1、raising standards worldwideNO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBSI Standards PublicationFixed capacitors for use in electronic equipmentPart 21: Sectional specification Fixed surface mount multilayer capacitors of ceramic dielectric, Class 1BS EN 60384-21:2012Nation
2、al forewordThis British Standard is the UK implementation of EN 60384-21:2012. It isidentical to IEC 60384-21:2011. It supersedes BS EN 60384-21:2004 which iswithdrawn.The UK participation in its preparation was entrusted to Technical CommitteeEPL/40X, Capacitors and resistors for electronic equipme
3、nt.A list of organizations represented on this committee can be obtained onrequest to its secretary.This publication does not purport to include all the necessary provisions of acontract. Users are responsible for its correct application. The British Standards Institution 2012Published by BSI Standa
4、rds Limited 2012ISBN 978 0 580 70052 1ICS 31.060.10Compliance with a British Standard cannot confer immunity fromlegal obligations.This British Standard was published under the authority of the StandardsPolicy and Strategy Committee on 30 April 2012.Amendments issued since publicationAmd. No. Date T
5、ext affectedBRITISH STANDARDBS EN 60384-21:2012EUROPEAN STANDARD EN 60384-21 NORME EUROPENNE EUROPISCHE NORM March 2012 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Management Centre:
6、Avenue Marnix 17, B - 1000 Brussels 2012 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 60384-21:2012 E ICS 31.060.10 Supersedes EN 60384-21:2004English version Fixed capacitors for use in electronic equipment - Part 21: Sectiona
7、l specification - Fixed surface mount multilayer capacitors of ceramic dielectric, Class 1 (IEC 60384-21:2011) Condensateurs fixes utiliss dans les quipements lectroniques - Partie 21: Spcification intermdiaire: Condensateurs multicouches fixes dilectriques en cramique pour montage en surface, de cl
8、asse 1 (CEI 60384-21:2011) Festkondensatoren zur Verwendung in Gerten der Elektronik - Teil 21: Rahmenspezifikation - Oberflchenmontierbare Vielschichtkeramik-Festkondensatoren, Klasse 1 (IEC 60384-21:2011) This European Standard was approved by CENELEC on 2012-01-13. CENELEC members are bound to co
9、mply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENEL
10、EC Management Centre or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre
11、has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, t
12、he Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. BS EN 60384-21:2012EN 60384-21:2012 - 2 - Foreword The text of document 40/2127/FDIS, future edition 2 of IEC 60384-21, prepared by IEC TC 40, “Capacitors and resistors f
13、or electronic equipment“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 60384-21:2012. The following dates are fixed: latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2012-
14、10-13 latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2015-01-13 This document supersedes EN 60384-21:2004. EN 60384-21:2012 includes the following significant technical changes with respect to EN 60384-21:2004: The test voltage of 1,2 URat UR 1 0
15、00 V has been added in 4.5.4 Voltage proof. Detail test conditions have been added in 4.7 Shear test and 4.8 Substrate bending test. Test conditions applying lead free solder alloy (Sn-Ag-Cu) have been included in 4.9 Resistance to soldering heat and 4.10 Solderability. A selection of the test condi
16、tions according to marketing needs have been stated in 4.13 Damp heat, steady state. The dimensions of 0402 M in Annex A have been added. The code of the temperature coefficient and the tolerance of capacitance for the reference temperature of 25 C have been added, see Annex B. Attention is drawn to
17、 the possibility that some of the elements of this document may be the subject of patent rights. CENELEC and/or CEN shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 60384-21:2011 was approved by CENELEC as a Eu
18、ropean Standard without any modification. In the official version, for Bibliography, the following note has to be added for the standard indicated: IEC 60384-14 NOTE Harmonized as EN 60384-14. BS EN 60384-21:2012- 3 - EN 60384-21:2012 Annex ZA (normative) Normative references to international public
19、ations with their corresponding European publications The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) appl
