1、BRITISH STANDARDBS EN 60539-2:2004Directly heated negative temperature coefficient thermistors Part 2: Sectional specification Surface mount negative temperature coefficient thermistorsICS 31.040.30g49g50g3g38g50g51g60g44g49g42g3g58g44g55g43g50g56g55g3g37g54g44g3g51g40g53g48g44g54g54g44g50g49g3g40g5
2、9g38g40g51g55g3g36g54g3g51g40g53g48g44g55g55g40g39g3g37g60g3g38g50g51g60g53g44g42g43g55g3g47g36g58+A1:2010National forewordThis British Standard is the UK implementation of EN 60539-2:2004+A1:2010. It is identical to IEC 60539-2:2003,incorporating amendment 1:2010. It supersedes BS EN 60539-2:2004 w
3、hich is withdrawn.The start and finish of text introduced or altered by amendment is in-dicated in the text by tags. Tags indicating changes to IEC text carry the number of the IEC amendment. For example, text altered by IEC amendment A1 is indicated by !“.The UK participation in its preparation was
4、 entrusted to Technical Committee EPL/40X, Capacitors and resistors for electronic equipment.A list of organizations represented on this committee can be obtained on request to its secretary.This publication does not purport to include all the necessary provisions of a contract. Users are responsibl
5、e for its correct application.Compliance with a British Standard cannot confer immunity from legal obligations.BS EN 60539-2:2004+A1:2010This British Standard was published under the authority of the Standards Policy and Strategy Committee on31 May 2004 BSI 2010Amendments/corrigenda issued since pub
6、licationDateComments 31 October 2010 Implementation of IEC amendment 1:2010 with CENELEC endorsement A1:2010ISBN 978 0 580 69056 3EUROPEAN STANDARD EN 60539-2:2004+A1 NORME EUROPENNE EUROPISCHE NORM September 2010 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Norma
7、lisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2004 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 60539-2:2004 E ICS 31.040.30 English versio
8、n Directly heated negative temperature coefficient thermistors Part 2: Sectional specification - Surface mount negative temperature coefficient thermistors (IEC 60539-2:2003) Thermistors coefficient de temprature ngatif chauffage direct Partie 2: Spcification intermdiaire - Montage en surface de the
9、rmistors coefficient de temprature ngatif (CEI 60539-2:2003) Direkt geheizte temperaturabhngige Widerstnde mit negativem Temperaturkoeffizienten Teil 2: Rahmenspezifikation - Oberflchenmontierbare temperaturabhngige Widerstnde mit negativem Temperaturkoeffizienten (IEC 60539-2:2003) This European St
10、andard was approved by CENELEC on 2004-02-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references conce
11、rning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into
12、its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvi
13、a, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Slovakia, Slovenia, Spain, Sweden, Switzerland and United Kingdom. Foreword The text of document 40/1346/FDIS, future edition 1 of IEC 60539-2, prepared by IEC TC 40, Capacitors and resistors for electronic equipment, was submit
14、ted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60539-2 on 2004-02-01. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2004-11-01 latest date by which t
15、he national standards conflicting with the EN have to be withdrawn (dow) 2007-02-01 Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 60539-2:2003 was approved by CENELEC as a European Standard without any modification. _ Foreword to amendment A1The
16、text of document 40/2034/CDV, future amendment 1 to IEC 60539-2:2003, prepared by IEC TC 40, Capacitors and resistors for electronic equipment, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as amendment A1 to EN 60539-2:2004 on 2010-09-01. Attention is drawn to the possi
17、bility that some of the elements of this document may be the subject of patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent rights. The following dates were fixed: latest date by which the amendment has to be implemented at national level by publicatio
18、n of an identical national standard or by endorsement (dop) 2011-06-01 latest date by which the national standards conflicting with the amendment have to be withdrawn (dow) 2013-09-01 Annex ZA has been added by CENELEC. _ Endorsement notice The text of amendment 1:2010 to the International Standard
