1、BRITISH STANDARD BS EN 61190-1-3:2007 Attachment materials for electronic assembly Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications ICS 31.190 +A1:2010National foreword This British Standard is the UK implementati
2、on of EN 61190-1-3:2007+A1:2010. It is identical to IEC 61190-1-3:2007, incorporating amendment 1:2010. It supersedes BS EN 61190-1-3:2007 which is withdrawn on 1 September 2013. The start and finish of text introduced or altered by amendment is indicated in the text by tags. Tags indicating changes
3、 to IEC text carry the number of the IEC amendment. For example, text altered by IEC amendment 1 is indicated by !“. The UK participation in its preparation was entrusted to Technical Committee EPL/501, Electronic assembly technology. A list of organizations represented on this committee can be obta
4、ined on request to its secretary. This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. Compliance with a British Standard cannot confer immunity from legal obligations. BS EN 61190-1-3:2007+A1:2010 This British St
5、andard was published under the authority of the Standards Policy and Strategy Committee on 31 July 2007 BSI 2011 ISBN 978 0 580 64639 3 Amendments/corrigenda issued since publication Date Comments 31 March 2011 Implementation of IEC amendment 1:2010 and its CENELEC endorsement A1:2010 EUROPEAN STAND
6、ARD EN 61190-1-3:2007+A1 NORME EUROPENNE EUROPISCHE NORM September 2010 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2007 CEN
7、ELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 61190-1-3:2007 E ICS 31.190 English version Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid sold
8、ers for electronic soldering applications (IEC 61190-1-3:2007) Matriaux de fixation pour les assemblages lectroniques - Partie 1-3: Exigences relatives aux alliages braser de catgorie lectronique et brasures solides fluxes et non-fluxes pour les applications de brasage lectronique (CEI 61190-1-3:200
9、7) Verbindungsmaterialien fr Baugruppen der Elektronik - Teil 1-3: Anforderungen an Elektroniklote und an Festformlote mit oder ohne Flussmittel fr das Lten von Elektronikprodukten (IEC 61190-1-3:2007) This European Standard was approved by CENELEC on 2007-05-01. CENELEC members are bound to comply
10、with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secret
11、ariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as th
12、e official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Po
13、rtugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom. Foreword The text of document 91/647/FDIS, future edition 2 of IEC 61190-1-3, prepared by IEC TC 91, Electronics assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as
14、EN 61190-1-3 on 2007-05-01. This European Standard supersedes EN 61190-1-3:2002. The main changes with regard to EN 61190-1-3:2002 concern a definition of lead-free solder alloy and an amendment to Table B.1 concerning lead-free solder alloys. The following dates were fixed: latest date by which the
15、 EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2008-02-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2010-05-01 Annex ZA has been added by CENELEC. _ Endorsement notice The text
16、of the International Standard IEC 61190-1-3:2007 was approved by CENELEC as a European Standard without any modification. _ Foreword The text of document 91/920/FDIS, future amendment 1 to IEC 61190-1-3:2007, prepared by IEC TC 91, Electronics assembly technology, was submitted to the IEC-CENELEC pa
17、rallel vote and was approved by CENELEC as amendment A1 to EN 61190-1-3:2007 on 2010-09-01. Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent right
18、s. The following dates were fixed: latest date by which the amendment has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2011-06-01 latest date by which the national standards conflicting with the amendment have to be withdrawn (dow) 2013
19、-09-01 _ Endorsement notice The text of amendment 1:2010 to the International Standard IEC 61190-1-3:2007 was approved by CENELEC as an amendment to the European Standard without any modification. _ to amendment A1 2 BS EN 61190-1-3:2007+A1:2010 EN 61190-1-3:2007+A1:2010 (E) CONTENTS 1 Scope.5 2 Nor
