1、Piezoelectric devices Preparation of outline drawings of surface-mounteddevices (SMD) for frequency control and selection General rulesBS EN 61240:2017BSI Standards PublicationWB11885_BSI_StandardCovs_2013_AW.indd 1 15/05/2013 15:06National forewordThis British Standard is the UK implementation of E
2、N 61240:2017. It is identical to IEC 61240:2016. It supersedes BS EN 61240:2012 which is withdrawn.The UK participation in its preparation was entrusted to TechnicalCommittee EPL/49, Piezoelectric devices for frequency control and selection.A list of organizations represented on this committee can b
3、e obtained onrequest to its secretary.This publication does not purport to include all the necessary provisions ofa contract. Users are responsible for its correct application. The British Standards Institution 2017.Published by BSI Standards Limited 2017ISBN 978 0 580 90140 9ICS 31.140Compliance wi
4、th a British Standard cannot confer immunity fromlegal obligations.T h i s B r i t i s h S t a n d a r d w a s p u b l i s h e d u n d e r t h e a u t h o r i t y o f t h eS t a n d a r d s P o l i c y a n d S t r a t e g y C o m m i t t e e o n 31 January 2 0 1 7 .Amendments/corrigenda issued since
5、 publicationDate Text affectedBRITISH STANDARDBS EN 61240:2017EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 61240 January 2017 ICS 31.140 Supersedes EN 61240:2012 English Version Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and
6、 selection - General rules (IEC 61240:2016) Dispositifs pizolectriques - Prparation des dessins dencombrement des dispositifs montage en surface pour la commande et le choix de la frquence - Rgles gnrales (IEC 61240:2016) Piezoelektrische Bauelemente - Anfertigung von Gehusezeichnungen von oberflche
7、nmontierbaren Bauelementen (SMD) zur Frequenz-Stabilisierung und -Selektion - Allgemeine Regeln (IEC 61240:2016) This European Standard was approved by CENELEC on 2016-11-28. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this
8、European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three official
9、 versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechnica
10、l committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serb
11、ia, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
12、 2017 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members. Ref. No. EN 61240:2017 E BS EN 61240:2017EN 61240:2017 2 European foreword The text of document 49/1172/CDV, future edition 3 of IEC 61240, prepared by IEC/TC 49“Piezoelectric, dielectric an
13、d electrostatic devices and associated materials for frequency control,selection and detection“ was submitted to the IEC-CENELEC parallel vote and approved byCENELEC as EN 61240:2017. The following dates are fixed: latest date by which the document has to beimplemented at national level bypublicatio
14、n of an identical nationalstandard or by endorsement(dop) 2017-08-28 latest date by which the nationalstandards conflicting with thedocument have to be withdrawn(dow) 2019-11-28 This document supersedes EN 61240:2012. Attention is drawn to the possibility that some of the elements of this document m
15、ay be the subject ofpatent rights. CENELEC and/or CEN shall not be held responsible for identifying any or all suchpatent rights. Endorsement notice The text of the International Standard IEC 61240:2016 was approved by CENELEC as a EuropeanStandard without any modification. In the official version,
16、for Bibliography, the following notes have to be added for the standards indicated: ISO 1101 NOTE Harmonized as EN ISO 1101.ISO 5456-2 NOTE Harmonized as EN ISO 5456-2. BS EN 61240:2017EN 61240:2017 3 Annex ZA (normative) Normative references to international publications with their corresponding Eu
17、ropean publications The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendmen
18、ts) applies. NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here: www.cenelec.eu Publication Year Titl
19、e EN/HD Year IEC 60191-6 - Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages EN 60191-6 - BS EN 61240:2017 2 IEC 61240:2016 IEC 2016 CONTENTS FOREWORD 3 INTRODUCTION . 5 1 Scope . 6 2 N
20、ormative references . . 6 3 Classification of SMD . . 6 4 Title of the outline drawing . . 6 5 Composition of the outline drawing 6 5.1 Elements of outline drawings 6 5.2 Outline drawing . 7 5.3 Table of detailed dimensions. 7 5.4 Actual size sketch . 7 5.5 Drawing of terminal land areas . 7 5.6 Ter
21、minal lead details . . 7 6 Requirements for terminal leads . . 9 7 Requirements for the terminal land area . 9 8 Connections of terminal leads . 9 9 Descriptive notes 10 Annex A (informative) Miniaturized leadless ceramic enclosures of piezoelectric devices (SMD) for frequency control and selection
22、. 13 A.1 Precise drawing 13 A.2 Requirements for enclosures with 3 terminals . 15 A.3 Naming rule for new type of enclosures . 15 Annex B (informative) Example of terminal connections for surface-mounted piezoelectric devices (SMD) for frequency control and selection 17 Bibliography . 18 Figure 1 Il
23、lustration of terminal projection zone 8 Figure 2 Example of a terminal land area 9 Figure A.1 Upper part of the view from above 13 Figure A.2 Front view (without a board) 14 Figure A.3 Front view (with a board) 14 Table A.1 Scale of drawings. . 13 Table A.2 Guideline for dimension table 14 Table A.