20、ies. NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. Publication Year Title EN/HD Year IEC 60063 + A1 + A2 1963 1967 1977 Preferred number series for resistors and capacitors - - IEC 60068-1 + corr. October 1988 1988 E
21、nvironmental testing - Part 1: General and guidance EN 60068-11994 IEC 60068-2-58 2004 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) EN 60068-2-58 + corr. December
22、 2004 2004 IEC 60384-1 + corr. November 2008 2008 Fixed capacitors for use in electronic equipment - Part 1: Generic specification EN 60384-1 2009 IEC 61193-2 2007 Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages EN 61193-2
23、 2007 ISO 3 1973 Preferred numbers - Series of preferred numbers - - BS EN 60384-21:2012 2 60384-21 IEC:2011 CONTENTS 1 General 7 1.1 Scope 7 1.2 Object . 7 1.3 Normative references 7 1.4 Information to be given in a detail specification . 7 1.4.1 Outline drawing and dimensions 8 1.4.2 Mounting . 8
24、1.4.3 Rating and characteristics . 8 1.4.4 Marking . 9 1.5 Terms and definitions 9 1.6 Marking . 10 1.6.1 Information for marking 10 1.6.2 Marking on the body 10 1.6.3 Requirements for marking 10 1.6.4 Marking of the packaging . 10 1.6.5 Additional marking . 10 2 Preferred ratings and characteristic
25、s 10 2.1 Preferred characteristics . 10 2.1.1 Preferred climatic categories . 10 2.2 Preferred values of ratings 11 2.2.1 Rated temperature (TR) . 11 2.2.2 Rated voltage (UR) 11 2.2.3 Category voltage (UC) . 11 2.2.4 Preferred values of nominal capacitance and associated tolerance values . 11 2.2.5
26、Temperature coefficient () . 12 2.2.6 Dimensions . 14 3 Quality assessment procedures 14 3.1 Primary stage of manufacture 14 3.2 Structurally similar components . 14 3.3 Certified records of released lots . 14 3.4 Qualification approval 14 3.4.1 Qualification approval on the basis of the fixed sampl
27、e size procedures 14 3.4.2 Tests . 15 3.5 Quality conformance inspection . 19 3.5.1 Formation of inspection lots . 19 3.5.2 Schedule . 20 3.5.3 Delayed delivery 20 3.5.4 Assessment levels . 20 4 Test and measurement procedures . 21 4.1 Preliminary drying . 21 4.2 Measuring conditions 22 4.3 Mounting
28、 . 22 4.4 Visual examination and check of dimensions . 22 4.4.1 Visual examination 22 BS EN 60384-21:201260384-21 IEC:2011 3 4.4.2 Requirements 22 4.5 Electrical tests . 24 4.5.1 Capacitance 24 4.5.2 Tangent of loss angle (tan ) . 24 4.5.3 Insulation resistance 24 4.5.4 Voltage proof . 25 4.6 Temper
29、ature coefficient () and temperature cycle drift . 26 4.6.1 Preliminary drying 26 4.6.2 Measuring conditions . 26 4.6.3 Requirements 26 4.7 Shear test . 26 4.8 Substrate bending test 27 4.8.1 Initial measurement . 27 4.8.2 Final inspection . 27 4.9 Resistance to soldering heat . 27 4.9.1 Initial mea
30、surement . 27 4.9.2 Test conditions 27 4.9.3 Recovery . 28 4.9.4 Final inspection, measurements and requirements 28 4.10 Solderability 29 4.10.1 Test conditions 29 4.10.2 Recovery . 30 4.10.3 Final inspection, measurements and requirements 30 4.11 Rapid change of temperature 30 4.11.1 Initial measur
31、ement . 30 4.11.2 Number of cycles . 30 4.11.3 Recovery . 30 4.11.4 Final inspection, measurements and requirements 30 4.12 Climatic sequence . 31 4.12.1 Initial measurement . 31 4.12.2 Dry heat 31 4.12.3 Damp heat, cyclic, Test Db, first cycle . 31 4.12.4 Cold 31 4.12.5 Damp heat, cyclic, Test Db,
32、remaining cycles 31 4.12.6 Final inspection, measurements and requirements 31 4.13 Damp heat, steady state 32 4.13.1 Initial measurement . 32 4.13.2 Conditions of test 32 4.13.3 Recovery . 33 4.13.4 Final inspection, measurements and requirements 33 4.14 Endurance . 33 4.14.1 Initial measurement . 3
33、3 4.14.2 Conditions of test 33 4.14.3 Recovery . 34 4.14.4 Final inspection, measurements and requirements 34 4.15 Robustness of terminations (only for capacitors with strip termination) 34 4.15.1 Test conditions 34 4.15.2 Final inspection and requirements . 34 4.16 Component solvent resistance (if
34、required) 35 BS EN 60384-21:2012 4 60384-21 IEC:2011 4.17 Solvent resistance of the marking (if required) . 35 4.18 Accelerated damp heat, steady state (if required) 35 4.18.1 Initial measurement . 35 4.18.2 Conditioning 35 4.18.3 Recovery . 36 4.18.4 Final measurements 36 Annex A (normative) Guidan
