1、BRITISH STANDARDBS EN 61192-5:2007Workmanship requirements for soldered electronic assemblies Part 5: Rework, modification and repair of soldered electronic assembliesThe European Standard EN 61192-5:2007 has the status of a British StandardICS 31.190g49g50g3g38g50g51g60g44g49g42g3g58g44g55g43g50g56
2、g55g3g37g54g44g3g51g40g53g48g44g54g54g44g50g49g3g40g59g38g40g51g55g3g36g54g3g51g40g53g48g44g55g55g40g39g3g37g60g3g38g50g51g60g53g44g42g43g55g3g47g36g58BS EN 61192-5:2007This British Standard was published under the authority of the Standards Policy and Strategy Committee on 31 July 2007 BSI 2007ISBN
3、 978 0 580 53580 2National forewordThis British Standard is the UK implementation of EN 61192-5:2007. It is identical to IEC 61192-5:2007.The UK participation in its preparation was entrusted to Technical Committee EPL/501, Electronic assembly technology.A list of organizations represented on this c
4、ommittee can be obtained on request to its secretary.This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application.Compliance with a British Standard cannot confer immunity from legal obligations. Amendments issued since pu
5、blicationAmd. No. Date CommentsEUROPEAN STANDARD EN 61192-5 NORME EUROPENNE EUROPISCHE NORM June 2007 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart
6、35, B - 1050 Brussels 2007 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 61192-5:2007 E ICS 31.190 English version Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered
7、 electronic assemblies (IEC 61192-5:2007) Exigences relatives la qualit dexcution des assemblages lectroniques brass - Partie 5: Retouche, modification et rparation des assemblages lectroniques brass (CEI 61192-5:2007) Anforderungen an die Ausfhrungsqualitt von Ltbaugruppen - Teil 5: Nacharbeit, nde
8、rungen und Reparatur von gelteten elektronischen Baugruppen (IEC 61192-5:2007) This European Standard was approved by CENELEC on 2007-06-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a
9、national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A versi
10、on in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, th
11、e Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom. EN 61192-5:2007 2 Foreword The text
12、 of document 91/652/FDIS, future edition 1 of IEC 61192-5, prepared by IEC TC 91, Electronics assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 61192-5 on 2007-06-01. The following dates were fixed: latest date by which the EN has to be implemented
13、 at national level by publication of an identical national standard or by endorsement (dop) 2008-03-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2010-06-01 Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Stan
14、dard IEC 61192-5:2007 was approved by CENELEC as a European Standard without any modification. _ 3 EN 61192-5:2007 CONTENTS 1 Scope . H6 2 Normative references H7 3 Terminology H8 3.1 Terms and definitions . H8 3.2 Abbreviations . H8 4 Classification of rework activities . H9 4.1 Pre-soldering rewor
15、k. H9 4.2 Post-soldering rework . H9 4.3 Essential prerequisites for successful and reliable rework H9 5 Pre-soldering rework . H10 5.1 General H10 5.2 Reworking solder paste and non-conducting adhesive deposits . H10 5.2.1 General H10 5.2.2 General misalignment or smudging of deposits H10 5.2.3 Loc
16、al misalignment or smudging of deposit H10 5.2.4 General paste or adhesive quantity incorrect . H11 5.2.5 Local paste or adhesive quantity incorrect . H11 5.3 Reworking placed components H11 5.3.1 General overall component misalignment. H11 5.3.2 Local component misalignment H11 5.4 Realigning compo
17、nents after curing thermoplastic adhesive H11 5.5 Realigning components after curing thermosetting adhesive H11 6 Factors affecting post-soldering rework H12 6.1 Component marking and unmarked components H12 6.2 Reuse of removed components . H12 6.3 Sensitive components. H12 6.4 Printed board layout
18、 design and space constraints H13 6.5 Heat-sink effects. H13 6.6 Printed board material type. H13 6.7 Solder resist material and aperture size H14 6.8 Reworking individual fine pitch device leads H15 6.9 Reworking grid arrays. H15 7 Preparation for post-soldering rework and repair H16 7.1 Electrosta
19、tic precautions. H16 7.2 Avoiding exposure of components to contaminants H16 7.3 Removal of conformal coating. H16 7.4 Unsuitable components. H17 7.5 Cleaning prior to rework H17 7.6 Protecting adjacent sensitive components . H17 7.7 Baking of assemblies prior to component replacement. H17 7.8 Prehe