19、IEC 60539-2:2003 was approved by CENELEC as an amendment to the European Standard without any modification. _ BS EN 60539-2:2004+A1:2010EN 60539-2:2004+A1:2010 (E)Page 2Annex ZA (normative) Normative references to international publications with their corresponding European publications The followin
20、g referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE When an international publication has been modified by c
21、ommon modifications, indicated by (mod), the relevant EN/HD applies. Publication Year Title EN/HD Year Replace the reference: IEC 60068-2-58 1999 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of su
22、rface mounting devices (SMD) EN 60068-2-581999 with the following: IEC 60068-2-58 2004 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) EN 60068-2-58 + corr. December
23、 2004 2004 BS EN 60539-2:2004+A1:2010EN 60539-2:2004+A1:2010 (E)Page 3CONTENTS 1 General 5 1.1 Scope5 1.2 Normative references 5 1.3 Information to be given in a detail specification .5 1.3.1 Outline drawing and dimensions 6 1.3.2 Mounting .6 1.3.3 Ratings and characteristics6 1.4 Terminology 6 2 Pr
24、eferred ratings and characteristics 6 2.1 Tolerances on rated zero-power resistance .6 2.2 Climatic categories6 3 Quality assessment procedures7 3.1 Primary stage of manufacture7 3.2 Structurally similar components.7 3.3 Qualification approval procedures .7 3.3.1 The manufacturer shall comply with 3
25、.4 of IEC 60539-1.7 3.4 Quality conformance inspection.7 3.4.1 Qualification approval on the basis of the fixed sample size procedure 7 3.5 Quality conformance inspection.9 3.5.1 Formation of inspection lots.9 3.5.2 Test schedule11 3.5.3 Delayed delivery11 3.5.4 Assessment level.11 4 Test and measur
26、ement procedures.11 4.1 Mounting .11 4.2 Drying and recovery 11 4.2.1 Drying .11 4.2.2 Recovery.11 4.3 Visual examination and check of dimensions.11 4.3.1 Visual examination 11 4.3.2 Requirements 11 4.3.3 Marking .13 4.3.4 Dimensions .13 4.4 Electrical tests.13 4.4.1 Zero-power resistance .13 4.4.2
27、B-value or resistance ratio.13 4.4.3 Resistance/temperature characteristic .14 4.5 Thermal tests 14 4.5.1 Dissipation factor ()14 4.5.2 Thermal time constant by cooling after self-heating (c) 14 BS EN 60539-2:2004+A1:2010EN 60539-2:2004+A1:2010 (E)Page 44.6 Resistance to soldering heat .14 4.6.1 Ini
28、tial measurement .14 4.6.2 Test conditions 14 4.6.3 Recovery.15 4.6.4 Final inspection, measurements and requirements 15 4.7 Solderability 15 4.7.1 Test conditions 15 4.7.2 Recovery.16 4.7.3 Final inspection, measurements and requirements 16 4.8 Rapid change of temperature 16 4.9 Thermal shock.16 4.
29、10 Climatic sequence .17 4.10.1 Initial measurements .17 4.10.2 Dry heat 17 4.10.3 Damp heat (cyclic), first cycle17 4.10.4 Cold 17 4.10.5 Damp heat (cyclic), remaining cycles.17 4.10.6 Final measurements 18 4.11 Damp heat, steady state18 4.12 Endurance.18 4.12.1 Endurance at 3and Pmax.18 4.12.2 End
30、urance at upper category temperature .18 4.13 Shear (adhesion) test 19 4.14 Substrate bending test 19 4.15 Component solvent resistance.19 4.16 Solvent resistance of marking19 Annex A (normative) Guide for the specification and coding of dimensions of surface mount negative temperature coefficient t
31、hermistors 20 Annex ZA (normative) Normative references to international publications with their corresponding European publications21 Table 1 Upper and lower category temperatures and duration of the damp heat test7Table 2 Fixed sample size test schedule for qualification approval of surface mount
32、negative temperature coefficient thermistors Assessment level EZ . 9 Table 3 Lot-by-lot inspection10 Table 4 Periodic test11 Table 5 Number of cycles 17 Table A.1 Dimensions20 Figure 1 Fault: fissure or defect .12 Figure 2 Fault: crack 12 Figure 3 Separation or delamination 12 Figure 4 Exposed elect
33、rodes12 Figure 5 Principal faces .13 Figure A.1 Dimensioning of surface mount thermistors.20 BS EN 60539-2:2004+A1:2010EN 60539-2:2004+A1:2010 (E)Page 5This page deliberately set blankDIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS Part 2: Sectional specification Surface mount negative
34、temperature coefficient thermistors 1 General 1.1 Scope This part of IEC 60539 is applicable to surface mount directly heated negative temperature coefficient thermistors, typically made from transition metal oxide materials with semiconducting properties. These thermistors have metallized connectin