35、ce for the specification and coding of dimensions of fixed surface mount multilayer capacitors of ceramic dielectric, Class 1 37 Annex B (informative) Combination of temperature coefficient and tolerance for the reference temperature of 25 C . 38 Bibliography 39 Figure 1 Fault: crack or fissure 22 F
36、igure 2 Fault: crack or fissure 22 Figure 3 Separation or delamination 23 Figure 4 Exposed electrodes 23 Figure 5 Principal faces . 23 Figure 6 Reflow temperature profile . 28 Figure A.1 Dimensions . 37 Table 1 Preferred tolerance on nominal capacitance 11 Table 2 Nominal temperature coefficient and
37、 tolerance 12 Table 3 Combination of temperature coefficient and tolerance . 13 Table 4 Fixed sample size test plan for qualification approval Assessment level EZ 16 Table 5 Tests schedule for qualification approval . 17 Table 6a Lot-by-lot inspection 21 Table 6b Periodic tests 21 Table 7 Tangent of
38、 loss angle limits . 24 Table 8 Test voltages. 26 Table 9 Temperature cyclic drift limits 26 Table 10 Reflow temperature profiles for Sn-Ag-Cu alloy . 28 Table 11 Maximum capacitance change . 29 Table 12 Maximum capacitance change . 31 Table 13 Number of damp heat cycles . 31 Table 14 Final inspecti
39、on measurements and requirements . 32 Table 15 Test conditions for damp heat, steady state . 32 Table 16 Final inspection measurements and requirements . 33 Table 17 Endurance test conditions (UC= UR) . 33 Table 18 Endurance test conditions (UC UR) . 34 Table 19 Final inspection measurements and req
40、uirements . 34 Table 20 Initial requirements 35 Table 21 Conditioning 35 Table B.1 Combination of temperature coefficient and tolerance for the reference temperature of 25 C 38 BS EN 60384-21:201260384-21 IEC:2011 7 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT Part 21: Sectional specification Fi
41、xed surface mount multilayer capacitors of ceramic dielectric, Class 1 1 General 1.1 Scope This part of IEC 60384 is applicable to fixed unencapsulated surface mount multilayer capacitors of ceramic dielectric, Class 1, for use in electronic equipment. These capacitors have metallized connecting pad
42、s or soldering strips and are intended to be mounted on printed boards, or directly onto substrates for hybrid circuits. Capacitors for electromagnetic interference suppression are not included, but are covered by IEC 60384-14. 1.2 Object The object of this standard is to prescribe preferred ratings
43、 and characteristics and to select from IEC 60384-1 the appropriate quality assessment procedures, tests and measuring methods and to give general performance requirements for this type of capacitor. Test severities and requirements prescribed in detail specifications referring to this sectional spe
44、cification should be of equal or higher performance level, lower performance levels are not permitted. 1.3 Normative references The following reference documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the
45、latest edition of the referenced document (including any amendments) applies. IEC 60063:1963, Preferred number series for resistors and capacitors Amendment 1 (1967) Amendment 2 (1977) IEC 60068-1:1988, Environmental testing Part 1: General and guidance IEC 60068-2-58:2004, Environmental testing Par
46、t 2-58: Tests Test Td Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) IEC 60384-1:2008, Fixed capacitors for use in electronic equipment Part 1: Generic specification IEC 61193-2:2007, Quality assessment systems Part
47、2: Selection and use of sampling plans for inspection of electronic components and packages ISO 3:1973, Preferred numbers Series of preferred numbers 1.4 Information to be given in a detail specification The detail specification shall be derived from the relevant blank detail specification. BS EN 60
48、384-21:2012 8 60384-21 IEC:2011 Detail specifications shall not specify requirements inferior to those of the generic, sectional or blank detail specification. When more severe requirements are included, they shall be listed in 1.9 of the detail specification and indicated in the test schedules, for
49、 example by an asterisk. NOTE The information given in 1.4.1 may, be presented in tabular form if more convenient. The following information shall be given in each detail specification and the values quoted shall preferably be selected from those given in the appropriate clause of this sectional specification. 1.4.1 Outline drawing and dimensions There shall be an illustration of the capacitors as an aid to easy recognit