20、ating large multilayer boards H17 7.9 Preheating replacement sensitive components H17 8 Post-soldering rework H18 8.1 General H18 8.2 Component realignment (tweaking) . H18 8.3 Component removal H18 EN 61192-5:2007 4 8.4 Removal of adjacent components H18 8.5 Reuse of components . H18 8.6 Addition o
21、f flux and solder H19 8.7 Topping-up. H19 8.8 Removal of excess solder from joints H20 8.9 Preparation of lands before component replacement . H20 8.10 Component replacement . H21 8.11 Cleaning (if required) H21 8.12 Visual inspection and electrical testing H21 8.13 Checking thermal integrity of sol
22、der joints . H21 8.14 Replacement of local conformal coating (if required) H21 9 Selection of rework equipment, tools and methods . H21 9.1 General H21 9.2 Matching rework equipment to component and printed-board prerequisites H22 9.2.1 General H22 9.2.2 Selection based on component types on the pri
23、nted board . H23 9.2.3 Selection based on printed-board laminate material type H23 9.2.4 Selection based on assembly structure and soldering processes H23 10 Manual rework tools and methods H25 10.1 General H25 10.2 Miniature conventional (stored energy) soldering irons H25 10.3 Directly heated sold
24、ering irons H26 10.4 Hot air/gas pencils H27 10.5 Heated tweezers. H27 10.6 Soldering irons with special tips H28 11 Mechanized and programmable rework machines. H28 11.1 General H28 11.2 Hot air rework machines . H28 11.3 Focused infrared (IR) equipment. H29 11.4 Thermode (heated electrode) equipme
25、nt . H30 11.5 Laser equipment for de-soldering H31 12 Ancillary tools and equipment H32 12.1 Conventional soldering irons. H32 12.2 Hotplates H32 12.3 Pneumatic dispensers. H32 12.4 De-soldering tools, as used for through-hole assemblies . H33 12.5 Tweezers and vacuum pencils H33 12.6 Solder pots. H
26、33 12.7 Copper braid H33 13 Rework recording procedures H33 13.1 General H33 13.2 Anomaly charts. H33 13.3 Travelling documents H34 13.4 Rework status. H35 14 Training of operators and inspectors H35 15 Field repair H36 5 EN 61192-5:2007 Annex ZA (normative) Normative references to international pub
27、lications with their corresponding European publications38 Bibliography H37 Figure 1 Typical in-process modification, rework or repair activities H6 Figure 2 Gang mounting no solder mask between lands. H14 Figure 3 Conductor between lands on small pitch H14 Figure 4 Optional solder-mask design for m
28、ultiple termination component attachment H15 Figure 5 SOIC repair procedure example. H22 Figure 6 Comparing hot air/gas and infrared rework processes H25 Figure 7 Miniature conventional soldering iron. H26 Figure 8 Hot air solder system. H29 Figure 9 Heated thermode reflow soldering H30 Figure 10 Au
29、tomated laser reflow equipment . H32 Table 1 Recommended tools for different component types H24 Table 2 Electrical and electronic assembly defects H34 EN 61192-5:2007 6 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES Part 5: Rework, modification and repair of soldered electronic assembl
30、ies 1 Scope This part of IEC 61192 provides information and requirements that are applicable to modification, rework and repair procedures for soldered electronic assemblies. It is applicable to specific processes used to manufacture soldered electronic assemblies where components are attached to pr
31、inted boards and to the relevant parts of resulting products. The standard is also applicable to activities that can form part of the work in assembling mixed technology products. This part of IEC 61192 also contains guidance on design matters where they have relevance to rework. NOTE Typical in-pro
32、cess surface-mount rework activities to which this standard applies are shown in Figure 1. After component preparationAfter solder past deposition After component placement After reflow soldering After cleaning After visual inspection After in-circuit testing After functional testing After final cle
33、an After individual component placement and soldering After adhesive deposition After componentplacement After visual inspection After in-circuit testing After functional testing After adhesive curing Pre-soldering After immersion soldering Post-soldering IEC 824/07 Figure 1 Typical in-process modif
34、ication, rework or repair activities 7 EN 61192-5:2007 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (includ
