ IEC 61076-4-116 fixed board connector, arrangement overview Top view . 14 Figure 9 Printed board dimensions . 15 Figure 10 Printed board dimensions, 4U example 16 Figure 11 Connector according to PICMG- MTCA.0, fixed board connector dimensions .
30、17 Figure 12 Fixed board and free board connector Isometric view 17 Figure 13 Two part connector, arrangement overview Top view 18 Figure 14 Two part connector, printed board dimensions . 18 Figure 15 Two part connector, arrangement overview Top view 19 Figure 16 Two part connector, dimensions, 2 U
31、. 19 Figure 17 Two part connector, connector mounted on backplane dimensions, 2 U . 20 Figure 18 Backplane dimensions 22 Figure 19 Subrack EMC dimensions 23 Figure 20 Plug-in unit EMC dimensions 24 Figure 21 Subrack ESD provision 25 Figure 22 Plug-in unit ESD provision 26 Figure A.1 Connector pin lo
32、cation according to IEC 61076-4-116, front view 29 Figure B.1 Depth dimension subrack type 1, side view . 30 Figure B.2 Depth dimension subrack type 2, side view . 30 Figure B.3 Depth dimension subrack type 3, side view . 31 Table 1 Height dimensions . 26 Table 2 Depth dimensions 27 BS EN 60297-3-10
33、7:2012 6 60297-3-107 IEC:2012 INTRODUCTION This standard provides for an alternative/smaller form factor of plug-in units as defined in IEC 60297-3-101. New technologies requiring smaller plug-in unit form factors used in 19 in equipment practice are rapidly gaining acceptance. Recognizing this deve
34、lopment it became obvious that a generic interface standard would be an advantage to the industry. This standard is based upon and coordinated with the plug-in unit form factor as defined in AMC.0 and MicroTCA developed by PICMG (PCI Industrial Computers Manufacturer Group). By making critical inter
35、face dimensions available and permitting the use of alternative connectors to the industry (beyond AMC.0 and MicroTCA) multiple product solutions may make use of this technology and will increase the overall market acceptance, increase availability, and reduce cost. In order to meet the requirements
36、 of small form factor plug-in units within the subrack the interface dimensions required differ from IEC 60297-3-101. This standard defines these small form factor interface dimensions. The small form factor generic dimensions are based on and coordinated with AMC.0 and MicroTCA. Since the AMC.0 and
37、 MicroTCA Specification defines only a limited range of connectors this standard opens the possible use of other suitable connectors. BS EN 60297-3-107:201260297-3-107 IEC:2012 7 MECHANICAL STRUCTURES FOR ELECTRONIC EQUIPMENT DIMENSIONS OF MECHANICAL STRUCTURES OF THE 482,6 mm (19 in) SERIES Part 3-
38、107: Dimensions of subracks and plug-in units, small form factor 1 Scope and object This part of IEC 60297 defines the interface dimensions between subracks and associated plug-in units using connectors as defined in PICMG-MTCA.0 (Fixed board, see Figure 7) and IEC 61076-4-116 (Two part, see Figure
39、12) and other two part connectors, (see Figure 15). For mechanical and climatic tests refer to IEC 61587-1. For electromagnetic shielding performance tests refer to IEC 61587-3. 2 Normative references The following referenced documents are indispensable for the application of this document. For date
40、d references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60297-3-100: Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series Part 3-100: Bas
41、ic dimensions of front panels, subracks, chassis, racks and cabinets IEC 61076-4-116: Connectors for electronic equipment Product requirements Printed board connectors: Detail specification for a high-speed two-part connector with integrated shielding function (to be published) PICMG AMC.0: Advanced
42、 Mezzanine Card Specification PICMG MicroTCA.0: Micro Telecommunications Computing Architecture PICMG MicroTCA.1: Air Cooled Rugged MicroTCA Specification BS EN 60297-3-107:2012 8 60297-3-107 IEC:2012 3 Arrangement overview (4U shown) Left side of plug-in unit = component side Typical subrack 4U plu
43、g-in unit with PICMG-AMC.0 connector 4U plug-in unit with two part connector according to IEC 61076-4-116 4U power unit (connector not shown) IEC 2770/11 Figure 1 Arrangement overview BS EN 60297-3-107:201260297-3-107 IEC:2012 9 4 Subrack dimensions 4.1 Subrack dimensions front mounting area Figure
44、2a Front area dimensions U482,6 0,4 B B See Figure 3 A 428,08 Mounting positions M3; front and rear 1,35 Z H5H6H14,26 First M3 mounting position and first possible centreline of guide rail / printed circuit board of plug-in unit 426,72 H 782 = 416,56 mounting positions M3 and possible guide rail mou
45、nting positions 5,08 Y First possible guide rail position (connector dependent) 5,90 C B D A G 0,2 G M2 See Figure 4 0,2 D L A IEC 2771/11 BS EN 60297-3-107:2012 10 60297-3-107 IEC:2012 Figure 2b Mounting holes and guide rail dimensions Figure 2 Subrack dimensions, front view Figure 3a Guide rail di
46、mensions Back-plane Fixed board Connector X 16,8 UHeight separation plane D2 D3 Guide rail H6D1 E F R See Figure 18 L Cross Section B - B 6,8 +0,56,8 +0,5Detail “Z“ Both hole types are permitted 13,5 0,4 14,7 1,2 10,3 0,4 H1H2H3H4L 1,65 2,1 0,1 5,08 Detail “Y“ The guide rail shall be made of electri
47、cally insulated material G M2 4,26 A IEC 2772/11 IEC 2773/11 BS EN 60297-3-107:201260297-3-107 IEC:2012 11 Figure 3b Mounting hole dimensions Figure 3 Subrack dimensions, side view 3,13,2 D2 H 6to first thread H5Areas provided for plug-in unit features D3 Guide rail M3 2,0 Threads D1 6,1 clearance E
48、 Detail “X“ E Dimensions for ESD provisions see Fig. 21 Other application specific detail may apply. Examples: PICMG-AMC.0; PICMG-MTCA.0 and PICMG-MTCA.1 Application specific detail may apply. Examples: PICMG-AMC.0 and PICMG-MTCA.0 and PICMG-MTCA.1 L 10 +10 0 +0,30,0IEC 2774/11 BS EN 60297-3-107:201
49、2 12 60297-3-107 IEC:2012 Figure 4 Subrack dimensions, top view 4.2 Subrack dimensions, rear view, backplane mounting area Figure 5 Subrack dimensions, rear view 449 (incl.fixing hardware) Sidepanel may exceed D1 (e.g. for EMC shielding ) Backplane attachment plane Typical guide rail 0,6 E Front attachment plane Cross Section A A (see Figure 2) W Detail W“
