1、BSI Standards PublicationTest methods for electrical materials, printed boards and other interconnection structures and assembliesPart 5-4: General test methods for materials and assemblies Solder alloys and fluxed and non-fluxed solid wire forprinted board assembliesBS IEC 61189-5-4:2015BS EN 61189
2、-5-4:2015BS EN 61189-5-4:2015 BRITISH STANDARDNational forewordThis British Standard is the UK implementation of EN 61189-5-4:2015. It is identical to IEC 61189-5-4:2015. It supersedes BS IEC 61189-5-4:2015, which is withdrawn.The UK participation in its preparation was entrusted to Technical Commit
3、tee EPL/501, Electronic Assembly Technology.A list of organizations represented on this committee can be obtained on request to its secretary.This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. The British Standa
4、rds Institution 2015. Published by BSI Standards Limited 2015ISBN 978 0 580 90020 4ICS 31.180Compliance with a British Standard cannot confer immunity from legal obligations.This British Standard was published under the authority of the Standards Policy and Strategy Committee on 31 January 2015.Amen
5、dments/corrigenda issued since publicationDate Text affected30 April 2015 This corrigendum renumbers BS IEC 61189-5-4:2015 as BS EN 61189-5-4:2015.EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 61189-5-4 March 2015 ICS 31.180 English Version Test methods for electrical materials, printed board
6、s and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies (IEC 61189-5-4:2015) Mthodes dessai pour les matriaux lectriques, les cartes imprimes et autres struct
7、ures dinterconnexion et ensembles - Partie 5-4: Mthodes dessai gnrales pour les matriaux et les assemblages - Alliages braser et brasages solides fluxs et non fluxs pour les assemblages de cartes imprimes (IEC 61189-5-4:2015) Prfverfahren fr Elektromaterialien, Leiterplatten und andere Verbindungsst
8、rukturen und Baugruppen - Teil 5-4: Allgemeine Prfverfahren fr Materialien und Baugruppen - Lotlegierungen und Lotdraht mit und ohne Flussmittel fr bestckte Leiterplatten (IEC 61189-5-4:2015) This European Standard was approved by CENELEC on 2015-02-12. CENELEC members are bound to comply with the C
9、EN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management C
10、entre or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same st
11、atus as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuan
12、ia, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische N
13、ormung CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels 2015 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members. Ref. No. EN 61189-5-4:2015 E EN 61189-5-4:2015 - 2 - Foreword The text of document 91/1212/FDIS, future edition 1 of IE
14、C 61189-5-4, prepared by IEC/TC 91 “Electronics assembly technology“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 61189-5-4:2015. The following dates are fixed: latest date by which the document has to be implemented at national level by publication of an identical na
15、tional standard or by endorsement (dop) 2015-11-12 latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2018-02-12 Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC and/or CEN
16、shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 61189-5-4:2015 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following notes have to be
17、 added for the standards indicated: IEC 60068-2-20 NOTE Harmonized as EN 60068-2-20. IEC 61189-1 NOTE Harmonized as EN 61189-1. IEC 61189-2:2006 NOTE Harmonized as EN 61189-2:2006 (not modified). IEC 61189-3:2007 NOTE Harmonized as EN 61189-3:2008 (not modified). IEC 61190-1-1 NOTE Harmonized as EN
18、61190-1-1. IEC 61190-1-2 NOTE Harmonized as EN 61190-1-2. IEC 61249-2-7 NOTE Harmonized as EN 61249-2-7. IEC 62137:2004 NOTE Harmonized as EN 62137:2004 (not modified). ISO 9001 NOTE Harmonized as EN ISO 9001. ISO 9455-2 NOTE Harmonized as EN ISO 9455-2. 2 BS EN 61189-5-4:2015EN 61189-5-4:2015EN 611
19、89-5-4:2015 - 2 - Foreword The text of document 91/1212/FDIS, future edition 1 of IEC 61189-5-4, prepared by IEC/TC 91 “Electronics assembly technology“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 61189-5-4:2015. The following dates are fixed: latest date by which th