20、mative references5 3 Terms and definitions .5 4 Classification7 4.1 Alloy composition.7 4.2 Solder form .7 4.3 Flux type .8 4.4 Flux percentage and metal content 9 4.5 Other characteristics10 5 Requirements .10 5.1 Materials .10 5.2 Alloys 10 5.3 Solder forms11 5.4 Flux type and form.12 5.5 Flux res
21、idue dryness13 5.6 Spitting13 5.7 Solder pool13 5.8 Labelling for product identification13 5.9 Workmanship 13 6 Quality assurance provisions.14 6.1 Responsibility for inspection and compliance14 6.2 Classification of inspections.14 6.3 Materials inspection.19 6.4 Qualification inspections 19 6.5 Qua
22、lity conformance20 6.6 Preparation of solder alloy for test20 7 Preparation for delivery Preservation, packing and packaging.20 Annex A (informative) Selection of various alloys and fluxes for use in electronic soldering General information concerning IEC 61190-1-3.21 Annex B (normative) Lead-free s
23、older alloys.25 Figure 1 Report form for solder alloy tests 15 Figure 2 Report form for solder powder tests 16 Figure 3 Report form for non-fluxed solder tests .17 Figure 4 Report form for fluxed wire/ribbon solder tests 18 Table 1 Solder materials.7 Table 2 Flux types and designating symbols .9 Tab
24、le 3 Flux percentage.10 Table 4 Standard solder powders .12 Annex ZA (normative) Normative references to international publications with their corresponding European publications 36 3 BS EN 61190-1-3:2007+A1:2010 EN 61190-1-3:2007+A1:2010 (E) Table 5 Solder inspections .19 Table B.1 Composition, and
25、 temperature characteristics of lead-free solder alloys a, b .25 Table B.2 Composition and temperature characteristics of common tin-lead alloys a, b .27 Table B.3 Composition and temperature characteristics for specialty (non-tin/lead) alloys a,b 29 Table B.4 Cross reference from solidus and liquid
26、us temperatures to alloy names by temperature a 30 Table B.5 Cross-reference from ISO 9453 alloy numbers and designations to IEC 61190-1-3 alloy names .3 4 BS EN 61190-1-3:2007+A1:2010 EN 61190-1-3:2007+A1:2010 (E) 2 INTRODUCTION Attention is drawn to the possibility that some of the elements of thi
27、s document may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. The International Electrotechnical Commission (IEC) draws attention to the fact that it is claimed that compliance with this document may involve the use of a patent conce
28、rning in particular alloys compositions. IEC takes no position concerning the evidence, validity and scope of this patent right. The holder of this patent right has assured the IEC that he/she is willing to negotiate licences under reasonable and non-discriminatory terms and conditions with applican
29、ts throughout the world. In this respect, the statement of the holder of this patent right is registered with IEC. Information may be obtained from: US PAT No. 4879096 Cookson Electronics Assembly Materials 600 Route 440 Jersey City,New Jersey 07304 US PAT No. 5527628 Iowa State University Research
30、Foundation, Inc. 310 Lab of Mechanics Ames, Iowa 50011-2131, U.S.A. JP PAT No. 3040929 JP PAT No. 3027441 Matsushita Electric Industrial Co., Ltd. Matsushita IMP Building 20F 1-3-7, Shiromi, Chouh-ku, Osaka, 540-6319, Japan JP PAT No. 2805595 Mitsui Mining suppliers or users remain responsible for e
31、stablishing the exact legal position relevant to their own situation. Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights other than those identified above. IEC shall not be held responsible for identifying any or all such patent right
32、s. ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications 1 Scope This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for
33、fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for “special” electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453, ISO 9454-1 and ISO 9454-2. This standard is a quality control document and i
34、s not intended to relate directly to the materials performance in the manufacturing process Special electronic grade solders include all solders which do not fully comply with the requirements of standard solder alloys and solder materials listed herein. Examples of special solders include anodes, i
35、ngots, preforms, bars with hook and eye ends, multiple-alloy solder powders, etc. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the
