1、BSI Standards PublicationTest methods for electrical materials, printed boards and other interconnection structures and assembliesPart 2-721: Test methods for materials for interconnection structures Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequenc
2、y using split post dielectric resonatorBS EN 61189-2-721:2015National forewordThis British Standard is the UK implementation of EN 61189-2-721:2015. Itis identical to IEC 61189-2-721:2015.The UK participation in its preparation was entrusted to TechnicalCommittee EPL/501, Electronic Assembly Technol
3、ogy.A list of organizations represented on this committee can be obtained onrequest to its secretary.This publication does not purport to include all the necessary provisions ofa contract. Users are responsible for its correct application. The British Standards Institution 2015.Published by BSI Stan
4、dards Limited 2015ISBN 978 0 580 83821 7ICS 31.180Compliance with a British Standard cannot confer immunity fromlegal obligations.This British Standard was published under the authority of theStandards Policy and Strategy Committee on 30 June 2015.Amendments/corrigenda issued since publicationDate T
5、ext affectedBRITISH STANDARDBS EN 61189-2-721:2015EUROPEAN STANDARDNORME EUROPENNEEUROPISCHE NORMEN 61189-2-721 June 2015 ICS 31.180 English Version Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Testmethods for materials for i
6、nterconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectricresonator (IEC 61189-2-721:2015) Mthodes dessai pour les matriaux lectriques, les cartes imprimes et autres structures dinterconnexion etensemb
7、les - Partie 2-721: Mthodes dessai des matriaux pour structures dinterconnexion - Mesure de la permittivit relative et de la tangente de perte pour les stratifisrecouverts de cuivre en hyperfrquences laide dunrsonateur dilectrique en anneaux fendus (IEC 61189-2-721:2015) Prfverfahren fr Elektromater
8、ialien, Leiterplatten undandere Verbindungsstrukturen und Baugruppen - Teil 2-721: Prfverfahren fr Verbindungsstrukturen (Leiterplatten) - Messung der relativen Permittivitt und des Verlustfaktors von kupferkaschiertem Laminat im Mikrowellen-Frequenzbereich unter Verwendung eines Split Postdielektri
9、schen Resonators (IEC 61189-2-721:2015) This European Standard was approved by CENELEC on 2015-06-03. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteratio
10、n. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made
11、 by translationunder the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions.CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Repu
12、blic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom.
13、European Committee for Electrotechnical Standardization Comit Europen de Normalisation ElectrotechniqueEuropisches Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels 2015 CENELEC All rights of exploitation in any form and by any means reserved world
14、wide for CENELEC Members. Ref. No. EN 61189-2-721:2015 E EN 61189-2-721:2015 2 European foreword The text of document 91/1246/FDIS, future edition 1 of IEC 61189-2-721, prepared by IEC/TC 91 “Electronics assembly technology“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as E
15、N 61189-2-721:2015. The following dates are fixed: latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2016-03-03 latest date by which the national standards conflicting with the document have to be withdr
16、awn (dow) 2018-06-03 Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC and/or CEN shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 611
17、89-2-721:2015 was approved by CENELEC as a European Standard without any modification. BS EN 61189-2-721:2015 2 IEC 61189-2-721:2015 IEC 2015 CONTENTS FOREWORD . 4 1 Scope 6 2 Test specimens . 6 2.1 Specimen size 6 2.2 Preparation . 7 2.3 Marking . 7 2.4 Thickness . 7 3 Equipment/apparatus . 7 3.1 G
18、eneral . 7 3.2 Vector network analyzer (VNA) . 8 3.3 SPDR test fixture 8 3.3.1 General . 8 3.3.2 Parameters 8 3.3.3 Frequency . 8 3.4 Verify unit . 9 3.5 Micrometer 9 3.6 Circulating oven 9 3.7 Test chamber 9 4 Procedure 9 4.1 Preconditioning . 9 4.2 Testing of relative permittivity and loss tangent
19、 at room temperature 9 4.2.1 Test conditions 9 4.2.2 Preparation 9 4.2.3 Fixture . 10 4.2.4 Connection to VNA 10 4.2.5 VNA parameter 10 4.2.6 Frequency and Q-factor without specimen . 10 4.2.7 Micrometer 10 4.2.8 Setting the specimen . 10 4.2.9 Frequency and Q-factor with specimen 10 4.2.10 Comparis
20、on . 10 4.2.11 Calculation 11 4.2.12 Change the specimen 12 4.2.13 Change in test frequency . 12 4.3 Testing of relative permittivity and loss tangent at variable temperatures 12 4.3.1 Test conditions 12 4.3.2 Preparation 12 4.3.3 Fixture . 12 4.3.4 Connection to VNA 12 4.3.5 VNA parameter 12 4.3.6
21、Temperature in the chamber 12 4.3.7 Frequency and Q-factor without specimen . 12 4.3.8 Micrometer 12 4.3.9 Setting of the specimen . 13 4.3.10 Frequency and Q-factor with specimen 13 4.3.11 Calculation 13 BS EN 61189-2-721:2015IEC 61189-2-721:2015 IEC 2015 3 4.3.12 Options 13 4.3.13 Thermal coeffici
22、ent 13 4.3.14 Change in test frequency . 14 5 Report . 14 5.1 At room temperature . 14 5.2 At variable temperature . 14 6 Additional information 14 6.1 Accuracy . 14 6.2 Maintenance . 14 6.3 Matters to be attended 15 6.4 Additional information concerning fixtures and results . 15 6.5 Additional info
