1、Semiconductor devices - Mechanical and climatic test methodsPart 3: External visual examination (IEC 60749-3:2017)BS EN 60749-3:2017BSI Standards PublicationWB11885_BSI_StandardCovs_2013_AW.indd 1 15/05/2013 15:06EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 60749-3 June 2017 ICS 31.080.01 Su
2、persedes EN 60749-3:2002 English Version Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination (IEC 60749-3:2017) Dispositifs semiconducteurs - Mthodes dessais mcaniques et climatiques - Partie 3: Examen visuel externe (IEC 60749-3:2017) Halbleiterbauelem
3、ente - Mechanische und klimatische Prfverfahren - Teil 3: uere Sichtprfung (IEC 60749-3:2017) This European Standard was approved by CENELEC on 2017-04-07. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard t
4、he status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three official versions (English,
5、 French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechnical committees of Aus
6、tria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slove
7、nia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels 2017 CENELEC All r
8、ights of exploitation in any form and by any means reserved worldwide for CENELEC Members. Ref. No. EN 60749-3:2017 E National forewordThis British Standard is the UK implementation of EN 60749-3:2017. It is identical to IEC 60749-3:2017. It supersedes BS EN 60749-3:2002, which is withdrawn.The UK p
9、articipation in its preparation was entrusted to Technical Committee EPL/47, Semiconductors.A list of organizations represented on this committee can be obtained on request to its secretary.This publication does not purport to include all the necessary provisions of a contract. Users are responsible
10、 for its correct application. The British Standards Institution 2017 Published by BSI Standards Limited 2017ISBN 978 0 580 94893 0ICS 31.080.01Compliance with a British Standard cannot confer immunity from legal obligations.This British Standard was published under the authority of the Standards Pol
11、icy and Strategy Committee on 30 November 2017.Amendments/corrigenda issued since publicationDate Text affectedBRITISH STANDARDBS EN 607493:2017EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 60749-3 June 2017 ICS 31.080.01 Supersedes EN 60749-3:2002 English Version Semiconductor devices - Mech
12、anical and climatic test methods - Part 3: External visual examination (IEC 60749-3:2017) Dispositifs semiconducteurs - Mthodes dessais mcaniques et climatiques - Partie 3: Examen visuel externe (IEC 60749-3:2017) Halbleiterbauelemente - Mechanische und klimatische Prfverfahren - Teil 3: uere Sichtp
13、rfung (IEC 60749-3:2017) This European Standard was approved by CENELEC on 2017-04-07. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date l
14、ists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
15、 under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark
16、, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. Europ
17、ean Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels 2017 CENELEC All rights of exploitation in any form and by any means reserved worldwide
18、 for CENELEC Members. Ref. No. EN 60749-3:2017 E BS EN 607493:2017EN 60749-3:2017 2 European foreword The text of document 47/2345/FDIS, future edition 2 of IEC 60749-3, prepared by IEC/TC 47 “Semiconductor devices“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 60749-3
19、:2017. The following dates are fixed: latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2018-01-07 latest date by which the national standards conflicting with the document have to be withdrawn (dow) 202
20、0-04-07 This document supersedes EN 60749-3:2002. Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the Internationa
21、l Standard IEC 60749-3:2017 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following note has to be added for the standard indicated : IEC 60749-9 NOTE Harmonized as EN 60749-9. BS EN 607493:2017EN 60749-3:2017 2 European forew
22、ord The text of document 47/2345/FDIS, future edition 2 of IEC 60749-3, prepared by IEC/TC 47 “Semiconductor devices“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 60749-3:2017. The following dates are fixed: latest date by which the document has to be implemented at n
23、ational level by publication of an identical national standard or by endorsement (dop) 2018-01-07 latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2020-04-07 This document supersedes EN 60749-3:2002. Attention is drawn to the possibility that some
24、of the elements of this document may be the subject of patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 60749-3:2017 was approved by CENELEC as a European Standard without any modificatio
25、n. In the official version, for Bibliography, the following note has to be added for the standard indicated : IEC 60749-9 NOTE Harmonized as EN 60749-9. EN 60749-3:2017 3 Annex ZA (normative) Normative references to international publications with their corresponding European publications The follow
26、ing documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE 1 When an In
27、ternational Publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here: www.cenelec.eu. Publication Year Title EN/HD Year IEC 61340-5-1 -
28、Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements EN 61340-5-1 - IEC 62483 - Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes on semiconductor devices - - BS EN 607493:2017This pag
29、e deliberately left blank 2 IEC 60749-3:2017 IEC 2017 CONTENTS FOREWORD . 3 1 Scope 5 2 Normative references 5 3 Terms and definitions 5 4 Test apparatus 5 5 Procedure 5 6 Failure criteria . 6 7 Summary . 6 Annex A (informative) External visual report form/checklist (example only not a mandatory tem
30、plate) . 7 A.1 Leads 7 A.2 Lead finish 8 A.3 Moulding and mould compound . 8 A.4 Critical sealant 9 A.5 Attachments 9 A.6 Marking . 9 A.7 Solder Balls 10 A.8 Substrate 10 A.9 Exposed (Backside) Silicon . 10 Bibliography 11 2 IEC 60749-3:2017 IEC 2017 CONTENTS FOREWORD . 3 1 Scope 5 2 Normative refer
31、ences 5 3 Terms and definitions 5 4 Test apparatus 5 5 Procedure 5 6 Failure criteria . 6 7 Summary . 6 Annex A (informative) External visual report form/checklist (example only not a mandatory template) . 7 A.1 Leads 7 A.2 Lead finish 8 A.3 Moulding and mould compound . 8 A.4 Critical sealant 9 A.5
32、 Attachments 9 A.6 Marking . 9 A.7 Solder Balls 10 A.8 Substrate 10 A.9 Exposed (Backside) Silicon . 10 Bibliography 11 BS EN 607493:2017IEC 60749-3:2017 IEC 2017 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SEMICONDUCTOR DEVICES MECHANICAL AND CLIMATIC TEST METHODS Part 3: External visual examinat
33、ion FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in
34、 the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrust
35、ed to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the Internati
36、onal Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each
37、 technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
38、 Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in thei
39、r national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessme
40、nt services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employee
41、s, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the pu
42、blication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the poss
43、ibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 60749-3 has been prepared by IEC technical committee 47: Semiconductor devices. This second editi
44、on cancels and replaces the first edition published in 2002. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: a) reference to the need for ESD protection; b) inclusion of information on the phenomen
45、on of tin whiskers; c) inclusion of an optional report form/checklist. BS EN 607493:2017IEC 60749-3:2017 IEC 2017 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SEMICONDUCTOR DEVICES MECHANICAL AND CLIMATIC TEST METHODS Part 3: External visual examination FOREWORD 1) The International Electrotechnica
46、l Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this en
47、d and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Comm
48、ittee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in ac
49、cordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all