36、referenced document (including any amendments) applies. IEC 60194, Printed board design, manufacture and assembly Terms and definitions IEC 61190-1-1:2002, Attachment materials for electronic assembly Part 1-1: Requirements for soldering fluxes for high-quality interconnects in electronics assembly
37、IEC 61190-1-2, Attachment materials for electronic assembly Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly IEC 61189-5, Test methods for electrical materials, interconnection structures and assemblies Part 5: Test methods for printed board assembli
38、es IEC 61189-6, Test methods for electrical materials, interconnection structures and assemblies Part 6: Test methods for materials used in manufacturing electronic assemblies ISO 9001, Quality management systems Requirements ISO 9453:2006, Soft solder alloys Chemical compositions and forms ISO-9454
39、-1:1990, Soft soldering fluxes Classification and requirements Part 1: Classifi- cation, labelling and packing ISO-9454-2:1998, Soft soldering fluxes Classification and requirements Part 2: Perform- ance requirements 3 Terms and definitions For the purposes of this document, the terms and definition
40、s given in IEC 60194, as well as the following apply. Terms marked with an asterisk (*) are taken from IEC 60194 and are reprinted here for convenience. ! “ 5 BS EN 61190-1-3:2007+A1:2010 EN 61190-1-3:2007+A1:2010 (E) 3.1 acceptance tests * those tests deemed necessary to determine the acceptability
41、 of a product and as agreed to by both purchaser and vendor 3.2 alloy substance having metallic properties and being composed of two or more chemical elements of which at least one is an elemental metal 3.3 basis metal * metal upon which coatings are deposited, also referred to as base metal 3.4 cor
42、rosion (chemical/electrolytic) * attack of chemicals, flux, and flux residues on base metals 3.5 density (phototool) * mass of a surface per unit volume, usually expressed in grams per cubic centimetre 3.6 dewetting * condition that results when molten solder coats a surface and then recedes to leav
43、e irregularly shaped mounds of solder that are separated by areas that are covered with a thin film of solder and with the basis metal not exposed 3.7 eutectic (n.) * alloy having the composition indicated by the eutectic point on an equilibrium diagram or an alloy structure of intermixed solid cons
44、tituents formed by a eutectic reaction 3.8 eutectic (adj.) * isothermal reversible reaction in which, on cooling, a liquid solution is converted into two or more intimately mixed solids, with the number of solids formed being the same as the number of components 3.9 flux * chemically - and physicall
45、y-active compound that, when heated, promotes the wetting of a base metal surface by molten solder by removing minor surface oxidation and other surface films and by protecting the surfaces from reoxidation during a soldering operation 3.10 flux characterization * series of tests that determines the
46、 basic corrosive and conductive properties of fluxes and flux residues 3.11 flux residue * flux-related contaminant that is present on or near the surface of a solder connection 3.12 liquidus temperature at which a solder alloy changes from a paste form to a liquid form 6 BS EN 61190-1-3:2007+A1:201
47、0 EN 61190-1-3:2007+A1:2010 (E) 3.13 nonwetting (solder) * partial adherence of molten solder to a surface that it has contacted and where basis metal remains exposed 3.14 lead-free solder solder alloy the lead content of which h is equal to, or less than 0,10 % by mass 3.15 solder * metal alloy wit
48、h a melting temperature that is below 450 C. NOTE Metal alloy with a melting temperature less than 450 C is classified as “soft solder”. 3.16 solderability * ability of a metal to be wetted by molten solder 3.17 solidus temperature at which a solder alloy changes from a solid to a paste form 3.18 we
49、tting, solder * formation of a relatively uniform, smooth, unbroken, and adherent film of solder to a basis metal. 4 Classification Soldering materials covered by this standard shall be classified by alloy composition, solder form, flux type, flux percentage and by other characteristics peculiar to the solder material form. 4.1 Alloy composition The solder alloys covered by this
