1、BRITISH STANDARD BS EN 61747-1:2000 IEC 61747-1:1998 Incorporating Amendment No. 1 to BS IEC 61747-1:1998 (renumbers the BS IEC as BS EN 61747-1:2000) and incorporating Amendment No. 2 to BS EN 61747-1:2000 Liquid crystal and solid-state display devices Part 1: Generic specification The European Sta
2、ndard EN 61747-1:1999, with the incorporation of amendment A1:2003 has the status of a British Standard ICS 31.120 BS EN 61747-1:2000 This British Standard, having been prepared under the direction of the Electrotechnical Sector Board, was published under the authority of the Standards Board and com
3、es into effect on 15 June 1998 BSI 31 October 2003 ISBN 0 580 29959 7 National foreword This British Standard is the English language version of EN 61747-1:1999, including amendment A1:2003. It is identical with IEC 61747-1:1998, Edition 1.1:2003, which comprises Edition 1:1998 consolidated by the i
4、ncorporation of amendment 1:2003. The UK participation in its preparation was entrusted by Technical Committee EPL/47, Semiconductor devices, to Subcommittee EPL/47/3, Optoelectronic display and imaging devices, which has the responsibility to: A list of organizations represented on this subcommitte
5、e can be obtained on request to its secretary. Cross-references The British Standards which implement international or European publications referred to in this document may be found in the BSI Catalogue under the section entitled “International Standards Correspondence Index”, or by using the “Sear
6、ch” facility of the BSI Electronic Catalogue or of British Standards Online. This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. Compliance with a British Standard does not of itself confer immunity from legal ob
7、ligations. aid enquirers to understand the text; present to the responsible international/European committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; monitor related international and European developments and promulgate them in the UK. Summar
8、y of pages This document comprises a front cover, an inside front cover, the EN title page, pages 2 to 43 and a back cover. The BSI copyright notice displayed in this document indicates when the document was last issued. Sidelining in this document indicates the most recent changes by amendment. Ame
9、ndments issued since publication Amd. No. Date Comments 10788 June 2000 Renumbers BS IEC 61747-1:1998 to BS EN 61747-1:2000 14623 31 October 2003 See national forewordEUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 61747-1 September 1999 + A1 April 2003 ICS 31.120 Supersedes EN 120000:1996 Engl
10、ish version Liquid crystal and solid-state display devices Part 1: Generic specification (includes amendment A1:2003) (IEC 61747-1:1998 + A1:2003) Dispositifs daffichage cristaux liquides et semiconducteurs Partie 1: Spcification gnrique (inclut lamendement A1:2003) (CEI 61747-1:1998 + A1:2003) Flss
11、igkristall- und Halbleiter-Anzeige-Bauelemente Teil 1: Fachgrundspezifikation (enthlt nderung A1:2003) (IEC 61747-1:1998 + A1:2003) This European Standard was approved by CENELEC on 1999-08-01; amendment A1 was approved by CENELEC on 2003-04-01. CENELEC members are bound to comply with the CEN/CENEL
12、EC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CE
13、NELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official version
14、s. CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic, Denmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Luxembourg, Malta, Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom. CENELEC Europea
15、n Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B-1050 Brussels 1999 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENEL
16、EC members Ref. No. EN 61747-1:1999 + A1:2003 EEN 16747:1-1999 2 Foreword The text of the International Standard IEC 61747-1:1998, prepared by SC 47C, Flat panel display devices, of IEC TC 47, Semiconductor devices, was submitted to the Unique Acceptance Procedure and was approved by CENELEC as EN 6
17、1747-1 on 1999-08-01 without any modification. This European standard supersedes EN 120000:1996. The following dates were fixed: Annexes designated “normative” are part of the body of the standard. Annexes designated “informative” are given for information only. In this standard, Annex C, Annex D, a
18、nd Annex ZA are normative and Annex A and Annex B are informative. Annex ZA has been added by CENELEC. Foreword to amendment A1 The text of document 47C/288/FDIS, future amendment 1 to IEC 61747-1:1998, prepared by SC 47C, Flat panel display devices, of IEC TC 47, Semiconductor devices, was submitte