35、g pads or soldering strips and are intended to be mounted directly on to substrates for hybrid circuits or on to printed boards. 1.2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. F
36、or undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60068-2-2:1974, Environmental testing Part 2: Tests Tests B: Dry heat Amendment 1 (1993) Amendment 2 (1994) IEC 60068-2-14:1984, Environmental testing Part 2: Tests Test N: Change of temperat
37、ure Amendment 1 (1986) IEC 60068-2-30:1980, Environmental testing Part 2: Tests Test Db and guidance: Damp heat, cyclic (12 + 12-hour cycle) Amendment 1 (1985) IEC 60068-2-78: Environmental testing Part 2-78: Tests Test Cab: Damp heat, steady state IEC 60410:1973, Sampling plans and procedures for i
38、nspection by attributes IEC 60539-1:2002, Directly heated negative temperature coefficient thermistors Part 1: Generic specification 1.3 Information to be given in a detail specification Detail specifications shall be derived from the relevant blank detail specification. Detail specifications shall
39、not specify requirements inferior to those of the generic, sectional or blank detail specification. When more severe requirements are included, they shall be listed in 1.9 of the detail specification and indicated in the test schedules, for example, by an asterisk. IEC 60068-2-58:2004, Environmental
40、 testing Part 2-58: Tests Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) !“BS EN 60539-2:2004+A1:2010EN 60539-2:2004+A1:2010 (E)Page 7NOTE The information given in 1.3.1 may for convenience, be presented in
41、tabular form. The following information shall be given in each detail specification and the values quoted shall preferably be selected from those given in the appropriate clause of this sectional specification. 1.3.1 Outline drawing and dimensions There shall be an illustration of the thermistor as
42、an aid to easy recognition and for comparison with others. Dimensions and their associated tolerances, which affect inter-changeability and mounting, shall be given in the detail specification. All dimensions shall preferably be stated in millimetres; however, when the original dimensions are given
43、in inches, the converted metric dimensions in millimetres shall be added. Normally, the numerical values shall be given for the length, width and height of the body. When necessary, for example when a number of items are covered by a detail specification, the dimensions and their associated toleranc
44、es shall be placed in a table below the drawing. When the configuration is other than described above, the detail specification shall state such dimensional information as will adequately describe the thermistor. 1.3.2 Mounting The detail specification shall give guidance on methods of mounting for
45、normal use. Mounting for test and measurement purposes (when required) shall be in accordance with 4.27 of IEC 60539-1. 1.3.3 Ratings and characteristics 1.3.3.1 Particular characteristics Additional characteristics may be listed when they are considered necessary to specify the component adequately
46、 for design and application purposes. 1.3.3.2 Marking See 2.4 of IEC 60539-1. 1.4 Terminology See 2.2 of IEC 60539-1. 2 Preferred ratings and characteristics 2.1 Tolerances on rated zero-power resistance Preferred values of tolerances on zero-power resistance are: 1 %, 2 %, 3 %, 5 %, 10 %. 2.2 Clima
47、tic categories The upper and lower category temperatures and the duration of the damp-heat steady-state test shall be selected from Table 1. BS EN 60539-2:2004+A1:2010EN 60539-2:2004+A1:2010 (E)Page 8Table 1 Upper and lower category temperatures and duration of the damp heat test Lower category temp
48、erature C 55, 40, 25, 10, 5, +5 Upper category temperature C 70, 85, 100, 105, 125, 150, 155 Damp heat, steady state days 21, 42, 56 The detail specification shall prescribe the appropriate category. 3 Quality assessment procedures 3.1 Primary stage of manufacture The primary stage of manufacture is
49、 defined as the initial mixing process of ingredients. 3.2 Structurally similar components Surface mount thermistors may be grouped as structurally similar for the purpose of forming inspection lots provided that the requirements of 3.1 of IEC 60539-1 are met, with the following addition. For the shear test and the substrate bending test, devices may be grouped if they have been made on the same production line, have the same dimens