35、ing any amendments) applies. IEC 60194, Printed board design, manufacture and assembly Terms and definitions IEC 61190-1-1, Attachment materials for electronic assembly Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly IEC 61190-1-2, Attachment mat
36、erials for electronic assembly Part 1-2: Requirements for solder paste for high-quality interconnections in electronics assembly IEC 61190-1-3, Attachment materials for electronics assembly Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electron
37、ic soldering applications IEC 61191-1:1998, Printed board assemblies Part 1: Generic specification Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies IEC 61191-2:1998, Printed board assemblies Part 2: Sectional specification Requireme
38、nts for surface mount soldered assemblies IEC 61191-3, Printed board assemblies Part 3: Sectional specification Requirements for through-hole mount soldered assemblies IEC 61191-4, Printed board assemblies Part 4: Sectional specification Requirements for terminal soldered assemblies IEC 61192-1, Wor
39、kmanship requirements for soldered electronic assemblies Part 1: General IEC 61192-2, Workmanship requirements for soldered electronic assemblies Part 2: Surface-mount assemblies IEC 61192-3, Workmanship requirements for soldered electronic assemblies Part 3: Through-hole mount assemblies IEC 61192-
40、4, Workmanship requirements for soldered electronic assemblies Part 4: Terminal assemblies IEC 61193-1, Quality assessment systems Part 1: Registration and analysis of defects on printed board assemblies IEC 61249 (all parts), Materials for printed boards and other interconnecting structures EN 6119
41、2-5:2007 8 3 Terminology 3.1 Terms and definitions For the purposes of this document, the terms and definitions given in IEC 60194, some of which (marked with an asterisk) are repeated below for convenience, as well as the following, apply. 3.1.1 rework* act of reprocessing non-complying articles, t
42、hrough the use of original or alternate equivalent processing, in a manner that assures compliance of the article with applicable drawings or specifications 3.1.2 repair* act of restoring the functional capability of a defective article in a manner that precludes compliance of the article with appli
43、cable drawings or specifications 3.1.3 modification* revision of the functional capability of a product in order to satisfy new acceptance criteria 3.1.4 anomaly chart copy of an assembly drawing (or of an actual printed board assembly) that is used to record the location of faults or process indica
44、tors used for process improvement analysis 3.1.5 added component electronic component that is mounted on a printed board by soldering or other attachment methods 3.1.6 embedded component electronic component that is an integral part of a printed board, for example, embedded resistors, capacitive lay
45、ers, printed inductors 3.2 Abbreviations The following abbreviations are commonly used in relation to printed board assemblies. Not all of them are used in the text. Some are included for information only. ASIC application-specific integrated circuit BGA ball grid array CLCC ceramic leaded chip carr
46、ier CLLCC ceramic leadless chip carrier LCCC leadless ceramic chip carrier LED light-emitting diode MELF metal electrode face-bonded component PLCC plastic leaded chip carrier PTFE polytetrafluoroethylene QFP plastic quad flat package 9 EN 61192-5:2007 RMA rosin, mildly active SMD surface-mounted de
47、vice SMT surface-mount technology SO small outline SOD small outline diode SOIC small outline integrated circuit SOT small outline transistor TSOP plastic thin small outline package 4 Classification of rework activities 4.1 Pre-soldering rework This includes rework following: a) component preparatio
48、n; b) deposition of solder (e.g. paste, preform, tinning); c) deposition of adhesive; d) component placement; e) curing of adhesive. NOTE In the context of this standard, the word “component” includes all added components, printed boards and any components that are manufactured integrally with the p
49、rinted board. 4.2 Post-soldering rework Post-soldering rework activities, not necessarily occurring in the order given, include: a) preparation prior to rework or repair, for example, removal of conformal coating, preheating, baking, cleaning, removal of adjacent components and parts to enable access; b) component realignment; c) component removal; d) addit