20、e document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2015-11-12 latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2018-02-12 Attention is drawn to the possibility that some of th
21、e elements of this document may be the subject of patent rights. CENELEC and/or CEN shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 61189-5-4:2015 was approved by CENELEC as a European Standard without any mod
22、ification. In the official version, for Bibliography, the following notes have to be added for the standards indicated: IEC 60068-2-20 NOTE Harmonized as EN 60068-2-20. IEC 61189-1 NOTE Harmonized as EN 61189-1. IEC 61189-2:2006 NOTE Harmonized as EN 61189-2:2006 (not modified). IEC 61189-3:2007 NOT
23、E Harmonized as EN 61189-3:2008 (not modified). IEC 61190-1-1 NOTE Harmonized as EN 61190-1-1. IEC 61190-1-2 NOTE Harmonized as EN 61190-1-2. IEC 61249-2-7 NOTE Harmonized as EN 61249-2-7. IEC 62137:2004 NOTE Harmonized as EN 62137:2004 (not modified). ISO 9001 NOTE Harmonized as EN ISO 9001. ISO 94
24、55-2 NOTE Harmonized as EN ISO 9455-2. - 3 - EN 61189-5-4:2015 Annex ZA (normative) Normative references to international publications with their corresponding European publications The following documents, in whole or in part, are normatively referenced in this document and are indispensable for it
25、s application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant EN/HD ap
26、plies. NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here: www.cenelec.eu Publication Year Title EN/HD Year IEC 61189-5 - Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for pri
27、nted board assemblies EN 61189-5 - IEC 61189-6 - Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies EN 61189-6 - IEC 61190-1-3 - Attachment materials for electronic assembly - Part 1-3: Req
28、uirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications EN 61190-1-3 - 3 BS EN 61189-5-4:2015EN 61189-5-4:2015 2 IEC 61189-5-4:2015 IEC 2015 CONTENTS FOREWORD . 4 INTRODUCTION . 6 1 Scope 7 2 Normative references 7 3 Accuracy, precis
29、ion and resolution 7 3.1 General . 7 3.2 Accuracy . 8 3.3 Precision . 8 3.4 Resolution 9 3.5 Report. 9 3.6 Students t distribution 9 3.7 Suggested uncertainty limits . 10 4 C: Chemical test methods 11 4.1 Test 5-4C01: Determination of the percentage of flux on/in flux-coated and/or flux-cored solder
30、 11 Object 11 4.1.1Test specimen . 11 4.1.2Apparatus 11 4.1.3Test procedure 11 4.1.44.2 Test 5-4CXX . 12 5 X: Miscellaneous test methods 12 5.1 Test 5-4X01: Spread test, extracted cored wires or preforms 12 Object 12 5.1.1Method A . 12 5.1.2Method B . 13 5.1.3Additional information 15 5.1.45.2 Test
31、5-4X02: Spitting test of flux-cored wire solder . 15 Object 15 5.2.1Method A . 15 5.2.2Method B . 16 5.2.3Additional information 19 5.2.45.3 Test 5-4X03: Solder pool test 20 Object 20 5.3.1Test specimen . 20 5.3.2Apparatus and reagents . 20 5.3.3Test procedure 20 5.3.4Evaluation . 21 5.3.5Additional
32、 information 21 5.3.6Bibliography 22 Figure 1 Test apparatus for spitting test . 16 Figure 2 Test apparatus for spitting test, method B 18 Figure 3 Collecting paper with printed concentric circles with 1 cm pitch 19 BS IEC 61189-5-4:2015IEC 61189-5-4:2015 IEC 2015 3 Table 1 Students t distribution .
33、 10 Table 2 Typical spread areas defined in mm213 Table 3 Example of a test report Spitting of flux-cored wire . 19 BS IEC 61189-5-4:2015 2 IEC 61189-5-4:2015 IEC 2015 CONTENTS FOREWORD . 4INTRODUCTION . 61 Scope 2 Normative references 3 Accuracy, precision and resolution 3.1 General . 7 3.2 Accurac
34、y . 8 3.3 Precision . 8 3.4 esolution 9 3.5 Report. 9 3.6 tudents t distribution 9 3.7 Suggested uncertainty limits . 10 4 C: Chemical test methods 11 4.1 Test 5-4C01: Determination of the percentage of flux on/in flux-coated and/or flux-cored solder Object 4.1.1Test specimen . 4.1.2Apparatus 4.1.3T
35、est procedure 11 4.1.44.2 Test 5-4CXX . 5 X: Miscellaneous test methods 5.1 Test 5-4X01: Spread test, extracted cored wires or preforms Object 5.1.1t d A . 12 5.1.2Method B . 13 5.1.3Additional information 5.1.45.2 Test 5-4X02: Spitting test of flux-cored wire solder . Object 5.2.1t d A . 15 5.2.2Me