24、3 Guideline for column “Max.” of Table A.2 for A, B . . 15 Table A.4 Examples of correspondence between new and old enclosures . . 16 Table B.1 Examples of terminal connections for various types of piezoelectric devices . 17 BS EN 61240:2017IEC 61240:2016 IEC 2016 3 INTERNATIONAL ELECTROTECHNICAL CO
25、MMISSION _ PIEZOELECTRIC DEVICES PREPARATION OF OUTLINE DRAWINGS OF SURFACE-MOUNTED DEVICES (SMD) FOR FREQUENCY CONTROL AND SELECTION GENERAL RULES FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprisingall national electrotechnical
26、committees (IEC National Committees). The object of IEC is to promote internationalco-operation on all questions concerning standardization in the electrical and electronic fields. To this end and inaddition to other activities, IEC publishes International Standards, Technical Specifications, Techni
27、cal Reports,Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Theirpreparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt withmay participate in this preparatory work. International, governmental
28、and non-governmental organizations liaisingwith the IEC also participate in this preparation. IEC collaborates closely with the International Organization forStandardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreemen
29、ts of IEC on technical matters express, as nearly as possible, an internationalconsensus of opinion on the relevant subjects since each technical committee has representation from allinterested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and ar
30、e accepted by IEC NationalCommittees in that sense. While all reasonable efforts are made to ensure that the technical content of IECPublications is accurate, IEC cannot be held responsible for the way in which they are used or for anymisinterpretation by any end user. 4) In order to promote interna
31、tional uniformity, IEC National Committees undertake to apply IEC Publicationstransparently to the maximum extent possible in their national and regional publications. Any divergence betweenany IEC Publication and the corresponding national or regional publication shall be clearly indicated in the l
32、atter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformityassessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for anyservices carried out by independent certification bodies. 6) All users shou
33、ld ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts andmembers of its technical committees and IEC National Committees for any personal injury, property damage orother damage
34、 of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expensesarising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the
35、 referenced publications isindispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patentrights. IEC shall not be held responsible for identifying any or all such patent rights. In
36、ternational Standard IEC 61240 has been prepared by lEC technical committee 49:Piezoelectric, dielectric and electrostatic devices and associated materials for frequency control,selection and detection. This third edition cancels and replaces the second edition published in 2012. It constitutes atec
37、hnical revision. This edition includes the following significant technical changes with respect to the previousedition: outline drawings have been changed from three views (top, front and bottom) to that basedon ISO layout in the third-angle projection, in which the view from the right has been adde
38、dto the top, front and bottom views; reference line and geometrical dimensions of the package for enclosures have beenchanged for practical use; information on miniaturized leadless ceramic enclosures of piezoelectric devices (SMD) forfrequency control and selection has been included in an annex. BS
39、 EN 61240:2017 4 IEC 61240:2016 IEC 2016 The text of this standard is based on the following documents: CDV Report on voting 49/1172/CDV 49/1188/RVC Full information on the voting for the approval of this International Standard can be found in thereport on voting indicated in the above table. This d
40、ocument has been drafted in accordance with the ISO/IEC Directives, Part 2. The committee has decided that the contents of this publication will remain unchanged until thestability date indicated on the IEC website under “http:/webstore.iec.ch“ in the data related tothe specific publication. At this
41、 date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. A bilingual version of this publication may be issued at a later date. BS EN 61240:2017IEC 61240:2016 IEC 2016 5 INTRODUCTION The enclosures of quartz crystal resonators and oscillators are unified in t
42、his third edition ofIEC 61240. Regarding the current situation of many quartz crystal device suppliers, many of them use theirown enclosure layouts in their catalogues. For the convenience of consumers, general rules ofenclosure layout and definition of size need to be unified. The reasons prompting
43、 the revision of IEC 61240:2012 are as follows: a) The height of packages should not be included in a drawing. Only the total height ofenclosures should be expressed. b) In small enclosure types, the size tolerance in smaller enclosures will not meet the conditions defined in Table A.3 (Annex A). In
44、 newly proposed general rules of outline drawings, only the total height of enclosures shouldbe expressed and the size tolerance in smaller enclosures is revised. BS EN 61240:2017 6 IEC 61240:2016 IEC 2016 PIEZOELECTRIC DEVICES PREPARATION OF OUTLINE DRAWINGS OF SURFACE-MOUNTED DEVICES (SMD) FOR FRE
45、QUENCY CONTROL AND SELECTION GENERAL RULES 1 Scope This International Standard sets out general rules for drawing all dimensional and geometricalcharacteristics of a surface-mounted piezoelectric device package (referred to in this documentas SMD) in order to ensure mechanical inter-changeability of
46、 all outline drawings of the SMDsfor frequency control and selection. 2 Normative references The following documents are referred to in the text in such a way that some or all of their contentconstitutes requirements of this document. For dated references, only the edition cited applies.For undated
47、references, the latest edition of the referenced document (including anyamendments) applies. IEC 60191-6, Mechanical standardization of semiconductor devices Part 6: General rules forthe preparation of outline drawings of surface mounted semiconductor device packages 3 Classification of SMD The SMD
48、piezoelectric devices are classified into three types of packages depending on thestructure of the terminal leads. a) Leaded type: the folded ends of the terminal leads are turned away from the body. NOTE 1 The package of the pin lead type is compatible with the socket. This is defined in the descri
49、ption of theleaded type. b) Folded-leads type: the folded ends of the terminal lead are turned towards the body. NOTE 2 The supporter with a board is defined in the description of this folded lead type. c) Leadless type: terminal pads only are present on the body instead of terminal leads. A proper combination of these options should be selected. 4 Title of the outline drawing The title of the outline drawing shall imply the main package material (e.g. metal, plastic,