23、rmation on K(r,h) and pes. 15 Annex A (informative) Example of test fixture and test result 16 A.1 Example of test fixture 16 A.2 Example of test result . 16 Annex B (informative) Additional information on K (r,h) and pes19 Bibliography 22 Figure 1 Scheme of SPDR test fixture 6 Figure 2 Component di
24、agram of test system 8 Figure 3 Scheme of the change of resonance frequency with or without the specimen 10 Figure A.1 Test fixture . 16 Figure A.2 Relative permittivity versus frequency (laminate of Dk 3,8 and thickness 0,51 mm) 17 Figure A.3 Loss tangent versus frequency (laminate of Dk 3,8 and th
25、ickness 0,51 mm) 17 Figure A.4 Curve of relative permittivity and loss tangent at variable temperatures (laminate of Dk 3,8 and thickness 0,51 mm) 18 Figure B.1 K(r,h) versus relative permittivity at different sample thicknesses 19 Figure B.2 Distribution of the electric field of the split dielectri
26、c resonator (side view of the dielectric resonators) 20 Figure B.3 Distribution of the electric field of the split dielectric resonator (top view between the dielectric resonators) 21 Figure B.4 pesversus relative permittivity at different sample thicknesses . 21 Table 1 Specimen dimensions . 7 Tabl
27、e 2 SPDR test fixtures parameter . 9 Table B.1 Results of measurements of different materials using a 10 GHz SPDR 20 BS EN 61189-2-721:2015 4 IEC 61189-2-721:2015 IEC 2015 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRU
28、CTURES AND ASSEMBLIES Part 2-721: Test methods for materials for interconnection structures Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator FOREWORD 1) The International Electrotechnical Commission (IEC) is a
29、 worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to ot
30、her activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the
31、 subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with condition
32、s determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National
33、 Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in
34、 which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Pub
35、lication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC i
36、s not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its te
37、chnical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other I
38、EC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the sub
39、ject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 61189-2-721 has been prepared by IEC technical committee 91: Electronics assembly technology. The text of this standard is based on the following documents: FDIS Report
40、on voting 91/1246/FDIS 91/1258/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. BS EN 61189-2-721:2015IEC 61189-2-721:2015 IEC 2015 5 A list of all parts in the IEC 61189 series, published under the general title
41、Test methods for electrical materials, printed boards and other interconnection structures and assemblies, can be found on the IEC website. Future standards in this series will carry the new general title as cited above. Titles of existing standards in this series will be updated at the time of the
42、next edition. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC website under “http:/webstore.iec.ch“ in the data related to the spec
43、ific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. IMPORTANT The colour inside logo on the cover page of this publication indicates that it contains colours which are considered to be useful for the correct understanding of its
44、contents. Users should therefore print this document using a colour printer. BS EN 61189-2-721:2015 6 IEC 61189-2-721:2015 IEC 2015 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES Part 2-721: Test methods for materials for interconnection str
45、uctures Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator 1 Scope This part of IEC 61189 outlines a way to determine the relative permittivity (r) and loss tangent (tan) (also called dielectric constant (Dk) an
46、d dissipation factor (Df) of copper clad laminates at microwave frequencies (from 1,1 GHz to 20 GHz) using a split post dielectric resonator (SPDR). This part of IEC 61189 is applicable to copper clad laminates and dielectric base materials. 2 Test specimens 2.1 Specimen size The size of the specime
47、n shall be larger than the internal diameter D of the metal enclosures, and the maximum thickness of the specimen shall be smaller than the distance hgbetween the metal enclosures of the fixture. (See Figure 1.) Key hgdistance between the metal enclosures of the fixture; D internal diameter of the m
48、etal enclosures; L internal height of the metal enclosures; drdiameter of the dielectric resonator; hrthickness of the dielectric resonator. Figure 1 Scheme of SPDR test fixture IEC Dielectric resonators Support D Z Coupling loop Sample Metal enclosure drhrLhgBS EN 61189-2-721:2015IEC 61189-2-721:20
49、15 IEC 2015 7 Three specimens for the test at room temperature and one specimen for the test at variable temperatures are required for each SPDR test fixture for this test. Table 1 shows the supported specimen dimensions. Table 1 Specimen dimensions SPDR test fixtures nominal frequency Supported specimen sizes Maximum thickness of specimens GHz mm mm 1,1 150 150 6,0 3 80 80 3,0 5 to 6 80 80 2,0 9 to 10 80 80 0,9 13 to 16 50 3