19、d to the IEC-CENELEC parallel vote and was approved by CENELEC as amendment A1 to EN 61747-1:1999 on 2003-04-01. The following dates were fixed: Annexes designated “normative” are part of the body of the standard. In this standard, Annex ZA is normative. Annex ZA has been added by CENELEC. latest da
20、te by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2000-08-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2002-08-01 latest date by which the amendment has to be implem
21、ented at national level by publication of an identical national standard or by endorsement (dop) 2004-01-01 latest date by which the national standards conflicting with the amendment have to be withdrawn (dow) 2006-04-01 Page2 EN617471:199961747-1 IEC:1998+A1:2003 3 CONTENTS 1 Scope .5 2 Normative r
22、eferences5 3 Terminology6 3.1 Physical concepts 6 3.2 General terms10 3.3 Terms related to ratings and characteristics .15 4 Technical aspects .19 4.1 Order of precedence 19 4.2 Terminology, units and symbols .19 4.3 Preferred values of temperature, humidity and pressure .22 4.4 Marking .22 4.4.1 De
23、vice identification .22 4.4.2 Device traceabillity.22 4.4.3 Packing23 4.5 Categories of assessed quality.23 4.6 Screening 23 4.7 Handling 23 5 Quality assessment procedures.24 5.1 Eligibility for qualification approval24 5.1.1 Primary stage of manufacture.24 5.2 Commercially confidential information
24、 24 5.3 Formation of inspection lots .24 5.4 Structurally similar devices.24 5.5 Granting of qualification approval .24 5.6 Quality conformance inspection25 5.6.1 Division into groups and subgroups 25 5.6.2 Inspection requirements .26 5.6.3 Supplementary procedure for reduced inspection27 5.6.4 Samp
25、ling requirements for small lots28 5.6.5 Certified records of released lots (CRRL) .28 5.6.6 Delivery of devices subjected to destructive or non-destructive tests.28 5.6.7 Delayed deliveries28 5.6.8 Supplementary procedure for deliveries28 5.7 Statistical sampling procedures28 5.7.1 AQL sampling pla
26、ns .28 5.7.2 LTPD sampling plans .28 5.8 Endurance tests.28 3egaP 3002:174716NE Page3 EN617471:199961747-1 IEC:1998+A1:2003 5 5.9 Endurance tests where the failure rate is specified .29 5.9.1 General29 5.9.2 Selection of samples29 5.9.3 Failure .29 5.9.4 Endurance test time and sample size .29 5.9.5
27、 Procedure to be used if the number of observed failures exceeds the acceptance number29 5.10 Accelerated test procedures.30 5.11 Capability approval.30 6 Test and measurement procedures .30 6.1 Standard atmospheric conditions for electrical and optical measurements 30 6.2 Physical examination .30 6
28、.2.1 Visual examination.30 6.2.2 Dimensions31 6.2.3 Permanence of marking .31 6.3 Electrical and optical measurements 31 6.3.1 General conditions and precautions31 6.4 Environmental tests .31 Annex A (informative) Cross references index 32 Annex B (informative) Example of outline drawings of liquid
29、crystal display cells .33 Annex C (normative) Orientation of LCD modules .35 Annex D (normative) Lot tolerance percentage defective (LTPD) sampling plans.36 Bibliography 14 ugiFrolB 1 eck gaidrma fro exfo noitanalp sylppu egatlovs.12 ugiFr 2 e Timign cahrt for exfo noitanalp resnopsit emes22 TretteL
30、 1 elba symslob .20 TTL 1.D elbas DPmasnalp gnilp miniM mu sizfo e smaselp set eb ottsne ot deru,e wic % 09 a htfnocnedirep a gnivah tol a taht ,ecfo egatne fedcecived evitse ot lauqe eht sepcifL deiTDP wa eb ton lliccdetpe (selgni sam)elp 83 TH 2.D elbayeproegmteric samsnalp gnilp fro smtol lla siz
31、se fo ro 002 elss.93 TA 3.D elbaQL dna LTDP sampsnalp gnil .04 4egaP 3002:174716NE -747163002:1A+8991:CEI 1 5 9.5 Eudnrnacet ests wehreht e faulire rasi et sepcifdei .92 1.9.5 General92 2.9.5 Selecfo noit sampels92 3.9.5 Fuliare .92 4.9.5 Eudnrnacet esit tme dna sampel size .92 5.9.5 Prcorudesu eb o
32、t efi de mun ehtreb fo sboref devruliase xecsdee eht accnatpecun emebr92 01.5 Acceelraet detsp trocuderes.03 11.5 ytilibapaC ppar.lavo03 6 Tesdna t maesuremp tnerocuderse .03 1.6 Sadnatrta dmosehprci csnoitidno fro electricitpo dna lacla maesuremstne 03 2.6 Physicae lxamnoitani .03 1.2.6 Vise lauxam
33、oitanin.03 2.2.6 Dimnesnois31 3.2.6 Permnenacfo e markgni .31 3.6 Eelctricaitpo dna lcla maesuremstne 31 1.3.6 Generla csnoitidno p dnarecnoituas31 4.6 Envirnomet latnesst .31 xennA A (informa)evit Cross refernecse xedni 23 xennA B (inform)evita Examfo elp d eniltuorawsgni fo diuqil crysid latsyalp
34、cslle .33 xennA C (onrma)evit Orfo noitatnei DCL mseludo .53 xennA D (onrm)evita elot toLrnacep erced egatnefecevit (LTP)D samnalp gnilps.63 Bibliography 43 Figure 1 Block diagram for explanation of supply voltages.21 Figure 2 Timing chart for explanation of response times22 Table 1 Letter symbols .