36、thod B . 16 5.2.3Additional information 19 5.2.45.3 Test 5-4X03: Solder pool test Object 5.3.1Test specimen . 5.3.2Apparatus and reagents . 5.3.3Test procedure 20 5.3.4Evaluation . 5.3.5Additional information 21 5.3.6Bibliography 22 1 .162 Test apparatus for spitting test, method B 18Figure 3 Collec
37、ting paper with printed concentric circles with 1 cm pitch 19 BS IEC 61189-5-4:2015BS EN 61189-5-4:2015IEC 61189-5-4:2015 4 2 IEC 61189-5-4:2015 IEC 2015 CONTENTS FOREWORD . 4 INTRODUCTION . 6 1 Scope 7 2 Normative references 7 3 Accuracy, precision and resolution 7 3.1 General . 7 3.2 Accuracy . 8
38、3.3 Precision . 8 3.4 Resolution 9 3.5 Report. 9 3.6 Students t distribution 9 3.7 Suggested uncertainty limits . 10 4 C: Chemical test methods 11 4.1 Test 5-4C01: Determination of the percentage of flux on/in flux-coated and/or flux-cored solder 11 Object 11 4.1.1Test specimen . 11 4.1.2Apparatus 1
39、1 4.1.3Test procedure 11 4.1.44.2 Test 5-4CXX . 12 5 X: Miscellaneous test methods 12 5.1 Test 5-4X01: Spread test, extracted cored wires or preforms 12 Object 12 5.1.1Method A . 12 5.1.2Method B . 13 5.1.3Additional information 15 5.1.45.2 Test 5-4X02: Spitting test of flux-cored wire solder . 15 O
40、bject 15 5.2.1Method A . 15 5.2.2Method B . 16 5.2.3Additional information 19 5.2.45.3 Test 5-4X03: Solder pool test 20 Object 20 5.3.1Test specimen . 20 5.3.2Apparatus and reagents . 20 5.3.3Test procedure 20 5.3.4Evaluation . 21 5.3.5Additional information 21 5.3.6Bibliography 22 Figure 1 Test app
41、aratus for spitting test . 16 Figure 2 Test apparatus for spitting test, method B 18 Figure 3 Collecting paper with printed concentric circles with 1 cm pitch 19 BS IEC 61189-5-4:2015IEC 61189-5-4:2015 IEC 2015 3 Table 1 Students t distribution . 10 Table 2 Typical spread areas defined in mm213 Tabl
42、e 3 Example of a test report Spitting of flux-cored wire . 19 BS IEC 61189-5-4:2015 2 IEC 61189-5-4:2015 IEC 2015 CONTENTS FOREWORD . 4INTRODUCTION . 61 Scope 2 Normative references 3 Accuracy, precision and resolution 3.1 General . 7 3.2 Accuracy . 8 3.3 Precision . 8 3.4 esolution 9 3.5 Report. 9
43、3.6 tudents t distribution 9 3.7 Suggested uncertainty limits . 10 4 C: Chemical test methods 11 4.1 Test 5-4C01: Determination of the percentage of flux on/in flux-coated and/or flux-cored solder Object 4.1.1Test specimen . 4.1.2Apparatus 4.1.3Test procedure 11 4.1.44.2 Test 5-4CXX . 5 X: Miscellan
44、eous test methods 5.1 Test 5-4X01: Spread test, extracted cored wires or preforms Object 5.1.1t d A . 12 5.1.2Method B . 13 5.1.3Additional information 5.1.45.2 Test 5-4X02: Spitting test of flux-cored wire solder . Object 5.2.1t d A . 15 5.2.2Method B . 16 5.2.3Additional information 19 5.2.45.3 Te
45、st 5-4X03: Solder pool test Object 5.3.1Test specimen . 5.3.2Apparatus and reagents . 5.3.3Test procedure 20 5.3.4Evaluation . 5.3.5Additional information 21 5.3.6Bibliography 22 1 .162 Test apparatus for spitting test, method B 18Figure 3 Collecting paper with printed concentric circles with 1 cm p
46、itch 19 BS IEC 61189-5-4:2015BS EN 61189-5-4:2015IEC 61189-5-4:2015 5 6 IEC 61189-5-4:2015 IEC 2015 INTRODUCTION IEC 61189 relates to test methods for materials or component robustness for printed board assemblies, irrespective of their method of manufacture. The standard is divided into separate pa
47、rts, covering information for the designer and the test methodology engineer or technician. Each part has a specific focus; methods are grouped according to their application and numbered sequentially as they are developed and released. In some instances test methods developed by other TCs (for exam
48、ple, TC 104) have been reproduced from existing IEC standards in order to provide the reader with a comprehensive set of test methods. When this situation occurs, it will be noted on the specific test method; if the test method is reproduced with minor revision, those paragraphs that are different a
49、re identified. This part of IEC 61189 contains test methods for evaluating robustness of materials or component for printed board assemblies. The methods are self-contained, with sufficient detail and description so as to achieve uniformity and reproducibility in the procedures and test methodologies. The tests shown in this standard are grouped according to the following principles: P: preparation/conditioning methods V: visual test met