35、20 Table D.1 LTPD sampling plans Minimum size of samples to be tested to ensure, with a 90 % confidence, that a lot having a percentage of defective devices equal to the specified LTPD will not be accepted (single sample) 38 Table D.2 Hypergeometric sampling plans for small lot sizes of 200 or less.
36、39 Table D.3 AQL and LTPD sampling plans .40 4egaP 3002:174716NE Annex ZA (normative) Normative references to international publications with their corresponding European publications. 41 ETON raHminoE sa dezN :3-14292ton( 3991 midofi.)de Page4 EN617471:199961747-1 IEC:1998+A1:2003 9 LIQUID CRYSTAL
37、AND SOLID-STATE DISPLAY DEVICES Part 1: Generic specification 1 Scope This part of IEC 61747 is a generic specification for liquid crystal and solid-state display devices. It defines general procedures for quality assessment to be used in the IECQ system and gives general rules for measuring methods
38、 of electrical and optical characteristics, rules for climatic and mechanical tests, and rules for endurance tests. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated refe
39、rences, the latest edition of the referenced document (including any amendments) applies. IEC 60027 (all parts), Letter symbols to be used in electrical technology IEC 60050 (all parts), International Electrotechnical Vocabulary IEC 60068 (all parts), Environmental testing IEC 60068-1:1988, Environm
40、ental testing Part 1: General and guidance IEC 60068-2 (all parts), Environmental testing Part 2: Tests IEC 60191 (all parts), Mechanical standardization of semiconductor devices IEC 60191-1:1966, Mechanical standardization of semiconductor devices Part 1: Preparation of drawings of semiconductor de
41、vices IEC 60191-2:1966, Mechanical standardization of semiconductor devices Part 2: Dimensions IEC 60191-3:1974, Mechanical standardization of semiconductor devices Part 3: General rules for the preparation of outline drawings of integrated circuits IEC 60410:1973, Sampling plans and procedures for
42、inspection by attributes IEC 60617 (all parts), Graphical symbols for diagrams IEC 60747 (all parts), Semiconductor devices Discrete devices IEC 60747-1:1983, Semiconductor devices Discrete devices and integrated circuits Part 1: General 5egaP 3002:174716NEPage5 EN617471:199961747-1 IEC:1998+A1:2003
43、 11 IEC 60747-5:1992, Semiconductor devices Discrete devices and integrated circuits Part 5: Optoelectronic devices IEC 60747-10:1991, Semiconductor devices Part 10: Generic specification for discrete devices and integrated circuits IEC 60748 (all parts), Semiconductor devices Integrated circuits IE
44、C 60749:1996, Semiconductor devices Mechanical and climatic test methods IEC 61747-2-1:1998, Liquid crystal and solid-state display devices Part 2-1: Passive matrix monochrome LCD modules Blank detail specification IEC 61747-3-1:1998, Liquid crystal and solid-state display devices Part 3-1: Liquid c
45、rystal display (LCD) cells Blank detail specification IEC 61747-4:1998, Liquid crystal and solid-state display devices Part 4: Liquid crystal display modules and cells Essential ratings and characteristics IEC 61747-5, Liquid crystal and semiconductor devices Part 5: Environmental, endurance and mec
46、hanical test methods QC 001002:1986, Rules of Procedure of the IEC Quality Assessment System for Electronic Components (IECQ) ISO 1000:1992, SI units and recommendations for the use of their multiples and of certain other units ISO 1101:1983, Technical drawings Geometrical tolerancing Tolerancing of
47、 form, orientation, location and run-out Generalities, definitions, symbols, indications on drawings ISO 2859 (all parts), Sampling procedures for inspection by attributes ISO 8601:1988, Data elements and interchange formats Information interchange Representation of dates and times 3 Terminology For
48、 the purpose of standard series IEC 61747, the following terms and definitions apply. 3.1 Physical concepts 3.1.1 alignment layer a thin layer deposited over the patterned electrodes that determines the direction of the director at the surface. This layer produces the desired ordering. Alignment suc
49、h as homeotropic alignment (3.1.14) or planar alignment (3.1.15) are achieved by the co-operative ordering of the liquid crystal molecules locally affected by the surface forces. The alignment layer is generating the pretilt angle (3.1.20) 3.1.2 chiral phase a liquid crystal phase exhibiting a spontaneous twist 6egaP 3002:174716NEPage6 EN617
